LAMINATED POLYESTER FILM, FLAME-RETARDANT POLYESTER FILM USING SAME, COPPER-CLAD LAMINATE, AND CIRCUIT BOARD

    公开(公告)号:JP2007001292A

    公开(公告)日:2007-01-11

    申请号:JP2006087369

    申请日:2006-03-28

    Abstract: PROBLEM TO BE SOLVED: To provide a laminated polyester film excellent in the property of adhesion to a coating material, a flame-retardant polyester film using it, a copper-clad laminate, and a circuit board. SOLUTION: In the laminated polyester film, a resin layer containing a polyester resin and an oxazoline-based cross-linking agent is laminated on at least one side of a polyester film, 40 mol% or more of all diol components constituting the polyester resin is diethylene glycol, and the mass ratio between the polyester resin and the oxazoline-based cross-linking agent, constituting the resin layer, is in the range of 20/80-80/20. In the flame-retardant polyester film, a layer containing a polyimide is laminated on both the sides of the laminated polyester film. The copper-clad laminate uses the flame-retardant polyester film. COPYRIGHT: (C)2007,JPO&INPIT

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