公开(公告)号：JP2007001194A

公开(公告)日：2007-01-11

申请号：JP2005185286

申请日：2005-06-24

Applicant: SONY CORP

Inventor： TANIGAWA TORU ,  ANDO MASATO

IPC: B41J2/05

Abstract: PROBLEM TO BE SOLVED: To reduce manufacturing costs and to smooth a nozzle surface. SOLUTION: Each nozzle sheet 25 is arranged so that a nozzle 25a is positioned within a head chip stationing hole to each head chip stationing hole at one side face of a module frame 11 and covers a part of the region of the head chip stationing hole. At the same time, the nozzle sheet 25 is formed in a size to cover a part of the region of the head chip stationing hole. A flexible wiring board 3 has its electrode electrically connected to an electrode 23 of the head chip 20. At the same time, the flexible wiring board 3 is arranged to cover the exposed electrode 23 of the head chip 20 at the face side of the module frame 11 where the nozzle sheet 25 is fitted. The nozzle sheet 25 set at the module frame 11 and an end part of the flexible wiring board 3 are covered with a protective cover 30. COPYRIGHT: (C)2007,JPO&INPIT

公开(公告)号：JP2006103343A

公开(公告)日：2006-04-20

申请号：JP2005367745

申请日：2005-12-21

Applicant: Sony Corp ,  ソニー株式会社

Inventor： MURAKAMI TAKAAKI ,  KONO MINORU ,  IGARASHI KOICHI ,  ONO SHOGO ,  TANIGAWA TORU

IPC: B41J2/045 ,  B05C5/00 ,  B41J2/055 ,  B41J2/135

Abstract: PROBLEM TO BE SOLVED: To provide a liquid discharge apparatus capable of retaining a nozzle sheet to an end face of a partition wall when the apparatus is applied to, for example, an inkjet printer, in relation to a printer and a manufacturing method for the liquid discharge apparatus.
SOLUTION: The liquid discharge apparatus is provided with an adhesion improvement layer 9 formed to ensure high bonding strength between the nozzle sheet 8 and the end face of the partition wall 5, and the nozzle sheet 8 is disposed on the end face of the partition wall 5.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种液体排出装置，当将装置应用于例如喷墨打印机时，能够将喷嘴片保持在分隔壁的端面上，相对于打印机和制造 液体排出装置的方法。 解决方案：液体排出装置设置有粘合改进层9，其形成为确保喷嘴片8与分隔壁5的端面之间的高粘合强度，并且喷嘴片8设置在分隔壁5的端面上 分隔墙5.版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005138529A

公开(公告)日：2005-06-02

申请号：JP2003379429

申请日：2003-11-10

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  MURAKAMI TAKAAKI ,  HORII SHINICHI

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To manufacture a liquid ejecting head suitable for a line head inexpensively with high accuracy, and to prevent ink leakage.
SOLUTION: A modular frame 11 is bonded to a nozzle sheet 13 in which a nozzle array for ejecting ink is formed. A head chip arranging hole is formed in the modular frame 11 and a head chip having a heating resistor and an ink liquid chamber is arranged in the head chip arranging hole thus forming a head module 10. A plurality of head modules 10 are arranged in series in the head chip arranging holes of the head frame 2 thus forming a liquid ejecting head. The modular frame 11 of the head module 10 and the head frame 2 are bonded through adhesive D containing particles having a constant diameter.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：以高精度廉价地制造适用于线头的液体喷射头，并防止油墨泄漏。 解决方案：模块化框架11结合到其中形成用于喷射油墨的喷嘴阵列的喷嘴片13。 在模块化框架11中形成有头部芯片布置孔，并且在头部芯片布置孔中布置具有加热电阻器和墨水室的头部芯片，从而形成头部模块10.多个头部模块10串联布置 在头部芯片的头部芯片中布置孔，从而形成液体喷射头。 头模块10的模块化框架11和头框架2通过含有恒定直径的颗粒的粘合剂D结合。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005138526A

公开(公告)日：2005-06-02

申请号：JP2003379426

申请日：2003-11-10

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  NAKAMURA ATSUSHI ,  ONO KENTARO ,  HONDA YASUKATSU ,  MATSUBARA YOJI

IPC: B41J2/05 ,  B41J2/16

CPC classification number: B41J2202/20

Abstract: PROBLEM TO BE SOLVED: To form a head in which projecting height is suppressed by reducing the quantity of sealing material being used at the opening of a nozzle sheet while ensuring component strength of the nozzle sheet.
SOLUTION: A head chip 20 is provided with a connection pad 23 connected electrically with each heating resistor and a nozzle sheet 13 is provided with an opening part 13d at a position facing each connection pad 23 when the head chip 20 is arranged. The electrode 13c at a wiring pattern part 13b performing electrical connection with the head chip 20 is provided in the region of the opening part 13d such that each connection pad 23 and electrode 13c are bonded using the opening part 13d.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：通过在确保喷嘴片的部件强度的同时减少在喷嘴片的开口处使用的密封材料的量来形成防止突出高度的头部。 解决方案：头芯片20设置有与每个加热电阻器电连接的连接焊盘23，并且喷嘴片13在布置头部芯片20时在与每个连接焊盘23相对的位置处设置有开口部13d。 在开口部13d的区域设置与头芯片20进行电连接的布线图形部13b的电极13c，使得利用开口部13d将各连接焊盘23和电极13c接合。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005138524A

公开(公告)日：2005-06-02

申请号：JP2003379424

申请日：2003-11-10

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  MURAKAMI TAKAAKI

IPC: B41J2/05 ,  B41J2/16

CPC classification number: B41J2202/20

Abstract: PROBLEM TO BE SOLVED: To enhance positional accuracy by preventing inclination of a head chip against a nozzle sheet at the electrical connection with an external circuit.
SOLUTION: A connection pad 23 connected electrically with each heating resistor is provided on the surface of a head chip 20 facing a nozzle sheet 13, and an electrode 13c being bonded to each connection pad 23 of the head chip 20 is provided on the surface of the nozzle sheet 13 facing the head chip 20. Furthermore, a dummy electrode 13d for arranging the head chip 20 in flush with the nozzle sheet 13 is provided on the surface of the nozzle sheet 13 facing the head chip 20 at such a position as abutting against the head chip 20 when it is placed on the head chip 20 through a barrier layer 12.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：通过在与外部电路的电连接处防止头部芯片相对于喷嘴片的倾斜来提高位置精度。 解决方案：在面向喷嘴片13的头芯片20的表面上设置有与每个加热电阻器电连接的连接焊盘23，并且将与头芯片20的每个连接焊盘23接合的电极13c设置在 喷嘴片13的与头部芯片20相对的表面。此外，在喷嘴片13的与头部芯片20相对的表面上设置用于将头部芯片20与喷嘴片13齐平配置的虚拟电极13d， 位置，当其通过阻挡层12放置在头部芯片20上时与头部芯片20抵接。（C）2005年，JPO和NCIPI

公开(公告)号：JP2005131949A

公开(公告)日：2005-05-26

申请号：JP2003370598

申请日：2003-10-30

Applicant: Sony Corp ,  ソニー株式会社

Inventor： MURAKAMI TAKAAKI ,  NAKAMURA ATSUSHI ,  KAYABA SHINJI ,  HORII SHINICHI ,  TAKAKURA SHIGEYUKI ,  TANIGAWA TORU ,  NAKAMURA MASATO

IPC: B41J2/16 ,  B41J2/05

Abstract: PROBLEM TO BE SOLVED: To enhance productivity remarkably by sticking even a thin and wide nozzle sheet produced through electrocast easily and accurately, and to realize good ejection characteristics by a nozzle sheet ensuring flatness.
SOLUTION: A nozzle sheet 17 having a nozzle formed on a mother die 30 is produced by electrocast using the mother die 30 and then stuck to a head frame 16 along with the mother die 30. Subsequently, the mother die 30 is released from the nozzle sheet 17 thus ensuring highly accurate positional relation between the nozzle and a heating resistor for imparting energy to ink.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：通过容易且精确地粘贴通过电铸而制造的薄而宽的喷嘴片，从而通过确保平坦度的喷嘴片实现良好的喷射特性，从而显着提高生产效率。 解决方案：具有形成在母模30上的喷嘴的喷嘴片17通过使用母模30的电铸产生，然后与母模30一起粘在头架16上。随后，母模30被释放 从而能够确保喷嘴和用于赋予墨水能量的加热电阻器之间的高度准确的位置关系。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005131947A

公开(公告)日：2005-05-26

申请号：JP2003370596

申请日：2003-10-30

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  MURAKAMI TAKAAKI ,  TOMITA MANABU ,  HORII SHINICHI

IPC: B41J2/175 ,  B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To attain cooling effect of a head chip or ink without providing any special cooling system.
SOLUTION: The head module comprises a head chip 20 arranged with heating resistors 22, a nozzle sheet 13 in which a nozzle 13a is formed, a barrier layer 12 for forming an ink liquid chamber 14, a module frame 11 being stuck to the nozzle sheet 13 in order to support it and provided with a hole 11b for arranging the head chip 20, and a buffer tank 15 stacked on the side of the module frame 11 opposite to the side for sticking the nozzle sheet 13 to form a common fluid channel 15a communicating with all ink liquid chambers 14 of the head chip 20 and having the inner surface not being fitted in the head chip arranging hole 11b and the outer surface copying that of the module frame 11.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了获得头部芯片或墨水的冷却效果，而不提供任何特殊的冷却系统。 解决方案：头模块包括配置有加热电阻器22的头芯片20，其中形成有喷嘴13a的喷嘴片13，用于形成墨液室14的阻挡层12，模块框架11粘附到 喷嘴片13为了支撑并设置有用于布置头部芯片20的孔11b以及堆叠在模块框架11的与侧面相对的侧面上的缓冲罐15，用于粘贴喷嘴片13以形成共同的 流体通道15a与头部芯片20的所有墨液室14连通，并且内表面不装配在头芯片排列孔11b中，外表面与模块框架11的外表面复制。（C） 2005年，JPO＆NCIPI

公开(公告)号：JP2003311973A

公开(公告)日：2003-11-06

申请号：JP2002117188

申请日：2002-04-19

Applicant: Sony Corp ,  ソニー株式会社

Inventor： MURAKAMI TAKAAKI ,  KONO MINORU ,  IGARASHI KOICHI ,  ONO SHOGO ,  TANIGAWA TORU

IPC: B41J2/135 ,  B41J2/05 ,  B41J2/14 ,  B41J2/145 ,  B41J2/15 ,  B41J2/16 ,  B65D81/24

CPC classification number: B41J2/1626 ,  B41J2/14024 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645

Abstract: PROBLEM TO BE SOLVED: To adhere and hold a nozzle sheet to an end face of a diaphragm by a full strength by applying a liquid discharge device, a printer and a manufacturing method for a liquid discharge device to, for example, an ink jet printer. SOLUTION: An adhesion improving layer 9 for improving adhesive properties to the end face of the diaphragm 5 is formed on the nozzle sheet 8 side. The nozzle sheet 8 is disposed at the end face of the diaphragm 5. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：通过将液体排出装置，打印机和液体排出装置的制造方法应用于例如一种液体排出装置，通过全面的强度将喷嘴片粘附并保持在隔膜的端面上 喷墨打印机。 解决方案：在喷嘴片8一侧形成有用于改善与隔膜5的端面的粘合性的粘附改善层9。 喷嘴片8设置在隔膜5的端面。（C）2004，JPO

公开(公告)号：JP2002240302A

公开(公告)日：2002-08-28

申请号：JP2001039713

申请日：2001-02-16

Applicant: SONY CORP

Inventor： TANIGAWA TORU ,  USHINOHAMA IWAO

IPC: B41J2/045 ,  B41J2/055 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a printer head applicable to an ink jet printer, for example, easily and surely while facilitating integration of a drive circuit, and the like, and a method for manufacturing an electrostatic actuator applicable to such a printer head. SOLUTION: A sacrifice layer 19 is formed on a fixed electrode 17 and a movable electrode is formed thereon. Subsequently, the sacrifice layer 19 is removed to form an air gap between the fixed electrode 17 and the movable electrode.

公开(公告)号：JP2002052725A

公开(公告)日：2002-02-19

申请号：JP2000243997

申请日：2000-08-07

Applicant: SONY CORP

Inventor： MIYAMOTO TAKAAKI ,  TANIGAWA TORU ,  MORI HIDEKI

IPC: B41J2/05 ,  B41J2/14 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To provide a printer, a printer head and its manufacturing method especially applicable to a thermal ink jet printer in order to introduce heat from a heating element efficiently to an ink liquid chamber. SOLUTION: Heating elements 35 are arranged on the upper layer of an uppermost wiring pattern 30 formed on a semiconductor substrate 22 or on the wiring pattern 31 for power supply or the wiring pattern for earth formed on the semiconductor substrate 22.