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公开(公告)号：US20210143536A1
公开(公告)日：2021-05-13
申请号：US17089014
申请日：2020-11-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongjin PARK , Dongyeon KIM , Hosaeng KIM , Sumin YUN , Woomin JANG , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: An electronic device is provided. The electronic device includes a housing having an inner space. The electronic device may further include an antenna structure disposed in the inner space of the housing and including a printed circuit board (PCB) having a first board surface facing a first direction, a second board surface facing a second direction opposite to the first direction, and a lateral board surface surrounding a space between the first and second board surfaces, a first antenna array disposed in the space between the first and second board surfaces and forming a beam pattern in a third direction that the lateral board surface faces, and a second antenna array disposed at a position spaced apart from the first antenna array and forming a beam pattern in the first direction.
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公开(公告)号：US20240258699A1
公开(公告)日：2024-08-01
申请号：US18612494
申请日：2024-03-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin YUN , Hosaeng KIM , Seongjin PARK , Woomin JANG , Jehun JONG , Jaehoon JO
CPC classification number: H01Q9/0421 , H01Q1/44 , H01Q1/243
Abstract: An electronic device is provided that includes a housing, an antenna structure, an electronic component, and a wireless communication circuit. The antenna structure includes a substrate, at least one conductive patch disposed at the substrate, at least one power feeder disposed at a position of the at least one conductive patch, and at least one electrical connection structure. The at least one electrical connection structure includes a first conductive via disposed to pass through the at least one conductive patch and a ground layer of the substrate, and a second conductive via passing through the at least one conductive patch and electrically connected to the ground layer. The electronic component is disposed to overlap at least in part with the at least one conductive patch when the substrate is viewed from above, and is electrically connected to a main board through the at least one electrical connection structure. The wireless communication circuit is electrically connected to the at least one power feeder, and is configured to form a beam pattern in a first direction through the at least one conductive patch.
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公开(公告)号：US20230411869A1
公开(公告)日：2023-12-21
申请号：US17687882
申请日：2022-03-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Woomin JANG , Hosaeng KIM , Seongjin PARK , Sumin YUN , Jehun JONG , Jaehoon JO , Jinwoo JUNG , Jaebong CHUN
CPC classification number: H01Q21/065 , H01Q1/243 , H01Q1/38
Abstract: According to various embodiments, an electronic device may include: a housing, an antenna structure disposed in the inner space of the housing, wherein the antenna structure includes: a substrate including a first substrate and a second substrate surface oriented in a direction opposite to the first substrate surface, and a first array antenna including a plurality of first chip antennas disposed at a specified interval in a first region of the first substrate surface, and a first wireless communication circuit disposed in the inner space and configured to transmit and/or receive a wireless signal of a first frequency band via the first array antenna.
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14.发明申请公开(公告)号：US20220336967A1
公开(公告)日：2022-10-20
申请号：US17719029
申请日：2022-04-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongjin PARK , Hosaeng KIM , Sumin YUN , Woomin JANG , Jaehoon JO , Jinwoo JUNG
Abstract: Disclosed is an electronic device including a housing, a wireless communication module, and an antenna module operatively connected to the wireless communication module and disposed inside the housing, wherein the antenna module includes a first substrate comprising at least one feed line, a first surface disposed in a first direction, and a second surface disposed in a second direction opposite the first surface, a second substrate disposed on the first surface of the first substrate and having a first antenna array and a second antenna array disposed on the second substrate, and a third substrate disposed in a portion of the second surface of the first substrate and having a third antenna array and a fourth antenna array disposed on the third substrate, wherein the second substrate and/or the third substrate is formed of a material having a higher permittivity than the first substrate.
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公开(公告)号：US20220336962A1
公开(公告)日：2022-10-20
申请号：US17859597
申请日：2022-07-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongjin PARK , Dongyeon KIM , Hosaeng KIM , Sumin YUN , Woomin JANG , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: An electronic device is provided. The electronic devices includes a housing at least partially including a conductive portion, an antenna structure including a printed circuit board including a plurality of insulating layers, at least one first conductive patch including a first feeding point, and a second feeding point, and at least one second conductive patch including a third feeding point, and a fourth feeding point, and an antenna module including a wireless communication circuit configured to transmit or receive a first signal through the at least one first conductive patch and to transmit or receive a second signal of a second frequency band through the at least one second conductive patch.
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Patent Agency Ranking
公开(公告)号：US20220231420A1
公开(公告)日：2022-07-21
申请号：US17584981
申请日：2022-01-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin YUN , Hosaeng KIM , Seongjin PARK , Woomin JANG , Jehun JONG , Jaehoon JO
Abstract: An electronic device is provided that includes a housing, an antenna structure, an electronic component, and a wireless communication circuit. The antenna structure includes a substrate, at least one conductive patch disposed at the substrate, at least one power feeder disposed at a position of the at least one conductive patch, and at least one electrical connection structure. The at least one electrical connection structure includes a first conductive via disposed to pass through the at least one conductive patch and a ground layer of the substrate, and a second conductive via passing through the at least one conductive patch and electrically connected to the ground layer. The electronic component is disposed to overlap at least in part with the at least one conductive patch when the substrate is viewed from above, and is electrically connected to a main board through the at least one electrical connection structure. The wireless communication circuit is electrically connected to the at least one power feeder, and is configured to form a beam pattern in a first direction through the at least one conductive patch.
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公开(公告)号：US20220159826A1
公开(公告)日：2022-05-19
申请号：US17440474
申请日：2020-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin YUN , Dongyeon KIM , Seongjin PARK , Sehyun PARK , Woomin JANG , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: Disclosed is an electronic device comprising: a housing comprising a first plate, a second plate, and a side member, the side member having a first part comprising a first surface, a second surface, a through-hole formed from the first surface to the second surface in a first direction in which same penetrates the side member, and a nonconductive material; a display; a printed circuit board comprising a third surface, a fourth surface, a first conductive layer, a second conductive layer, a feeding line, a conductive pattern, a conductive via, a third conductive layer disposed between the first conductive layer and the second conductive layer, a fourth conductive layer disposed between the first conductive layer and the third conductive layer, multiple first side vias formed so as to electrically connect the first conductive layer and the third conductive layer and to be spaced apart from the conductive via by a first distance in a second direction, which is perpendicular to the first direction, and in which same face away from the through-hole and the slit, and multiple second side vias formed so as to electrically connect the third conductive layer and the fourth conductive layer and to be spaced apart from the conductive via by a second distance, which is different from the first distance, in the second direction; and at least one wireless communication circuit. Various other embodiments recognizable from the specification are also possible.
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公开(公告)号：US20200243948A1
公开(公告)日：2020-07-30
申请号：US16750541
申请日：2020-01-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongyeon KIM , Ahmed HUSSAIN , Seongjin PARK , Sehyun PARK , Sumin YUN , Woomin JANG , Myunghun JEONG , Jehun JONG , Jaehoon JO
Abstract: An electronic device is provided. The electronic device includes a housing, a display exposed through at least part of the first plate, an antenna structure body disposed inside the housing and including a first surface facing the non-conductive portion and a second surface facing away from the first surface, a spacer structure coupled to the first surface or integrally formed with the antenna structure body to protrude from the first surface without overlapping with the conductive pattern when viewed from above the first surface, and a wireless communication circuit electrically connected to the conductive pattern and configured to transmit or receive a signal. At least part of the first plate, the second plate, or the side member includes a non-conductive portion. The antenna structure body includes at least one conductive pattern disposed between the first surface and the second surface or on the first surface.
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公开(公告)号：US20240039171A1
公开(公告)日：2024-02-01
申请号：US18485849
申请日：2023-10-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sumin YUN , Hosaeng KIM , Seongjin PARK , Woomin JANG , Jehun JONG , Jaehoon JO , Jinwoo JUNG , Jaebong CHUN
CPC classification number: H01Q21/065 , H01Q1/2208
Abstract: An antenna structure is provided. The antenna structure includes a PCB including a first surface and a second surface facing in an opposite direction to the first surface, a conductive patch disposed on the first surface or inside the PCB so as to be adjacent to the first surface rather than the second surface, a first via passing through at least a section of the PCB and connected to the conductive patch and a second via spaced apart from the first via and connected to the conductive patch, a radio frequency integrated circuit (RFIC) disposed on the second surface, and a phase shifter disposed on the second surface or the conductive patch and electrically connected to the RFIC, or disposed inside the RFIC, wherein the conductive patch may be connected to the RFIC through the first and may be connected to the phase shifter through the second via.
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公开(公告)号：US20230198126A1
公开(公告)日：2023-06-22
申请号：US17980128
申请日：2022-11-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungsoo KIM , Jaehoon JO , Yongyoun KIM , Dongyoung LEE , Woomin JANG , Seungbum CHOI
CPC classification number: H01Q1/243 , H01Q9/0407 , G01D5/24 , G01L1/142
Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface, an antenna including a carrier including a first carrier surface facing the side surface, a second carrier surface opposite to the first carrier surface and a plurality of side carrier surfaces between the first carrier surface and the second carrier surface, and a patch positioned on the first carrier surface, a first capacitive sensor positioned between the first carrier surface and the side surface, and a filler positioned between the side surface and the first carrier surface.
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