公开(公告)号：US20230142174A1

公开(公告)日：2023-05-11

申请号：US17979554

申请日：2022-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bumhee LEE ,  Wooram KIM ,  Hyunseok KIM ,  Kihyun PARK ,  Sooyun LEE ,  Hyeongyu CHO ,  Shin-Ho CHOI

IPC: G06F3/06

CPC classification number: G06F3/0656 ,  G06F3/0604 ,  G06F3/0622 ,  G06F3/0679

Abstract: There is provided an operation method of a memory system which includes a host and a storage device, and the operation method includes allocating a portion of a host memory included in the host for a host memory buffer to be used by a controller of the storage device, setting a set feature command such that the host memory buffer is enabled, setting a retention command including information about a response speed of the host memory buffer, selecting an operation mode of the host memory buffer, based on the retention command, and selecting one of a plurality of power states, which the controller supports, based on a performance objective of the operation mode of the host memory buffer.

公开(公告)号：US20230112285A1

公开(公告)日：2023-04-13

申请号：US18075850

申请日：2022-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumhee LEE ,  Seungtae KO ,  Junsig KUM ,  Yoongeon KIM ,  Seokmin LEE ,  Youngju LEE ,  Jongmin LEE ,  Seungho CHOI

IPC: H01Q21/00 ,  H01Q1/24

Abstract: The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.