公开(公告)号：JP2000013152A

公开(公告)日：2000-01-14

申请号：JP80399

申请日：1999-01-06

Applicant: XEROX CORP

Inventor： ZOMORRODI MEHRDAD

IPC: H03F1/34 ,  H03F3/30 ,  H04N5/14 ,  H04N5/335

Abstract: PROBLEM TO BE SOLVED: To provide a sensor array analog video buffer. SOLUTION: This sensor array analog video buffer 40 is provided with an input means 45 that has a feedback receiving node and an input node to receive an input signal and with a feedback means 44 that has a feedback node. The feedback means connects to the input means to respond to the input means, the feedback node of the feedback means connects to the feedback reception node of the input means. The buffer 40 is also provided with a driver means 42 that has an output node, which outputs an output signal for the video buffer 40. The driver means connects to the input means and the feedback means and responds to the input means. The driver means and the feedback means are configured and laid out so that the output node is isolated from the feedback node.

公开(公告)号：JP2000012607A

公开(公告)日：2000-01-14

申请号：JP14100899

申请日：1999-05-21

Applicant: XEROX CORP

Inventor： ZOMORRODI MEHRDAD ,  MOJARRADI MOHAMMAD M ,  WONG KAISER H

IPC: H01L21/60 ,  H01L23/482

Abstract: PROBLEM TO BE SOLVED: To manufacture an integrated circuit having an united flexible interconnection part by a pitch less than 15 μm. SOLUTION: Chips 32a and 32b formed on a substrate 40 have an united flexible interconnection part 38 (fine pitch interconnection part). The distance from the center of one interconnection part 38 to the center of the adjacent interconnection part 38 (pitch) is 6 microns. The interconnection part 38 extends over the boundary B of every chips 32a and 32b. The exceeding part B of the boundary is flexible. Although the region shown by F is flexible, it has enough solidity to keep its flatness.