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公开(公告)号：US10579847B2
公开(公告)日：2020-03-03
申请号：US15631472
申请日：2017-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyu Sang Cho , Hee Cheul Moon , Hyung Dal Kim , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Myung Su Kang , Heung Sik Shin
Abstract: An electronic device is provided which includes a light emitting module that radiates infrared light, a window disposed on the light emitting module and having a specific refractive index with respect to the infrared light, wherein the window includes a refraction part that totally reflects the infrared light inside the window in correspondence with the specific refractive index, and a fingerprint sensor disposed under the window and obtaining a fingerprint of a user based on a user input on the window by using scattered light of the infrared light.
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公开(公告)号：US20170372114A1
公开(公告)日：2017-12-28
申请号：US15631472
申请日：2017-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyu Sang Cho , Hee Cheul Moon , Hyung Dal Kim , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Myung Su Kang , Heung Sik Shin
CPC classification number: G06K9/00006 , G01J1/0219 , G01J1/0233 , G01J1/0266 , G01J1/08 , G01J1/58 , G01J5/10 , G01J2001/0257 , G01N2201/061 , G01N2201/0638 , G06F3/0412 , G06F3/0421 , G06F2203/04109 , G06K9/00033 , G06K9/00114 , G06K9/00161 , G06T11/003 , G06T2207/10 , G06T2207/10008 , G06T2207/10048
Abstract: An electronic device is provided which includes a light emitting module that radiates infrared light, a window disposed on the light emitting module and having a specific refractive index with respect to the infrared light, wherein the window includes a refraction part that totally reflects the infrared light inside the window in correspondence with the specific refractive index, and a fingerprint sensor disposed under the window and obtaining a fingerprint of a user based on a user input on the window by using scattered light of the infrared light.
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13.发明申请公开(公告)号：US20170358544A1
公开(公告)日：2017-12-14
申请号：US15617973
申请日：2017-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki Cheol BAE , Chul Woo Park , Kwang Sub Lee , Sang Gyun Lee , Se Young Jang , Chi Hyun Cho
CPC classification number: H01L23/645 , H01L23/3128 , H01L23/642 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/04042 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48195 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83851 , H01L2224/92247 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1076 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19105 , H01L2924/30101 , H01L2924/30107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.
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Patent Agency Ranking
14.发明授权公开(公告)号：US11037890B2
公开(公告)日：2021-06-15
申请号：US16696917
申请日：2019-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki Cheol Bae , Chui Woo Park , Kwang Sub Lee , Sang Gyun Lee , Se Young Jang , Chi Hyun Cho
Abstract: A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.
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公开(公告)号：US10754938B2
公开(公告)日：2020-08-25
申请号：US15609383
申请日：2017-05-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yun Jang Jin , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Chi Hyun Cho
IPC: G06K9/00 , G06F21/32 , H04L29/06 , H04L9/32 , H04W12/06 , G06F21/81 , G06F3/041 , G06F3/0481 , G06F3/0488 , H04W12/00
Abstract: An electronic device is provided. The electronic device includes a housing, a touch display, a pressure sensing circuit, a fingerprint sensor, a processor, and a memory. The memory is configured to store fingerprint data associated with a plurality of reference fingerprints. The processor is configured to, when pressure is applied by the finger in the fingerprint sensing area, receive first data associated with the pressure from the pressure sensing circuit and receive second data associated with the fingerprint of the finger from the fingerprint sensor, identify a selected function corresponding to the second data based on comparing result of the second data and the reference fingerprint data, and execute the selected function.
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公开(公告)号：US10366272B2
公开(公告)日：2019-07-30
申请号：US15491589
申请日：2017-04-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Hoon Song , Kwang Sub Lee , Gyu Sang Cho , Yun Jang Jin , Se Young Jang , Chi Hyun Cho
IPC: G06K9/00
Abstract: An electronic device and method of operating an electronic device is provided. The electronic device a display in which a fingerprint recognition area is formed in at least one portion thereof; a fingerprint sensor disposed under the display on which a screen is displayed, wherein the fingerprint sensor is adapted to acquire image information related to authentication of a fingerprint corresponding to an object that approaches a fingerprint recognition area at least partially based on light radiated from at least one pixel of the display and reflected by the object; and a processor adapted to control at least one function of the fingerprint sensor in association with the operation of acquiring the image information.
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公开(公告)号：US10117367B2
公开(公告)日：2018-10-30
申请号：US14625104
申请日：2015-02-18
Applicant: SAMSUNG ELECTRONICS CO., LTD. , S-Connect Co., Ltd.
Inventor： Hyun-Tae Jang , Yong Won Lee , Jung Je Bang , Kwang Sub Lee
IPC: H05K9/00
Abstract: A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.
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公开(公告)号：US20150245543A1
公开(公告)日：2015-08-27
申请号：US14625104
申请日：2015-02-18
Applicant: SAMSUNG ELECTRONICS CO., LTD. , S-Connect Co., Ltd.
Inventor： Hyun-Tae Jang , Yong Won Lee , Jung Je Bang , Kwang Sub Lee
IPC: H05K9/00
CPC classification number: H05K9/0032
Abstract: A fastening structure for a shield can is capable of ensuring easy attachment/detachment of the shield can and prevents deformation caused by excessive impact when the shield can is attached and detached by improving the fastening structure for a shield can fixed to a printed circuit board. The fastening structure for a shield can provided to shield a printed circuit board on which electronic components are mounted and the electronic components from electromagnetic waves includes a frame provided with a fixing part allowing the frame to be fixed to the printed circuit board, a shield cover provided to surround an outer side of the frame, fastening parts provided at the shield cover and the frame, respectively, such that the shield cover and the frame are attached/detached to/from each other. The fastening parts and the fixing part are disposed without overlapping each other.
Abstract translation: 用于屏蔽罐的紧固结构能够确保屏蔽壳的容易的附接/拆卸，并且通过改进固定到印刷电路板的屏蔽罩的紧固结构来防止当屏蔽壳被附接和分离时由过度的冲击引起的变形。 可以设置用于屏蔽的紧固结构以屏蔽安装有电子部件的印刷电路板，并且来自电磁波的电子部件包括设置有允许框架固定到印刷电路板的固定部的框架，屏蔽盖 设置成围绕框架的外侧，分别设置在屏蔽罩和框架处的紧固部件，使得屏蔽盖和框架彼此附接/分离。 紧固部件和固定部件彼此重叠设置。
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