公开(公告)号：JP2004139185A

公开(公告)日：2004-05-13

申请号：JP2002300927

申请日：2002-10-15

Applicant: Toshiba Corp ,  株式会社東芝

Inventor： TOMIOKA KENTARO ,  KUNO KATSUMI ,  TAKAMATSU TOMONAO ,  TANIMOTO MITSUYOSHI ,  KUSAKA HIROYUKI ,  KINOSHITA TERUO

IPC: F25D17/02 ,  G06F1/16 ,  G06F1/20 ,  H01L23/473 ,  H05K5/02 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1616 ,  G06F1/1681 ,  G06F1/1683 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To easily insert a cable, and first and second pipes through a connection part for first and second casings, while preventing the connection part from getting large. SOLUTION: This electronic device is provided with the first casing 4 and the second casing 9 connected to the first casing. The connection part of the first and second casings has at least three passage parts 20a-20d for communicating the inside of the first casing with the inside of the second casing. The cable 60 for processing an electric signal is inserted in at least one of the passage parts, and the first pipe 57 and the second pipe 58 for circulating a coolant between a heat receiving part 33 and a heat radiation part 35 are respectively inserted separately in the two residual passage parts. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004031979A

公开(公告)日：2004-01-29

申请号：JP2003286641

申请日：2003-08-05

Applicant: Toshiba Corp ,  株式会社東芝

Inventor： ISHIKAWA KENICHI ,  KUNO KATSUMI

IPC: G06F1/20 ,  H01L23/467 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide an electronic instrument in which excessive temperature rise in a second chassis can be prevented by cooling a heating element efficiently. SOLUTION: The electronic instrument (1) has a first chassis (4) having a heating element (12) and a second chassis (8) supported by the first chassis. A heat receiving unit (31) thermally connected to the heating element is contained within the first chassis. Furthermore, the instrument has a cooling unit (70) having a plurality of radiating fins (88) for radiating heat of the heating element and a fan (90) for blowing cooling air to the fins; and a circulating path (33) for transferring the heat of the heating element transferred to the heat receiving unit to the cooling unit by circulating a cooling medium between the first chassis and second chassis. The circulating path has a first conduit (50) for guiding the cooling medium heated in the heat receiving unit to the cooling unit; and a second conduit (51) for returning the cooling medium cooled in the cooling unit to the heat receiving unit through the second chassis. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2003324174A

公开(公告)日：2003-11-14

申请号：JP2002128821

申请日：2002-04-30

Applicant: Toshiba Corp ,  株式会社東芝

Inventor： TAKAMATSU TOMONAO ,  KUNO KATSUMI ,  IWASAKI HIDEO ,  TOMIOKA KENTARO

IPC: F28D15/02 ,  G06F1/20 ,  H01L23/36 ,  H01L23/467 ,  H01L23/473 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an electronic instrument which efficiently discharges the heat of a heat generating element of improve the cooling performance of the heat generating element. SOLUTION: The electronic instrument is provided with a heat receiving head (26), housed in an instrument body (2), a radiator (27) housed in a display unit (3) having a display panel (10), and a circulation route (28) arranged astride the instrument body and the display unit while circulating cooling liquid between the refrigerant flow passage (31) of the heat receiving head and the refrigerant flow passage (40) of the radiator. A motor-driven fan (29) is housed in the display unit. The motor-driven fan sends air between the radiation unit and the display panel to forcibly cool the radiation unit. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种有效地排放发热元件的热​​量以提高发热元件的冷却性能的电子仪器。 电子仪器设置有容纳在仪器主体（2）中的受热头（26），容纳在具有显示面板（10）的显示单元（3）中）的散热器（27），以及 在所述受热头的制冷剂流路（31）和所述散热器的制冷剂流路（40）之间使冷却液循环的同时跨越所述仪器主体和所述显示单元的循环路径（28）。 电动风扇（29）容纳在显示单元中。 电动风扇在辐射单元和显示面板之间发送空气以强制冷却辐射单元。 版权所有（C）2004，JPO

公开(公告)号：JP2003257394A

公开(公告)日：2003-09-12

申请号：JP2002366907

申请日：2002-12-18

Applicant: TOSHIBA CORP

Inventor： KANAI HIDEYUKI ,  KANDA MOTOI ,  KUNO KATSUMI ,  IWASAKI HIDEO

IPC: A47L9/28 ,  H01M2/10 ,  H01M10/60 ,  H01M10/613 ,  H01M10/617 ,  H01M10/62 ,  H01M10/643 ,  H01M10/653 ,  H01M10/6555 ,  H01M10/6556 ,  H01M10/6557 ,  H01M10/6563 ,  H01M10/50

Abstract: PROBLEM TO BE SOLVED: To provide a battery pack with enhanced cycle characteristics in high rate discharge. SOLUTION: This battery pack has a outer case 1; and cylindrical lithium ion secondary batteries housed in the arrangement of longitudinal N columns and lateral M rows (N column ≤ M row) in the outer case 1, the outer case 1 has a blast port 4 opened on a first surface 3 facing the outer circumferential surface of the secondary battery in the first column, an exhaust port 5 is opened in a second surface 3b positioned on the opposite side on the first surface, the secondary batteries are arranged through a gap, and in the first column secondary batteries, a region where the distance to the first surface of outer surfaces becomes the shortest is faced to the blast port 4 of the outer case 1, and in the second column secondary battery, a region where the distance to the first surface of the outer circumferential surfaces becomes the shortest is faced to the blast port 4 of he outer case 1 through the gap in the first columns. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003249783A

公开(公告)日：2003-09-05

申请号：JP2002047387

申请日：2002-02-25

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  TAKAMATSU TOMONAO ,  IWASAKI HIDEO ,  TOMIOKA KENTARO

IPC: F16L53/00 ,  G06F1/20 ,  H05K5/02 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide an electronic apparatus like a computer having a tube joint unit for preventing damage of a tube and liquid leakage. SOLUTION: A first joint 38 having a joint 39 connected with a first channel and a joint 40 protruding in the inner direction of a case 30, a second joint 41 having a joint 43 connected with a second channel and a joint 44 protruding in the inner direction of the case 30, and a tube 48 for connecting the joints 40 and 44 of the first and second joints 38 and 41 are accommodated in the case 30 of the tube joint unit 20 for connecting the first channel of a main body with the second channel of a display part. The inside of the case 30 is filled with a grease 50. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003222098A

公开(公告)日：2003-08-08

申请号：JP2002020360

申请日：2002-01-29

Applicant: TOSHIBA CORP

Inventor： TOMIOKA KENTARO ,  ISHIKAWA KENICHI ,  KUNO KATSUMI ,  MATSUOKA TAKASHI ,  TOMA HIDEYUKI

IPC: F04D29/44 ,  G06F1/16 ,  G06F1/20 ,  H01L23/467

Abstract: PROBLEM TO BE SOLVED: To improve a centrifugal fan device, in which the sectional area of a volute is enlarged without expanding the casing to the outside in the radial direction. SOLUTION: The centrifugal fan device 23 comprises a casing 30 and an impeller 31. The casing 30 has inlets 36a, 36b facing to the center of rotation of the impeller, a volute 42 formed on the outside periphery of the impeller, and a discharge opening 37 provided in the downstream end on the side of the volute end. The impeller discharges air sucked from the inlets from the periphery of the impeller into the volute, and simultaneously supplies the air through the volute to the discharge opening. The volute of the casing has a sectional shape in which the size of the impeller along the axial direction increases, as it advances to the outside in the radial direction from the periphery of the impeller. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003216658A

公开(公告)日：2003-07-31

申请号：JP2002010790

申请日：2002-01-18

Applicant: TOSHIBA CORP

Inventor： HIROHATA KENJI ,  KUNO KATSUMI ,  MATSUOKA TAKASHI ,  KUGIMIYA TETSUYA ,  SHIRATORI MASAKI ,  U KYO

IPC: G06F17/50 ,  G06F17/10 ,  G06F17/17 ,  G06F17/18

Abstract: PROBLEM TO BE SOLVED: To provide a design support method and program that facilitate the development of a high precision response curved surface approximate expression or the expansion of response curved surface space. SOLUTION: Sampling point data are calculated on the basis of a first response curved surface approximate expression, with regard to a partial region of the design space, in order to support the development of the response curved surface approximate expression in the design space of a phenomenon or a system as an object. At least for an inclusive region that includes this partial region, a linear primary response curved surface model is calculated in relation to a coefficient of a second response curved surface approximate expression. With each coefficient of this second response curved surface approximate expression as a state quantity, the best fit of the response curved surface model is calculated by obtaining a residual error or a dispersed estimate through the estimation of the state quantity on the basis of a state estimating algorithm using observed data. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2002304994A

公开(公告)日：2002-10-18

申请号：JP2002012013

申请日：2002-01-21

Applicant: TOSHIBA CORP

Inventor： KANAI HIDEYUKI ,  KANDA MOTOI ,  KUNO KATSUMI ,  IWASAKI HIDEO ,  KUBO KOICHI

IPC: C01G53/00 ,  H01M4/505 ,  H01M4/525 ,  H01M10/05 ,  H01M4/58 ,  H01M4/02 ,  H01M10/40

Abstract: PROBLEM TO BE SOLVED: To provide a positive electrode active material capable of eliminating bursting and firing in a nail sticking test and of improving a large-current discharge characteristic. SOLUTION: This positive electrode active material contains a composite oxide expressed by chemical formula (1). Lix (Ni1-y Me1y ) (O2-z Xz )+A (1) (Where, Me1 is one or more kinds of elements selected from among B, Mg, Al, Sc, Ti, V, Cr, Mn, Co, Cu, Zn, Ga, Y, Zr, Nb, Mo, Tc, Ru, Sn, La, Hf, Ta, W, Re, Pb and Bi; X is one or more elements of halogen; 0.02

公开(公告)号：JP2002291669A

公开(公告)日：2002-10-08

申请号：JP2001099134

申请日：2001-03-30

Applicant: TOSHIBA CORP

Inventor： KUNO KATSUMI ,  IWASAKI HIDEO ,  KANAI HIDEYUKI ,  KANDA MOTOI

IPC: A47L9/28 ,  H01M2/10 ,  H01M10/60 ,  H01M10/613 ,  H01M10/617 ,  H01M10/62 ,  H01M10/652 ,  H01M10/655 ,  H01M10/6551 ,  H01M10/6556 ,  H01M10/6563 ,  H01M10/6566 ,  H01M10/50

Abstract: PROBLEM TO BE SOLVED: To provide a battery-driven vacuum cleaner, with which a battery pack is efficiently cooled by air and reliability can be prevented from being lowered by using air sucked by a fan for cooling the battery pack. SOLUTION: This cleaner is provided with a battery pack 3, with which a plurality of secondary batteries 4 are bundled a battery pack housing part 2, a motor 7 to be driven by batteries, fan to be driven by the motor, a dust cup 9 for separately storing dust or the like in sucked air, first air channel for guiding sucked air to the motor and a second air channel 30a for guiding air from a housing 1, where an exhaust hole 12 is formed for exhausting internal air to the outside, and the motor. Then, the battery pack housing part is arranged on the second air channel, an inflow hole 37 for making air flow into the battery pack housing part is formed on a motor side wall part 31, and an outflow hole 38 for making air flow outside the battery pack housing part is formed on an exhaust side wall part 32.

公开(公告)号：JP2001196773A

公开(公告)日：2001-07-19

申请号：JP2000001832

申请日：2000-01-07

Applicant: TOSHIBA CORP ,  TOSHIBA HOME TECH CORP

Inventor： NAKAMURA HIROSHI ,  KUNO KATSUMI ,  TOMIOKA KENTARO ,  AOKI HIROSHI ,  YAMAMOTO KATSUHIKO

IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20 ,  H01L23/40

Abstract: PROBLEM TO BE SOLVED: To provide a cooling device, which is capable of efficiently conducting heat released from a semiconductor package from a heat receiving part to a heat sink and is moreover reduced in thickness. SOLUTION: A cooling device 25 is equipped with a heat sink 27 possessed of a heat receiving part 50, which receives heat released from a semiconductor package 19 and a heat-dissipating part 51, thermally connected to the heat receiving part 50, and a fan unit 26 which sends cooling air to the heat- dissipating part 51 of the heat sink 27. The heat-dissipating part 51 is arranged two-dimensionally and does not overlap with the heat receiving part 50 at a position distant from the semiconductor package. The heat-receiving part 50 of the heat sink 27 is set movable to approach to or recede from the semiconductor package and is energized via a leaf spring 80 in a direction so as to approach the semiconductor package.