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公开(公告)号：US09990576B2
公开(公告)日：2018-06-05
申请号：US15106529
申请日：2015-01-23
Applicant: United Technologies Corporation
Inventor： Aaron T. Nardi , Joseph V. Mantese , Michael A. Klecka , Daniel V. Viens
IPC: G06K19/077 , G01D11/24
CPC classification number: G06K19/07722 , G01D9/005 , G01D11/245 , H01L23/04 , H01L23/24 , H01L2924/0002 , H01L2924/00
Abstract: A component may be self-monitoring having a sensor assembly located on a surface of a substrate and covered by an encapsulating layer additively manufactured over the sensor assembly and thereby bonded to the substrate. The sensor may be wireless, self-powered, and embedded into the substrate such that it is unobtrusive and may not limit the performance or function of the component.
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公开(公告)号：US09850589B2
公开(公告)日：2017-12-26
申请号：US14703079
申请日：2015-05-04
Applicant: UNITED TECHNOLOGIES CORPORATION
Inventor： Ying She , Raja Kountanya , Changsheng Guo , Daniel V. Viens
IPC: C25D5/22 , C25C1/00 , C25C7/00 , C25C7/02 , C25C7/06 , C25D17/10 , C25D21/12 , C25F3/16 , C25F7/00
CPC classification number: C25D5/22 , C25C1/00 , C25C7/00 , C25C7/02 , C25C7/06 , C25D17/10 , C25D21/12 , C25F3/16 , C25F7/00
Abstract: A system and methods are provided for electrochemical grinding a workpiece. In one embodiment, a method includes controlling potentials to grinding tool and the workpiece, controlling applying electrolyte, and controlling grinding of the workpiece by the grinding tool. The method may also include determining screen replacement when there is sufficient metal plated.
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公开(公告)号：US20160007474A1
公开(公告)日：2016-01-07
申请号：US14790886
申请日：2015-07-02
Applicant: United Technologies Corporation , Goodrich Corporation
Inventor： Sameh Dardona , Michael P. Humbert , John P. Wesson , Wayde R. Schmidt , Daniel V. Viens , Jin Hu
IPC: H05K3/00 , H05B3/06 , H05B3/02 , H05K3/30 , H05B3/12 , H05B3/26 , H05K3/12 , H05B3/00 , H05B3/16
CPC classification number: H05K3/0014 , B33Y80/00 , H05B3/0014 , H05B3/06 , H05B3/12 , H05B3/145 , H05B3/16 , H05B3/265 , H05B3/267 , H05B3/34 , H05B3/84 , H05B2203/003 , H05B2203/013 , H05B2203/017 , H05B2214/02 , H05B2214/04 , H05K3/12 , H05K3/30
Abstract: A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste.
Abstract translation: 加热电路组件及其制造方法包括具有图案的导电加热元件。 非导电基材是制造并固定到用于结构支撑的元件的添加剂。 衬底具有通常与元件的图案对准的拓扑，从而减少组件重量并使衬底材料浪费最小化。
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公开(公告)号：US20150321217A1
公开(公告)日：2015-11-12
申请号：US14763915
申请日：2013-01-28
Applicant: UNITED TECHNOLOGIES CORPORATION
Inventor： Aaron T. Nardi , Tahany I. El-Wardany , Daniel V. Viens
Abstract: An additive manufacturing system includes a cold spray system operable to accelerate a powdered material. In one embodiment, wherein the powdered material includes a ductile material. In the alternative or additionally thereto, the foregoing embodiment, includes wherein the powdered material is a copper alloy. In the alternative or additionally thereto, the foregoing embodiment includes, wherein the powdered material is an aluminum alloy.
Abstract translation: 添加剂制造系统包括可用于加速粉末材料的冷喷雾系统。 在一个实施例中，其中粉末材料包括延性材料。 在替代或附加地，上述实施例包括其中粉末材料是铜合金。 在替代或附加地，前述实施例包括其中粉末材料是铝合金。
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公开(公告)号：US10710161B2
公开(公告)日：2020-07-14
申请号：US14202195
申请日：2014-03-10
Applicant: United Technologies Corporation
Inventor： Tahany Ibrahim El-Wardany , Matthew E. Lynch , Daniel V. Viens , Robert A. Grelotti
Abstract: A method of fabricating a functionally graded turbine engine component is disclosed and includes the step of depositing layers of powder onto a base and solidifying/fusing each layer with a first directed energy beam to define a component. The method further includes varying a process parameter between deposited layers to define different material properties within the component. The method also proposes surface enhancement approach that can be used after depositing each layer to locally customize the material properties. The method also proposes machining the different internal surfaces to achieve the proper surface finishing required.
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Patent Agency Ranking
公开(公告)号：US10440829B2
公开(公告)日：2019-10-08
申请号：US14790886
申请日：2015-07-02
Applicant: United Technologies Corporation , Goodrich Corporation
Inventor： Sameh Dardona , Michael P. Humbert , John P. Wesson , Wayde R. Schmidt , Daniel V. Viens , Jin Hu
IPC: H05K3/00 , H05B3/12 , H05B3/14 , H05B3/26 , H05B3/34 , H05B3/84 , H05B3/00 , H05B3/06 , H05B3/16 , H05K3/12 , H05K3/30 , B33Y80/00
Abstract: A heating circuit assembly and method of manufacture includes an electrically conductive heating element having a pattern. An electrically non-conductive substrate is additive manufactured and secured to the element for structural support. The substrate has a topology that generally aligns with the pattern of the element thereby reducing the assembly weight and minimizing substrate material waste.
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公开(公告)号：US20190275627A1
公开(公告)日：2019-09-12
申请号：US15916683
申请日：2018-03-09
Applicant: United Technologies Corporation
Inventor： Zhigang Wang , Changsheng Guo , Daniel V. Viens
Abstract: A system includes a machine tool that includes a cutting tool, a fluid subsystem that provides fluid to the cutting tool, and at least one processor that executes instructions that cause the at least one processor to: obtain a signal indicative of a load on the cutting tool, establish a first value of at least one parameter of the fluid based on the signal, obtain a second value of the at least one parameter that is based on a simulation, determine a difference between the first value and the second value, and adjust a state of a device of the fluid subsystem based on the determined difference.
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公开(公告)号：US10376960B2
公开(公告)日：2019-08-13
申请号：US15409483
申请日：2017-01-18
Applicant: United Technologies Corporation
Inventor： John A. Sharon , Daniel V. Viens , Tahany Ibrahim El-Wardany , Gajawalli V. Srinivasan , Joseph J. Sangiovanni , Ranadip Acharya
IPC: B22F5/00 , B33Y10/00 , B33Y80/00 , B22F3/105 , B23K26/342 , F01D5/02 , B22F7/06 , B23K26/00 , B23K26/082 , B23K101/00 , B23K103/18
Abstract: An additively manufactured alloy component has a first portion formed of the alloy and having a first grain size, and a second portion formed of the alloy and having a second grain size smaller than the first grain size. In an embodiment, the alloy component is an alloy turbine disk, the first portion is a rim region of the alloy turbine disk, and the second portion is a hub region of the alloy turbine disk. The first and second grain sizes may be achieved by controllably varying the laser power and/or scan speed during additive manufacturing.
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公开(公告)号：US10222001B2
公开(公告)日：2019-03-05
申请号：US15035060
申请日：2014-09-08
Applicant: United Technologies Corporation
Inventor： Paul F. Croteau , John P. Wesson , Andrzej Ernest Kuczek , Matthew E. Lynch , Tahany Ibrahim El-Wardany , Ellen Y. Sun , Wenping Zhao , Daniel V. Viens
Abstract: A pressure vessel configured to store a pressurized fluid is provided including a plurality of lobes. Each lobe includes at least one vertically arranged interior wall. The plurality of lobes are positioned in a side by side configuration such that a first interior wall of a first lobe is positioned adjacent a second interior wall of a second adjacent lobe. The first interior wall and the second interior wall are configured to contact one another at a first point of tangency. A first tangent intersects the first lobe at the first point of tangency and a second tangent intersects the second lobe at the first point of tangency. The first tangent and the second tangent are separated by about 120 degrees.
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公开(公告)号：US20170286821A1
公开(公告)日：2017-10-05
申请号：US15106529
申请日：2015-01-23
Applicant: United Technologies Corporation
Inventor： Aaron T. Nardi , Joseph V. Mantese , Michael A. Klecka , Daniel V. Viens
IPC: G06K19/077 , G01D11/24
CPC classification number: G06K19/07722 , G01D9/005 , G01D11/245 , H01L23/04 , H01L23/24 , H01L2924/0002 , H01L2924/00
Abstract: A component may be self-monitoring having a sensor assembly located on a surface of a substrate and covered by an encapsulating layer additively manufactured over the sensor assembly and thereby bonded to the substrate. The sensor may be wireless, self-powered, and embedded into the substrate such that it is unobtrusive and may not limit the performance or function of the Ccomponent.
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