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公开(公告)号：KR1020070062082A
公开(公告)日：2007-06-15
申请号：KR1020050121788
申请日：2005-12-12
Applicant: 삼성전자주식회사
IPC: H01R33/76 , H01R13/639 , H01R12/51
Abstract: A combined structure of a semiconductor package insert and a test socket is provided to stably support even a semiconductor package having a narrow support region. A combined structure(300) of a semiconductor package insert and a test socket includes an insert(100) and a test socket(200). The insert includes an insert body(110) having a pocket(112) formed at the center thereof and a latch protruded from the bottom face of the pocket to the inside of the pocket. A semiconductor packet(310) is accommodated in the pocket, and the latch supports the bottom face of the semiconductor package accommodated in the pocket. The test socket is combined with the bottom of the insert and electrically connected to an external connecting terminal(311) of the semiconductor package accommodated in the pocket. When the latch is moved to the outside of the pocket in the event of combination of the insert and the test socket, the semiconductor package passes through the bottom face of the pocket and is mounted on the test socket.
Abstract translation: 提供半导体封装插入件和测试插座的组合结构，以稳定地支撑具有窄支撑区域的半导体封装。 半导体封装插入件和测试插座的组合结构（300）包括插入件（100）和测试插座（200）。 插入件包括插入体（110），该插入体具有形成在其中心处的凹部（112）和从凹部的底面突出到口袋内部的闩锁。 半导体封装（310）容纳在袋中，并且闩锁支撑容纳在口袋中的半导体封装的底面。 测试插座与插入件的底部组合并电连接到容纳在口袋中的半导体封装的外部连接端子（311）。 在插入件和测试插座的组合的情况下，当闩锁移动到口袋的外部时，半导体封装穿过口袋的底面并安装在测试插座上。
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