公开(公告)号：US20190214964A1

公开(公告)日：2019-07-11

申请号：US16356890

申请日：2019-03-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer ,  Abram Castro

IPC: H03H9/10

CPC classification number: H03H9/1042 ,  H03H9/1007

Abstract: An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.

公开(公告)号：US20190019776A1

公开(公告)日：2019-01-17

申请号：US15646976

申请日：2017-07-11

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer ,  Minhong Mi ,  Swaminathan Sankaran ,  Rajen M. Murugan ,  Vikas Gupta

IPC: H01L25/065 ,  H01L23/31 ,  H01L49/02 ,  H01L23/495 ,  H01L23/00

Abstract: Described examples include a packaged device including a first object and a second object spaced from each other by a gap, each object having a first surface and an opposite second surface, the first surfaces of the first object and the second object including first terminals. A structure includes at least two conductors embedded in a dielectric casing consolidating a configuration and organization of the at least two conductors, the at least two conductors having end portions un-embedded by the dielectric casing. An end portion of at least one of the at least two conductors is electrically connected to a first terminal of the first object, and an opposite end portion of the at least one of the at least two conductors is electrically connected to a respective first terminal of the second object, the at least two conductors electrically connecting the first object and the second object.

公开(公告)号：US20160322557A1

公开(公告)日：2016-11-03

申请号：US14698616

申请日：2015-04-28

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer ,  Abram Castro

IPC: H01L41/08 ,  H03H3/007

CPC classification number: H03H9/1042 ,  H03H9/1007

Abstract: An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.

Abstract translation: 一种组件，包括由杨氏模量小于约10MPa的材料形成的电连接衬底，具有安装在电连接衬底上并与其电连接的相对端部的声学器件模具和封装声学器件裸片的模制化合物层 与基底接触。

公开(公告)号：US12191252B2

公开(公告)日：2025-01-07

申请号：US17546383

申请日：2021-12-09

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: H01L23/525 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic device has a fuse circuit including a semiconductor die and first and second bond wires, the semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit, the first bond wire having a first end coupled to the bond pad and a second end coupled to a conductive terminal, and the second bond wire having a first end coupled to the second end of the first bond wire and a second end coupled to the conductive terminal.

公开(公告)号：US20240266306A1

公开(公告)日：2024-08-08

申请号：US18610050

申请日：2024-03-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer

IPC: H01L23/62 ,  H01L21/56 ,  H01L23/00 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/532 ,  H02H7/00

CPC classification number: H01L23/62 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3135 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H02H7/008 ,  H01L23/293 ,  H01L23/296 ,  H01L23/49513 ,  H01L23/53295 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/73265

Abstract: A semiconductor package includes a metallic pad and leads, a semiconductor die including a semiconductor substrate attached to the metallic pad, and a conductor including a sacrificial fuse element above the semiconductor substrate, the sacrificial fuse element being electrically coupled between one of the leads and at least one terminal of the semiconductor die, a shock-absorbing material over a profile of the sacrificial fuse element, and mold compound covering the semiconductor die, the conductor, and the shock-absorbing material, and partially covering the metallic pad and leads, with the metallic pad and the leads exposed on an outer surface of the semiconductor package. Either a glass transition temperature of the shock-absorbing material or a melting point of the shock-absorbing material is lower than a melting point of the conductor.

公开(公告)号：US11935844B2

公开(公告)日：2024-03-19

申请号：US17138903

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer

IPC: H01L23/62 ,  H01L21/56 ,  H01L23/00 ,  H01L23/24 ,  H01L23/31 ,  H02H7/00 ,  H01L23/29 ,  H01L23/495 ,  H01L23/532

CPC classification number: H01L23/62 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3135 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H02H7/008 ,  H01L23/293 ,  H01L23/296 ,  H01L23/49513 ,  H01L23/53295 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/73265

Abstract: A semiconductor package and a method for forming a semiconductor package are disclosed. The semiconductor package includes a metallic pad and leads, a semiconductor die including a semiconductor substrate attached to the metallic pad, and a conductor including a sacrificial fuse element above the semiconductor substrate, the sacrificial fuse element being electrically coupled between one of the leads and at least one terminal of the semiconductor die, a shock-absorbing material over a profile of the sacrificial fuse element, and mold compound covering the semiconductor die, the conductor, and the shock-absorbing material, and partially covering the metallic pad and leads, with the metallic pad and the leads exposed on an outer surface of the semiconductor package. Either a glass transition temperature of the shock-absorbing material or a melting point of the shock-absorbing material is lower than a melting point of the conductor.

公开(公告)号：US11881445B2

公开(公告)日：2024-01-23

申请号：US17307915

申请日：2021-05-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/49575 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/50 ,  H01L21/4828 ,  H01L21/4842 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2224/49175 ,  H01L2224/73265

Abstract: An apparatus includes a first die attach pad and a second die attach pad. A first die is attached to the first die attach pad and a second die is attached to the second die attach pad. The first die attach pad and the second die attach pad are separated by a gap. A first edge of the first die attach pad adjacent to the gap is thinner than a second edge of the first die attach pad. The first edge of the first die attach pad is opposite the second edge of the first die attach pad. A first edge of the second die attach pad adjacent to the gap is thinner than a second edge of the second die attach pad. The first edge of the second die attach pad is opposite the second edge of the second die attach pad.

公开(公告)号：US11879790B2

公开(公告)日：2024-01-23

申请号：US17513259

申请日：2021-10-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer

IPC: H01L23/00 ,  G01K7/01 ,  H01L23/28 ,  H01L23/48 ,  H01L23/485

CPC classification number: G01K7/01 ,  H01L23/28 ,  H01L23/48 ,  H01L23/485 ,  H01L24/46 ,  H01L2224/48091 ,  H01L2224/73265

Abstract: An electronic device includes a substrate, a dielectric spacer, a semiconductor die, and a package structure. The substrate has a dielectric layer, a die pad, first and second leads, a conductive via, and a conductive trace, the dielectric layer has an opening extending into a side, the die pad is coupled to the first lead, the second lead is coupled to the conductive via, and the conductive trace is coupled to the via. The dielectric spacer is mounted above the die pad in the opening, and the semiconductor die is mounted above the dielectric spacer, the semiconductor die includes a temperature sensor, and an electrical connection couples the semiconductor die to the conductive trace. The package structure extends on the side of the dielectric layer, on the semiconductor die, and on the conductive trace, the package structure extending around the dielectric spacer and to the die pad in the opening.

公开(公告)号：US20230138475A1

公开(公告)日：2023-05-04

申请号：US17513259

申请日：2021-10-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer

IPC: G01K7/01 ,  H01L23/00

Abstract: An electronic device includes a substrate, a dielectric spacer, a semiconductor die, and a package structure. The substrate has a dielectric layer, a die pad, first and second leads, a conductive via, and a conductive trace, the dielectric layer has an opening extending into a side, the die pad is coupled to the first lead, the second lead is coupled to the conductive via, and the conductive trace is coupled to the via. The dielectric spacer is mounted above the die pad in the opening, and the semiconductor die is mounted above the dielectric spacer, the semiconductor die includes a temperature sensor, and an electrical connection couples the semiconductor die to the conductive trace. The package structure extends on the side of the dielectric layer, on the semiconductor die, and on the conductive trace, the package structure extending around the dielectric spacer and to the die pad in the opening.

公开(公告)号：US11573203B2

公开(公告)日：2023-02-07

申请号：US17027592

申请日：2020-09-21

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: G01N27/70 ,  G01K7/00

Abstract: In a described example, an apparatus includes: at least one electrode having a base on a first surface of a substrate and extending away from the base to an end; a counter-electrode spaced from the end of the at least one electrode, having a first conductive surface facing the end; and a package having a cavity containing the at least one electrode, the substrate, and the counter-electrode, the package having at least one opening configured to allow an atmosphere to enter the cavity.