METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS
    201.
    发明申请
    METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS 有权
    用于监视和控制RF信号的电路的单片集成方法和系统

    公开(公告)号:US20140037286A1

    公开(公告)日:2014-02-06

    申请号:US13959107

    申请日:2013-08-05

    Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

    Abstract translation: 一种操作BPSK调制器的方法包括在BPSK调制器处接收RF信号,并将RF信号分成第一部分和相对于第一部分反相的第二部分。 该方法还包括在BPSK调制器的第一臂处接收第一部分,在BPSK调制器的第二臂处接收第二部分,向BPSK调制器的第一臂应用第一音调,并向第 BPSK调制器的第二臂。 该方法还包括测量与BPSK调制器的输出相关联的功率,并且响应于测量的功率调整施加到BPSK调制器的第一臂或BPSK调制器的第二臂中的至少一个的相位。

    OPTICAL FIBER CONNECTION ARCHITECTURE
    202.
    发明申请
    OPTICAL FIBER CONNECTION ARCHITECTURE 审中-公开
    光纤连接架构

    公开(公告)号:US20130230285A1

    公开(公告)日:2013-09-05

    申请号:US13767310

    申请日:2013-02-14

    CPC classification number: G02B6/4248 G02B6/421 G02B6/4292

    Abstract: An optical fiber package includes a housing having a plurality of walls. One of the walls includes a via passing therethrough. The optical fiber package also includes an optical fiber mounted in the housing and extending through at least a portion of the via and a connector. The connector has a first portion mounted in the via. The optical fiber passes through the first portion. The connector also has a second portion extending outside the housing and including a collar operable to receive a male protrusion of an external fiber.

    Abstract translation: 光纤封装包括具有多个壁的壳体。 其中一个墙壁包括穿过其中的通孔。 光纤封装还包括安装在壳体中并延伸穿过通孔的至少一部分的光纤和连接器。 连接器具有安装在通孔中的第一部分。 光纤通过第一部分。 连接器还具有延伸到壳体外部的第二部分,并且包括可操作以容纳外部光纤的阳突起的套环。

    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS
    203.
    发明申请
    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS 有权
    使用PEDESTALS模板辅助波形粘结的方法和系统

    公开(公告)号:US20130189804A1

    公开(公告)日:2013-07-25

    申请号:US13733337

    申请日:2013-01-03

    Inventor: Elton Marchena

    Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括第一材料并具有第一表面的第一基板,并且形成沿垂直于第一表面的方向延伸到预定高度的多个基座。 该方法还包括将包括第二材料的多个元件附接到多个基座中的每一个,从而提供其上设置有一个或多个结构的第二基板,以及对准第一基板和第二基板。 该方法还包括接合第一基板和第二基板以形成复合基板结构,并从复合基板结构去除第一基板的至少一部分。

    ETCHED FACET IN A MULTI QUANTUM WELL STRUCTURE
    206.
    发明公开

    公开(公告)号:US20230358951A1

    公开(公告)日:2023-11-09

    申请号:US18179167

    申请日:2023-03-06

    Abstract: An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.

    Optical bandpass filter based on reflective devices

    公开(公告)号:US11675134B1

    公开(公告)日:2023-06-13

    申请号:US17306801

    申请日:2021-05-03

    CPC classification number: G02B6/29389 G02B6/2931 G02B6/29346 G02B6/29395

    Abstract: An optical bandpass filter includes an optical splitter having at least four ports, one of the ports being designated as an input port and one of the ports being designated as an output port. First and second reflectors couple with respective third and fourth ones of the ports. The splitter directs portions of the input light from the input port, into the third and fourth ports, such that the portions of the input light propagate toward the respective first and second reflectors. The first and second reflectors reflect light having wavelengths within a predetermined wavelength range, back toward the splitter, as wavelength-selected light, and transmit light having wavelengths that are outside of the predetermined wavelength range, away from the splitter. The splitter directs at least a portion of the wavelength-selected light that propagates back toward the splitter, into the output port, as output light.

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