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    INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE
    13.
    发明申请
    INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE 审中-公开
    将不受约束的直接带状芯片集成到硅光电器件

    公开(公告)号：US20160274319A1

    公开(公告)日：2016-09-22

    申请号：US15073957

    申请日：2016-03-18

    Applicant: Skorpios Technologies, Inc.

    Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

    IPC: G02B6/42 ,  H01S5/022 ,  G02B6/12

    CPC classification number: G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252 ,  H01S5/14

    Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.

    Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 该芯片，材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层将芯片密封在平台上。

    METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER
    14.
    发明申请
    METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER 审中-公开
    用于混合激光的混合积分的方法和系统

    公开(公告)号：US20150139256A1

    公开(公告)日：2015-05-21

    申请号：US14488041

    申请日：2014-09-16

    Applicant: Skorpios Technologies, Inc.

    Inventor： John Dallesasse ,  Stephen B. Krasulick ,  William Kozlovsky

    IPC: H01S5/14 ,  H01S5/026 ,  H01S5/10 ,  H01S5/02

    CPC classification number: H01S5/141 ,  H01S3/10053 ,  H01S3/1055 ,  H01S3/107 ,  H01S5/0208 ,  H01S5/021 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/0261 ,  H01S5/1003 ,  H01S5/1032 ,  H01S2301/03

    Abstract: A cable television transmitter includes a substrate including a silicon material, control electronics disposed in the substrate, and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The cable television transmitter also includes an optical modulator optically coupled to the gain medium and electrically coupled to the control electronics, a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The cable television transmitter further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror.

    Abstract translation: 一种有线电视发射器包括：衬底，包括硅材料，设置在衬底中的控制电子器件和耦合到衬底的增益介质。 增益介质包括化合物半导体材料。 有线电视发射机还包括光学耦合到增益介质并电耦合到控制电子器件的光学调制器，设置在衬底中并光学耦合到增益介质的波导，第一波长选择元件，其特征在于第一反射光谱并且被布置 以及第二波长选择元件，其特征在于第二反射光谱并设置在基板中。 有线电视发射机还包括设置在基板中并连接第一波长选择元件，第二波长选择元件和波导的光耦合器和输出镜。

    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING
    16.
    发明申请
    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING 有权
    用于模板辅助波形粘结的方法和系统

    公开(公告)号：US20130302920A1

    公开(公告)日：2013-11-14

    申请号：US13869408

    申请日：2013-04-24

    Applicant: Skorpios Technologies, Inc.

    Inventor： John Dallesasse ,  Stephen B. Krasulick

    IPC: H01L33/48

    CPC classification number: H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

    Abstract: A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括多个器件的衬底并提供包括多个光子器件的化合物半导体衬底。 该方法还包括切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供组装衬底，将多个光子模具安装在组装衬底的预定部分上，对准衬底和组装衬底，将衬底和组件衬底接合以形成复合衬底结构，并且移除至少一个 从组合衬底结构的组装衬底的一部分。

    HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION
    17.
    发明申请
    HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION 有权

    公开(公告)号：US20230124445A1

    公开(公告)日：2023-04-20

    申请号：US17949022

    申请日：2022-09-20

    Applicant: Skorpios Technologies., Inc.

    Inventor： Stephen B. Krasulick ,  John Dallesasse

    IPC: H01L25/16 ,  H01L25/075 ,  H01L25/00

    Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

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