公开(公告)号：US20230096678A1

公开(公告)日：2023-03-30

申请号：US17850714

申请日：2022-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JUNYUN KWEON ,  JUMYONG PARK ,  SOLJI SONG ,  DONGJOON OH ,  CHUNGSUN LEE ,  HYUNSU HWANG

IPC: H01L21/78 ,  H01L21/02

Abstract: A method of manufacturing a semiconductor package, includes forming a mask layer on a wafer, the wafer including a semiconductor substrate and an insulating layer; forming a groove in the semiconductor substrate by performing a first laser grooving process; expanding an opening of the mask layer opened by the first laser grooving process by performing a second laser grooving process; exposing a portion of the insulating layer by removing a portion of the mask layer; and cutting the semiconductor substrate while removing the portion of the insulating layer exposed during the exposing by performing a dicing process.

公开(公告)号：US20220254827A1

公开(公告)日：2022-08-11

申请号：US17731022

申请日：2022-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： YONGHOE CHO ,  CHUNGSUN LEE ,  YOONHA JUNG ,  CHAJEA JO

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/48 ,  H01L21/683

Abstract: Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package may include a semiconductor chip structure, a transparent substrate disposed on the semiconductor chip structure, a dam placed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate, and an adhesive layer interposed between the dam and the semiconductor chip structure. The semiconductor chip structure may include an image sensor chip and a logic chip, which are in contact with each other, and the image sensor chip may be closer to the transparent substrate than the logic chip.