Abstract:
To provide a highly reliable heat-dissipating silicone grease composition having stable thermoconductive properties over a long period of time, which does not exude oil, and which does not lead to contact defects. The heat-dissipating silicone grease composition, comprising: (A) 100 weight parts of an organopolysiloxane having a thixotropicity degree &agr; of 1.03-1.50 and a viscosity at 25° C. of 100-1,000,000 mm2/s, and (B) 100-2,000 weight parts of a thermoconductive inorganic filler having an) average particle diameter of 0.1-100 micrometers.
Abstract:
Methods of lubricating food processing equipment that include applying a food grade, high temperature lubricant composition to the food processing equipment are described. The composition includes a polyol polyester base oil that is a reaction product of at least one neopentyl polyhydric alcohol and at least one monocarboxylic acid. Also described are methods of preparing a food grade, high temperature composition comprising reacting at least one neopentyl polyhydric alcohol and at least one monocarboxylic acid. The composition may be a lubricant composition. Additionally, the invention provides a food grade, high temperature lubricant composition comprising a polyol polyester base oil that is a reaction product of at least one neopentyl polyhydric alcohol and at least one monocarboxylic acid.
Abstract:
An article including a first release liner with a first release surface, a second release liner with a second release surface, and a layer of a thermally conductive grease between the first and the second release surfaces. The thermally conductive grease includes a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D 50 ) particle size which differs from the other distributions by at least a factor of 5.
Abstract:
An article including a first release liner with a first release surface, a second release liner with a second release surface, and a layer of a thermally conductive grease between the first and the second release surfaces. The thermally conductive grease includes a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D50) particle size which differs from the other distributions by at least a factor of 5.
Abstract:
The present invention discloses a nanodiamond thermal grease, which comprises a nanodiamond powder, a thermal powder and a substrate. The nanodiamond powder has volume percentage of 5% to 30%, the thermal powder has volume percentage of 40% to 90%, and the substrate has volume percentage of 5% to 30%. The nanodiamond powder and the thermal powder are distributed uniformly in the substrate to form the nanodiamond thermal grease having high thermal conductivity.
Abstract:
A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystalline filler, a second talc, and a hydrocarbon resin are mixed forming an accelerator mixture. A methylamino accelerator is mixed into the accelerator mixture forming an epoxy accelerator. Substantially equal amounts of the epoxy base and the epoxy accelerator are mixed to form the lubricating fast-setting epoxy compound having a high lubricity and a curing time ranging from two minutes to twelve minutes. Adjusting the mixing speed and temperature of the epoxy base, the accelerator mixture, and the epoxy accelerator is contemplated to promote homogeneity. The epoxy base can also include a flatting agent. The epoxy accelerator can also include a modified aliphatic amine, an acrylic resin, a coloring agent, or combinations thereof.
Abstract:
A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 nullm; and a semiconductor device utilizing the aforesaid grease composition.
Abstract:
An object of the present invention is to provide a grease composition which has little influence on the environment and has good rust prevention and water resistance against salt water such as sea water. The grease composition comprises a biodegradable base oil and a rust-preventive agent comprising a calcium sulfonate complex and a sorbitan fatty acid ester, wherein a total content of biodegradable organic substances in the grease composition is 75% by mass or more, and wherein a content of the rust-preventive agent is 2.5 to 30% by mass.
Abstract:
A thermally conductive silicone grease composition comprises: (A) an organopolysiloxane represented by the following general formula: wherein each R1 is independently selected from monovalent hydrocarbon groups, each X is independently selected from monovalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) wherein R1 is defined as above, R2 is an oxygen atom or an alkylene group, R3 is an alkyl group, a is an integer ranging from 0 to 2, m is an integer equal to or greater than 0, and n is an integer equal to or greater than 0; (B) a thermally conductive filler; and (C) an aluminum-based or titanium-based coupling agent. The composition exhibits excellent heat resistance and reduced oil bleeding.
Abstract:
The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D50) particle size which differs from the other average particle sizes by at least a factor of five. The thermally conductive greases of the invention exhibit desirable rheological behavior during installation/application and during use of devices involving these materials.