Abstract:
PROBLEM TO BE SOLVED: To facilitate the alignment of a semiconductor circuit and a color filter. SOLUTION: An alkali free glass 1737 (0.5 mm thickness) manufactured by Corning Inc. is used as a substantially transparent base material 3, a color filter layers 4 of R (red), G (green) and B (blue) are formed on one surface thereof, an over coat comprising a transparent resin is added thereon and then a protective film is stuck onto the color filter layers. A semiconductor circuit having substantially transparent thin film transistors and wiring lines having electric contact points conducted to the thin film transistors and constituted of a substantially transparent conductive material is provided so as to be aligned with a filter arranged pattern on the surface opposite to the color filters of the base material 3. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate having an intermediate film serving as an etching stopper layer, in which the stresses of a thin film serving as a self-sustaining membrane, the intermediate film and a support substrate are optimally adjusted and which has conductivity, for the production of stencil mask that uses the substrate, and to provide the stencil mask and an exposure method. SOLUTION: The substrate is provided having such structure that an indium oxide thin film and a silicon thin film are laminated on the support substrate in this order, wherein stress adjustment is performed between the silicon thin film/indium oxide thin film and the support substrate, and wherein the indium oxide thin film contains one kind or more of elements selected from among tin, titanium, zirconium, hafnium, niobium, tantalum, tungsten, germanium, tellurium, zinc and fluorine as substances other than oxygen and indium. The stencil mask produced, by using the substrate and the exposure method that uses the mask are also provided. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a film forming device which can form a film by increasing the number of cycles without enlarging a facility, in the film forming device which forms the film while transferring a base board.SOLUTION: In the film forming device which forms the thin film on the base board 104 by using raw materials which are in air phase states while transferring the base board 104, the film forming device continuously or intermittently transfers the base board 104 by using a base board transfer mechanism 107 at a speed lower than the circumferential speed of a film forming drum 102 along the external peripheral face of the film forming drum 102. In this state, the raw materials are discharged toward the base board 104 in the air phase states from film forming sources 201A, 201B, 202A and 202B which are arranged at the external peripheral face of the film forming drum 102, and the film is formed on a face opposing the film forming drum 102 of the base board 104.
Abstract:
PROBLEM TO BE SOLVED: To provide a vacuum chamber capable of keeping the inside of the vacuum chamber in a clean condition and reducing the frequency of maintenance.SOLUTION: This vacuum chamber 100 installed in a device using a vacuum technology includes a mechanism configured to discharge a liquid from at least one first portion 101 of a structure installed on an inner wall of the vacuum chamber 100 or in the inside of the vacuum chamber 100, and to recover the liquid in at least one second portion 102 of the structure installed on the inner wall of the vacuum chamber 100 or in the inside of the vacuum chamber 100, wherein the discharge and the recovery of the liquid are performed in a vacuum atmosphere.
Abstract:
PROBLEM TO BE SOLVED: To provide a reflection type photomask blank, reflection type photomask, and a method and a device for inspecting the same, which improve accuracy of pattern inspection of a reflection type photomask and reduce the time needed for the inspection. SOLUTION: The reflection type photomask blank includes a substrate, a first reflective film formed on the substrate, a light emitting layer formed on the first reflective film and emitting light by applying a voltage, an absorber formed on the light emitting layer, a light-shielding film formed on the absorber, and a second reflecting film formed on the light-shielding film. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thin-film transistor in which problems that a source electrode and a drain electrode are easily broken and that a contact resistance is high when an oxide semiconductor film such as an InGaZnO 4 thin film is provided between the source electrode and the drain electrode. SOLUTION: The thin-film transistor has at least a gate electrode, a gate insulating film, a source electrode, a gate electrode and an oxide semiconductor film on an insulating substrate. In the thin-film transistor, the gate electrode and the gate insulating film are sequentially stacked on the insulating substrate, the source and drain electrodes are provided on the gate insulating film, and the oxide semiconductor film is provided on the gate insulating film between the source and drain electrodes, and on the principal portion of the source electrode and the principal portion of the drain electrode. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a structure of a display device and a manufacturing method of the display device which makes the positioning of substrates formed of a color filter and a semiconductor circuit unnecessary. SOLUTION: The image display device comprises: the color filter; a substantially transparent substrate; the semiconductor circuit composed of a substantially transparent thin film transistor and lines constituted by substantially transparent conductive material having electrical contacts with the transistor; and a reflection type display element, disposed in the order viewed from the visual side of the display device, therein the color filter and the substantially transparent semiconductor circuit are positioned to each other and are formed on surfaces of the transparent substrate different from each other. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a structure, a transmission type liquid crystal display device and a manufacturing method of semiconductor circuit which facilitates the positioning between a semiconductor circuit and a color filter, and to provide a manufacturing method of the transmission type liquid crystal display device. SOLUTION: As a substantially transparent planar first substrate 5, a non-alkali glass 1737 (thickness 0.5 mm) made by Corning Co., Ltd. is used and a color filter layer 4 of R(red), G(green), B(blue) is formed on one side surface of the thickness direction. Subsequently, as a substantially transparent planar second substrate 3, likewise a non-alkali glass 1737 (thickness 0.5 mm) made by Corning Co., Ltd. is used and a substantially transparent semiconductor circuit 2 is formed on one side surface of the thickness direction. While opposing the surface of a color filter which faces the opposite side to the first substrate 5 and the surface of the second substrate 3 which faces the opposite side to the semiconductor circuit 2 to each other, the positioning between the filter array pattern on the first substrate 5 and the semiconductor circuit 2 on the second substrate 3 is performed, and the first substrate 5 and the second substrate 3 are overlapped and joined via the color filter 4. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thin-film transistor material with which a semiconductor can be deposited with good reproducibility and yield of a thin film transistor can be improved by eliminating the necessity of precisely controlling an oxygen flow rate in depositing a semiconductor principally containing InGaZnO4 of an amorphous oxide semiconductor depositable at a room temperature, and to provide a method of manufacturing the same. SOLUTION: Using an InGaZnO4 doped with Sn, an active layer made of an Sn-doped InGaZnO4 thin film is formed on a flexible substrate by a sputtering method. Thus, the problem can be solved. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a thin-film transistor having an active layer capable of being deposited at a room temperature by suppressing variations in performance of individual products. SOLUTION: By using InGaSnO x (4≤x≤5) as a material of the thin-film transistor, an amorphous InGaSnO x (4≤x≤5) semiconductor can be formed on a flexible board at a room temperature with a wide process window, and the thin-film transistor having high bending strength can be manufactured while suppressing the variations between products at the minimum. Further, a sputtering method, especially, an InGaSnO 5 target is used as the manufacturing method to make an oxygen flow rate 2-4%, and thus, mobility of about 1 cm 2 /Vs can be stably obtained. COPYRIGHT: (C)2007,JPO&INPIT