公开(公告)号：US20120249465A1

公开(公告)日：2012-10-04

申请号：US13493524

申请日：2012-06-11

Applicant: Yi-Chun Lin ,  Ming-Kung Wu ,  Hsiao-Ping Li ,  Ping-Wen Huang ,  Cheng-Yi Chou ,  Yu-Hua Wu ,  Xuan-Chang Shiu ,  Chih-Yuan Wang ,  Ching-Fu Hsu ,  Shiao-Hui Liao ,  Ting-Yu Chang ,  Fa-Chen Wu ,  Wen-Chun Wang

Inventor： Yi-Chun Lin ,  Ming-Kung Wu ,  Hsiao-Ping Li ,  Ping-Wen Huang ,  Cheng-Yi Chou ,  Yu-Hua Wu ,  Xuan-Chang Shiu ,  Chih-Yuan Wang ,  Ching-Fu Hsu ,  Shiao-Hui Liao ,  Ting-Yu Chang ,  Fa-Chen Wu ,  Wen-Chun Wang

IPC: G06F3/041

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/0393 ,  H05K2201/017 ,  H05K2201/09 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.

Abstract translation: 公开了触摸屏结构及其制造方法，其中制造方法包括以下步骤：提供接合层; 以及在所述接合层上形成导电图案层; 其中所述导电图案层由至少一个第一和至少一个第二主导体构成，绝缘层插入在所述第一和第二主导体之间。 与用于制造触摸板的现有技术相比，本发明在材料成本，生产成本和生产成本方面是有利的; 此外，可以简化面板层压工艺，并且可以将触摸面板结构连接到平面或弯曲的面板，并且便于设计更薄的产品。

公开(公告)号：KR1020100081401A

公开(公告)日：2010-07-15

申请号：KR1020090000628

申请日：2009-01-06

Applicant: 아이디밸리 주식회사

Inventor： 박신옥 ,  정일재

IPC: H04B1/40 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/141 ,  H05K3/30 ,  H05K2201/09

Abstract: PURPOSE: An annular RF module using a PCB is provided to install a coil, a SMD type condenser and an RF chip at separated independent PCB, thereby embodying annular RF module applying in various products by independent manufacturing process with low cost / high efficiency. CONSTITUTION: A PCB(Printed Circuit Board)(50) is used as a base module. A SMD(Surface Mounting Device) type condenser, a coil contact and an RF(Radio Frequency) chip contact are included on the PCB. A coil(51) is installed in the coil point of the PCB. An RF chip(52) is installed in the RF chip contact point of the PCB. The cut end of the coil is manufactured as horizontal type, a vertical type, or a complex type by considering spatial construction of product applying an annular RF module.

Abstract translation: 目的：提供使用PCB的环形RF模块，在分离的独立PCB上安装线圈，SMD型冷凝器和RF芯片，从而体现环形RF模块通过独立制造工艺以低成本/高效率应用于各种产品。 构成：PCB（印刷电路板）（50）用作基本模块。 PCB上包括SMD（表面贴装装置）型电容器，线圈触点和RF（射频）芯片触点。 线圈（5​​1）安装在PCB的线圈点上。 RF芯片（52）安装在PCB的RF芯片接触点中。 通过考虑施加环形RF模块的产品的空间结构，线圈的切割端被制造为水平型，垂直型或复合型。