Abstract:
A display device includes a first barrier insulating layer including a first contact hole, a first metal layer disposed on the first barrier insulating layer, the first metal layer including a protruding part inserted in the first contact hole to protrude from below the first barrier insulating layer, and a recessed part formed in the first contact hole, a substrate disposed on the first metal layer and including a second contact hole, a second metal layer disposed on the substrate and inserted in the second contact hole to be connected to the first metal layer, a thin-film transistor including an active layer and a third metal layer overlapping the active layer, and a flexible film disposed below the first barrier insulating layer and including a lead electrode electrically connected to the protruding part of the first metal layer.
Abstract:
A display device includes a first base layer including a first opening; a first barrier layer located on a surface of the first base layer, and including a second opening; and a pad electrode located on the first barrier layer and overlapping the second opening in a plan view. At least one first groove is formed at a surface of the first barrier layer, a second groove is formed at a surface of the pad electrode, and the first opening exposes the at least one first groove and the second groove.
Abstract:
A display device comprises: a light emitting array including a plurality of light emitting elements on a substrate and an insulating pattern disposed between the light emitting elements; a color conversion array including a plurality of sub-color conversion parts corresponding to the respective light emitting elements; and a printed circuit board having a first contact electrode connected to each of the light emitting elements, the printed circuit board driving the light emitting elements, wherein the plurality of sub-color conversion parts include first to third sub-color conversion parts that convert the light provided from corresponding light emitting elements into lights of first to third colors and emitting the converted lights, wherein each of the plurality of light emitting elements is electrically insulated from an adjacent light emitting elements.
Abstract:
Disclosed herein is a liquid crystal display device having a thin thickness and a reduced size of a bezel. According to an exemplary embodiment, the liquid crystal display device includes: a liquid crystal display panel including a display area and a non-display area enclosing the display area; a light guide plate disposed under the liquid crystal display panel and having a polygonal plane shape including a first side, a second side, a third side, and a fourth side; and a light source adjacent to the first side of the light guide plate, wherein at least one of the second side, the third side, and the fourth side of the light guide plate overlaps the display area.
Abstract:
Provided are a backlight assembly and a display device having the same. A backlight assembly includes a light source unit which emits light, a light guide plate (LGP) including an incident surface upon which light emitted from the light source unit is incident, an opposite surface which faces the incident surface, and an exit surface which connects the incident surface and the opposite surface and from which light incident upon the incident surface exits, a wavelength conversion member which is located on the exit surface and converts a wavelength of light output from the exit surface, and a first reflective member which is located on the opposite surface and reflects light incident upon the opposite surface, wherein the first reflective member includes a plurality of first color patterns which face the opposite surface.
Abstract:
A display device includes a first substrate including an open portion, a first barrier insulating layer disposed on the first substrate and including a first contact hole overlapping the open portion, a first fan-out line disposed on the first barrier insulating layer, a pad part integrally formed with the first fan-out line and exposed through the open portion, a second substrate disposed on the first fan-out line, a connection part disposed on the second substrate and connected to the first fan-out line, a second fan-out line disposed on a layer between the first fan-out line and the connection part and connected to the connection part, a data line disposed on the same layer as the connection part and electrically connected to the second fan-out line, a flexible film including a lead electrode, and a contact part electrically connecting the lead electrode and the pad part.
Abstract:
A display device includes a display panel, and a backlight unit which provides first light to the display panel, the first light being a combination of light having a first peak wavelength and light having a second peak wavelength. The display panel includes a wavelength conversion layer which converts a peak wavelength of the first light. The backlight unit includes laser diodes emitting the light having the second peak wavelength, and where the wavelength conversion layer includes quantum dots or phosphor.
Abstract:
A light source module includes a printed circuit board including a wiring layer, an insulating coating layer disposed on the wiring layer, and a reflection adjustment pattern disposed on the insulating coating layer and having reflection characteristics which are different from reflection characteristics of the insulating coating layer, a light emitting chip mounted on the printed circuit board, and an optical lens arranged on an upper portion of the light emitting chip and fixed to the printed circuit board.
Abstract:
A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.
Abstract:
A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED package is mounted on a printed circuit board is provided. The method comprises a step of not including an ESD and EMI suppressing Zener diode within the combination of the printed circuit board and the LED package and of providing within the combination of the printed circuit board and the LED package a first conductive member and a spaced apart second conductive member which are electrically connected to the LED chip and which have defined between them at least one insulative ESD and/or EMI suppressing region which breaks down in its insulative properties when subjected to voltages of absolute magnitudes greater than a predetermined threshold voltage.