FLAME RETARDANT-STABILIZER COMBINATION FOR THERMOPLASTIC POLYMERS

    公开(公告)号:US20240218160A1

    公开(公告)日:2024-07-04

    申请号:US18557438

    申请日:2022-04-25

    Abstract: Described herein is a flame retardant-stabilizer mixture including as a component A, 5% to 95% by weight of aluminium diethylphosphinate (DEPAL) and/or zinc diethylphosphinate (DEPZN); as a component B, 5% to 95% by weight of titanium phosphinates and/or titanyl phosphinates of the formula (I) (DEPTI) in which x is a number from 0 to 1.9; as a component C, 0% to 10% by weight of aluminium phosphite or zinc phosphite of the formula (II), [HP(═O)O2]2−Zn2+, and formula (III), [HP(═O)O2]2−3Al3+2; as a component D, 0% to 30% by weight of a nitrogen-containing synergist and/or of a phosphorus-containing and/or nitrogen-containing flame retardant; as a component E, 0% to 70% by weight of a filler and reinforcer; as a component F, 0% to 3% by weight of an organic phosphonite and/or an organic phosphite and/or mixtures with phenolic antioxidants; and as a component G, 0% to 3% by weight of an ester and/or salt of long-chain aliphatic carboxylic acids (fatty acids) typically having chain lengths of C14 to C40. The sum total of components A-G is 100% by weight.

    THERMALLY CONDUCTIVE SILICONE COMPOSITION
    17.
    发明公开

    公开(公告)号:US20240218150A1

    公开(公告)日:2024-07-04

    申请号:US18563419

    申请日:2022-03-31

    Abstract: [Problem]
    One object of the present invention is to provide a thermally conductive silicone composition in which an increase in viscosity is suppressed when a thermally conductive filler is filled with a high amount level, and a thermally conductive silicone cured product having good thermal conductivity and excellent handling properties.
    [Solution]
    A thermally conductive silicone composition comprising the following components (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom: 100 parts by mass; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom to the number of the alkenyl group in component (A) is 0.1 to 2; (C) a thermally conductive filler: 4,000 to 7,000 parts by mass; (D) a platinum group metal-based catalyst: a catalyst amount; (E) an addition reaction control agent: 0.01 to 1 part by mass; and (F) a dimethylpolysiloxane having a trialkoxysilyl group at one end of a molecular chain and represented by the formula (1): 100 to 300 parts by mass: wherein R5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of 5 to 100, wherein the thermally conductive filler (C) comprises, relative to a total mass of component (C), 20 to 50 mass % of aluminum nitride (C1) having a volume median diameter in the range of 50 μm or more and less than 120 μm, 20 to 40 mass % of alumina (C2) having a volume median diameter in the range of 1 μm or more and less than 5 μm, and 2 to 10 mass % of alumina (C3) having a volume median diameter in the range of 0.1 μm or more and less than 1 μm.

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