公开(公告)号：US09190400B2

公开(公告)日：2015-11-17

申请号：US14135006

申请日：2013-12-19

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: H01L25/16 ,  H01L25/00 ,  H01S5/022 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02

CPC classification number: G02B6/1225 ,  G02B6/12002 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147 ,  H01L25/167 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/00 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02272

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

Abstract translation: 制造复合集成光学器件的方法包括提供包括硅层的衬底，在硅层中形成波导，以及形成包含耦合到硅层的金属材料的层。 该方法还包括提供光学检测器，在金属材料和光学检测器的第一部分之间形成金属辅助结合，在波导与光学检测器的第二部分之间形成直接的半导体 - 半导体结合。

公开(公告)号：US09159631B2

公开(公告)日：2015-10-13

申请号：US14261276

申请日：2014-04-24

Applicant: Skorpios Technologies, Inc.

Inventor： Elton Marchena

IPC: H01L21/8258 ,  H01L21/762 ,  G02B6/13 ,  H01L31/18 ,  H01L33/00 ,  H01S5/02 ,  H01S5/30

CPC classification number: H01L21/8258 ,  G02B6/13 ,  H01L21/76251 ,  H01L31/18 ,  H01L33/005 ,  H01S5/0215 ,  H01S5/3013

Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

Abstract translation: 制造复合半导体结构的方法包括提供包括第一材料并具有第一表面的第一基板，并且形成沿垂直于第一表面的方向延伸到预定高度的多个基座。 该方法还包括将包括第二材料的多个元件附接到多个基座中的每一个，从而提供其上设置有一个或多个结构的第二基板，以及对准第一基板和第二基板。 该方法还包括接合第一基板和第二基板以形成复合基板结构，并从复合基板结构去除第一基板的至少一部分。

公开(公告)号：US09151592B2

公开(公告)日：2015-10-06

申请号：US13733331

申请日：2013-01-03

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi

IPC: G02F1/225 ,  G01B9/02 ,  G02F1/21 ,  G02B6/293 ,  G02B6/12 ,  G02F1/015

CPC classification number: G01B9/02049 ,  G02B6/29335 ,  G02B6/29338 ,  G02B2006/12142 ,  G02F1/21 ,  G02F1/225 ,  G02F2001/0151 ,  G02F2001/212 ,  G02F2203/15

Abstract: A multiple resonance interferometer structure includes an input port and a first arm coupled to the input port and including a first resonant structure. The multiple resonance interferometer also includes a second arm coupled to the input port and including a second resonant structure and an output port coupled to the first arm and the second arm.

Abstract translation: 多谐振干涉仪结构包括输入端口和耦合到输入端口并包括第一谐振结构的第一臂。 多谐振干涉仪还包括耦合到输入端口的第二臂，并且包括耦合到第一臂和第二臂的第二谐振结构和输出端。

公开(公告)号：US20150253501A1

公开(公告)日：2015-09-10

申请号：US14642415

申请日：2015-03-09

Applicant: Skorpios Technologies, Inc.

Inventor： Guoliang Li ,  Nikhil Kumar

IPC: G02B6/125 ,  G02B6/122

CPC classification number: H01S5/12 ,  G02B6/1228 ,  G02B6/125 ,  G02B2006/12097 ,  G02B2006/12147 ,  H01S3/0315 ,  H01S3/063 ,  H01S3/0635 ,  H01S3/0675 ,  H01S3/08009 ,  H01S3/1003 ,  H01S3/1055 ,  H01S5/021 ,  H01S5/0612 ,  H01S5/0683 ,  H01S5/1032 ,  H01S5/1218 ,  H01S5/1234 ,  H01S5/141 ,  H01S5/3013

Abstract: An optical, directional coupler has a first input, a second input, a first output, and a second output. The coupler is made with a shoulder disposed on a substrate and a first ridge and a second ridge disposed on the shoulder. The first ridge extends from the first input to the first output. The second ridge extends from the second input to the second output. The shoulder, the first ridge, and the second ridge taper to provide coupling and are modified to select a coupling ratio.

Abstract translation: 光学定向耦合器具有第​​一输入，第二输入，第一输出和第二输出。 耦合器由设置在基板上的肩部和设置在肩部上的第一脊部和第二脊部制成。 第一个脊从第一个输入延伸到第一个输出。 第二脊从第二输入延伸到第二输出。 肩部，第一脊和第二脊锥形以提供联接并被修改以选择耦合比。

公开(公告)号：US20150219853A1

公开(公告)日：2015-08-06

申请号：US14615942

申请日：2015-02-06

Applicant: Skorpios Technologies, Inc.

Inventor： Nikhil Kumar ,  Guoliang Li ,  Stephen Krauslick

IPC: G02B6/30

CPC classification number: G02B6/305

Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.

Abstract translation: 波导耦合器具有用于在硅波导和光纤之间耦合光的压缩区域和扩展区域。 压缩区域接收来自硅波导的光并压缩光的光学模式。 光从压缩区域传输到扩展区域。 膨胀区域使光线扩展成具有较大的横截面。 光然后传输到光纤。

公开(公告)号：US20150098676A1

公开(公告)日：2015-04-09

申请号：US14509914

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/122

CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 芯片III-V材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层在平台上密封芯片。

公开(公告)号：US08942516B2

公开(公告)日：2015-01-27

申请号：US13838596

申请日：2013-03-15

Applicant: Skorpios Technologies, Inc.

Inventor： Lina He ,  Amit Mizrahi

IPC: G02F1/01 ,  G02F1/095 ,  G02F1/313 ,  G02B6/27

CPC classification number: G02F1/2257 ,  G02B6/2746 ,  G02B27/4244 ,  G02F1/0955 ,  G02F1/3136 ,  G02F2001/212

Abstract: An optical circulator includes a first optical isolator including a first port and a second port and a plurality of optical isolators coupled to the second port of the first optical isolator. Each of the plurality of optical isolators comprise a first port and a second port.

Abstract translation: 光环行器包括第一光隔离器，其包括第一端口和第二端口以及耦合到第一光隔离器的第二端口的多个光隔离器。 多个光隔离器中的每一个包括第一端口和第二端口。

公开(公告)号：US20140342500A1

公开(公告)日：2014-11-20

申请号：US14245191

申请日：2014-04-04

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/00 ,  H01L21/78 ,  H01L31/18

CPC classification number: H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

Abstract: A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

Abstract translation: 制造复合半导体结构的方法包括提供包括多个器件的衬底并提供包括多个光子器件的化合物半导体衬底。 该方法还包括切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供组装衬底，将多个光子模具安装在组装衬底的预定部分上，对准衬底和组装衬底，将衬底和组件衬底接合以形成复合衬底结构，并且移除至少一个 从组合衬底结构的组装衬底的一部分。

公开(公告)号：US08735191B2

公开(公告)日：2014-05-27

申请号：US13733337

申请日：2013-01-03

Applicant: Skorpios Technologies, Inc.

Inventor： Elton Marchena

IPC: H01L21/00

CPC classification number: H01L21/8258 ,  G02B6/13 ,  H01L21/76251 ,  H01L31/18 ,  H01L33/005 ,  H01S5/0215 ,  H01S5/3013

Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

Abstract translation: 制造复合半导体结构的方法包括提供包括第一材料并具有第一表面的第一基板，并且形成沿垂直于第一表面的方向延伸到预定高度的多个基座。 该方法还包括将包括第二材料的多个元件附接到多个基座中的每一个，从而提供其上设置有一个或多个结构的第二基板，以及对准第一基板和第二基板。 该方法还包括接合第一基板和第二基板以形成复合基板结构，并从复合基板结构去除第一基板的至少一部分。

公开(公告)号：US08722464B2

公开(公告)日：2014-05-13

申请号：US13869408

申请日：2013-04-24

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: H01L21/00

CPC classification number: H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

Abstract: A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

Abstract translation: 制造复合半导体结构的方法包括提供包括多个器件的衬底并提供包括多个光子器件的化合物半导体衬底。 该方法还包括切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供组装衬底，将多个光子模具安装在组装衬底的预定部分上，对准衬底和组装衬底，将衬底和组件衬底接合以形成复合衬底结构，并且移除至少一个 从组合衬底结构的组装衬底的一部分。