WEATHERING-RESISTANT STYRENE COPOLYMER MOLDING COMPOSITIONS WITH REDUCED MOLD DEPOSIT FORMATION FOR HIGH GLOSS APPLICATIONS

    公开(公告)号:US20240026146A1

    公开(公告)日:2024-01-25

    申请号:US17768045

    申请日:2020-10-13

    Abstract: The invention relates to a molding composition (P) comprising: (A) 81.7 to 99.4 wt.-% of at least one thermoplastic polymer composition (A); (B) at least one hindered amine light stabilizing composition (B) comprising: (B-1) 0.1 to 0.9 wt.-% of a hindered amine light stabilizer mixture having a monopiperidine structure, (B-2) 0 to 0.4 wt.-% of at least one hindered amine light stabilizer having a dipiperidine structure with at least one alkyl group at each of the 2 and 6 positions of the dipiperidine structure and (B-3) 0.5 to 2 wt. -% of at least one hindered amine light stabilizer having a polymeric structure comprising piperidine groups (C) 0 to 10 wt.-% of one or more colorants, dyes and/or pigments (C); and (D) 0 to 5 wt.-%, based on the total weight of the molding composition (P), of one or more further additives (D); wherein constituents (A) to (D) sum up to 100 wt.-% of molding composition (P).

    Curable composition, cured product and laminate

    公开(公告)号:US11851557B2

    公开(公告)日:2023-12-26

    申请号:US16778050

    申请日:2020-01-31

    Applicant: AGC Inc.

    CPC classification number: C08L33/08 C08L33/14 C08L2201/08

    Abstract: To provide a curable composition being excellent in curability and being capable of forming a cured product which is excellent in heat resistance, which is excellent in adhesion to an inorganic substrate or an inorganic compound layer, and which is hardly peeled even when exposed to a high temperature/high humidity environment for a long time, a cured product formed by curing the curable composition, and a laminate.
    A curable composition comprising specific metal oxide fine particles A, a specific (meth)acrylate B, a specific antioxidant, an organopolysiloxane and a radical polymerization initiator, which may further contain a specific epoxy (meth)acrylate C, and which may further contain a specific urethane (meth)acrylate D. A cured product formed by curing the curable composition, and a laminate having the cured product.

    POLYAMIDE AND MOLDED BODY AND FILM OBTAINED FROM THE SAME AND METHOD FOR PRODUCING THE POLYAMIDE

    公开(公告)号:US20230331987A1

    公开(公告)日:2023-10-19

    申请号:US18021689

    申请日:2021-09-13

    Applicant: UNITIKA LTD.

    CPC classification number: C08L77/10 C08G69/265 C08L2203/16 C08L2201/08

    Abstract: The present invention provides a polyamide and a polyamide film which are more sufficiently superior in all of heat-resisting properties, flexibility properties and rubber elastic properties. The present invention relates to a polyamide comprising a unit comprised of an aliphatic dicarboxylic acid (A) having 18 or more carbon atoms, a unit comprised of an aliphatic diamine (B) having 18 or more carbon atoms, a unit comprised of an aromatic dicarboxylic acid (C) having 12 or less carbon atoms and a unit comprised of an aliphatic diamine (D) having 12 or less carbon atoms, wherein the polyamide has a melting point of 240° C. or more, a crystalline melting enthalpy of 20 J/g or more and an elongation recovery rate of 50% or more in a hysteresis test, and a polyamide film comprising the polyamide.

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