Abstract:
PROBLEM TO BE SOLVED: To provide an optical element capable of performing precise driving at a low voltage while ensuring sufficient insulation performance.SOLUTION: The optical element includes: first and second electrodes disposed opposed to each other; an insulation film which has a dielectric layer and an ion barrier layer which are laminated in order to cover a face of the first electrode opposing to the second electrode; and polar liquid and nonpolar liquid sealed between the insulation film and the second electrode each of which has a refractive index different from each other. The dielectric layer has a permittivity higher than that of the ion barrier layer, the ion barrier layer prevents the ion included in the polar liquid from transmitting, and a water-repellent film is positioned at the uppermost layer of the insulation film and has an affinity with the nonpolar liquid.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-film transistor improving reproducibility of a process. SOLUTION: In the thin-film transistor 1, a gate electrode 12 and an oxide semiconductor film 15 is disposed on a substrate 11 with a gate insulating film 13 interposed therebetween and a source electrode 14A and a drain electrode 14B are disposed in contact with the oxide semiconductor film 15. The oxide semiconductor film 15 is formed by a DC sputtering method and a DC voltage Vdc for formation is set according to a carrier density D. Control of the carrier density D is facilitated by utilizing a proportional relation between the DC voltage Vdc and the carrier density D. A result of control is less susceptible to the accuracy of another equipment such as an MFC (Mass Flow Controller) or the like than in the case of controlling the carrier density by oxygen partial pressure adjustment. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a zinc oxide based sputtering target having a sufficiently high density and a satisfactorily low resistivity and to provide a method of manufacturing the zinc oxide based sputtering target. SOLUTION: The zinc oxide based sputtering target is manufactured by using γ-Al 2 O 3 as a dopant material, and a zinc oxide based transparent conductive film is formed by using the zinc oxide based sputtering target according to a sputtering method. Therein, γ-Al 2 O 3 is contained in the zinc oxide based sputtering target by 1 to 3 wt.%. The zinc oxide based sputtering target is manufactured by mixing zinc oxide powder and γ-Al 2 O 3 powder and sintering the mixed powder at a temperature of 1,150 to 1,300 °C. A particle size of γ-Al 2 O 3 is preferably specified to be 0.5 μm or less. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation:要解决的问题:提供具有足够高的密度和令人满意的低电阻率的氧化锌基溅射靶,并提供一种制造氧化锌基溅射靶的方法。 解决方案:通过使用γ-Al O 3 SB>作为掺杂剂材料制造氧化锌基溅射靶,形成氧化锌系透明导电膜 通过使用基于氧化锌的溅射靶根据溅射法。 其中,氧化锌系溅射靶中含有1〜3重量%的γ-Al 2 SB 3 O 3。 氧化锌系溅射靶是通过将氧化锌粉末与γ-Al O 3 SB>粉末混合而制成的,并在1,150〜1300℃的温度下烧结混合粉末。 优选将γ-Al 2 O 3 / SB 3的粒径规定为0.5μm以下。 版权所有(C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a transparent conductive thin film, which can easily providing both high permeability and low specific resistance of a film, and to provide a transparent conductive thin film manufactured by the same. SOLUTION: In the method of manufacturing a transparent conductive thin film, a transparent conductive thin film is formed on a substrate 11 by a sputtering method. Using a target 3 of ZnO with Al 2 O 3 doped or ZnO with Ga 2 O 3 doped, a pulsating DC voltage of high frequency is applied from a pulse DC power source 5 between the substrate 11 and the target 3, without introducing oxygen gas under Ar gas atmosphere, for sputter film-forming. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation:要解决的问题:提供一种可以容易地提供膜的高透过性和低电阻率的透明导电薄膜的制造方法,并提供由其制造的透明导电薄膜。 解决方案:在制造透明导电薄膜的方法中,通过溅射法在基板11上形成透明导电薄膜。 使用ZnO掺杂的掺杂Ga 2 O 3或SB 3的掺杂的ZnO 3的靶3,掺杂了Ga 2 SB 3 O 3 / 脉冲直流电压从基板11和靶3之间的脉冲直流电源5施加,而不会在氩气气氛下引入氧气,用于溅射成膜。 版权所有(C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a light-emitting device whose light emission quantity can be controlled and to provide a driving method of the device. SOLUTION: The device is provided with an n-type semiconductor layer 1, and a source electrode 4 and a drain electrode 5, which are formed on the layer 1, a p-type semiconductor layer 2, a gate electrode 3 formed below the layer 2, an AC power supply 6 applying AC voltage between the source electrode 4 and the drain electrode 5, and a DC power supply 7 applying DC voltage between the gate electrode 3 and the source electrode 4. A prescribed amount of electrons are implanted in the n-type semiconductor layer 1 by AC voltage. Electron holes are implanted from the p-type semiconductor layer in the n-type semiconductor layer by DC voltage, and the electrons and the electron holes are re-coupled. AC voltage is biased by DC voltage and is applied. A base insulating layer is formed on a substrate. The gate electrode 3, p-type semiconductor layer 2 and n-type semiconductor layer 1 are formed on the base insulating layer in this order. The n-type semiconductor layer 1 is formed of n-type zinc oxide, the p-type semiconductor layer 2 is formed of p-type zinc oxide and the base insulating layer of zinc oxide. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a reflection enhanced mirror which is free from corrosion of Ag by an oxidation process necessary to deposit a dielectric film layer and which causes no decrease in the reflectance, and to provide a backlight device for a liquid crystal display equipped with a light guide plate having the above reflection enhanced mirror. SOLUTION: The reflection enhanced mirror has a dielectric multilayer film 36 deposited across an oxidation preventing thin film 33 on a metallic film 32. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a screen in which contrast is improved by comparatively surely eliminating the effect of outdoor daylight, thereby decreasing the black level of an image, and to provide a rear projector using the screen. SOLUTION: The screen 10, on which images are displayed by the emission of image light from back, includes: a selective transmission filter 2 which has the properties of highly transmitting light of specific wavelength region which corresponds to image light, and the properties of highly reflecting the light of visible wavelength region excepting at least the specific wavelength region; and a circular polarizer plate 3 disposed in front of the selective transmission filter 2. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To make a device operate more securely.SOLUTION: An optical element substrate includes: a first driving electrode which has a periodically rugged structure and is provided to side face of a partition wall as a projection part of the rugged structure; a second driving electrode provided on a side face opposed to the side face of the partition wall where the first driving electrode is provided while electrically insulated from the first driving electrode; a first coupling electrode provided a recessed part of the rugged structure and a part of the side face of the partition wall which comes into contact with the first driving electrode; and a second coupling electrode provided to the recessed part of the rugged structure and a part of a side face of the partition wall which comes into contact with the second driving electrode while electrically insulated from the first coupling electrode. The first driving electrode or second driving electrode is applied with a predetermined voltage through the first coupling electrode or second coupling electrode, and the driving electrodes are made of different materials from the coupling electrodes.
Abstract:
PROBLEM TO BE SOLVED: To provide an optical element capable of achieving an accurate drive at a low voltage while maintaining sufficient insulating property.SOLUTION: The optical element includes: first and second electrodes disposed to oppose to each other; an insulating film, which comprises a dielectric layer, an ion barrier layer and a water repellent layer, successively layered to cover a surface of the first electrode, the surface opposing to the second electrode; and a polar liquid and a nonpolar liquid having different refractive indices from each other, which are sealed between the insulating film and the second electrode. The dielectric layer has a dielectric constant higher than that of the ion barrier layer. The ion barrier layer suppresses permeation of ions included in the polar liquid. The water repelling film is located at the uppermost layer of the insulating film and shows affinity to the nonpolar liquid.
Abstract:
PROBLEM TO BE SOLVED: To provide a thin-film transistor manufacturing method that simplifies the process. SOLUTION: The thin-film transistor manufacturing method is configured as follows. An oxide semiconductor film 30 having a shape including a channel formation scheduled region 31A, a source electrode formation scheduled region 32SA, and a drain electrode formation scheduled region 32DA is formed on a gate insulating film 13 so that the whole oxide semiconductor film has the same carrier concentration as that of the channel formation scheduled region 31A. A mask 33 for suppressing heat transfer is formed on the channel formation scheduled region 31A while the oxide semiconductor film 30 is heated at a temperature of ≥100°C and ≤200°C in the atmosphere. The channel formation scheduled region 31A becomes a channel region, in which the carrier concentration before the heating is maintained, by suppressing heat transfer by the mask 33. Alternatively, regions not covered with the mask 33 on the oxide semiconductor film 30 become a source electrode region and a drain electrode region which respectively have a high carrier concentration and a low resistance by the occurrence of oxygen loss or the like due to the heating. COPYRIGHT: (C)2010,JPO&INPIT