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公开(公告)号:US20180356596A1
公开(公告)日:2018-12-13
申请号:US15914247
申请日:2018-03-07
Applicant: Skorpios Technologies, Inc.
Inventor: Nikhil Kumar , Guoliang Li , Stephen Krasulick
IPC: G02B6/30
CPC classification number: G02B6/305
Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.
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公开(公告)号:US20180348432A1
公开(公告)日:2018-12-06
申请号:US15968454
申请日:2018-05-01
Applicant: Skorpios Technologies, Inc.
Inventor: Damien Lambert , Guoliang Li , John Zyskind , Stephen B. Krasulick
Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.
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公开(公告)号:US10132996B2
公开(公告)日:2018-11-20
申请号:US15133920
申请日:2016-04-20
Applicant: Skorpios Technologies, Inc.
Inventor: Damien Lambert
Abstract: A method forms a vertical output coupler for a waveguide, formed of waveguide material and disposed within a layer stack on a top surface of a wafer. The method includes etching through a portion of the wafer to form a via that exposes the waveguide material, and etching the waveguide material to remove at least a first portion of the waveguide. The etching forms a tilted plane in the waveguide material. The method further includes coating the first tilted plane with one or more reflective layers, to form a tilted mirror in contact with the first tilted plane in the waveguide material. The tilted mirror forms the vertical output coupler such that light propagating through the waveguide is deflected by the tilted mirror, and exits the waveguide.
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公开(公告)号:US09977188B2
公开(公告)日:2018-05-22
申请号:US15051348
申请日:2016-02-23
Applicant: Skorpios Technologies, Inc.
Inventor: Damien Lambert , Guoliang Li , John Zyskind , Stephen B. Krasulick
CPC classification number: G02B6/14 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/305 , G02B2006/12061 , G02B2006/12097 , G02B2006/12152
Abstract: A method of fabricating a waveguide mode expander includes providing a substrate including a waveguide, bonding a chiplet including multiple optical material layers in a mounting region adjacent an output end of the waveguide, and selectively removing portions of the chiplet to form tapered stages that successively increase in number and lateral size from a proximal end to a distal end of the chiplet. The first optical material layer supports an input mode substantially the same size as a mode exiting the waveguide. One or more of the overlying layers, when combined with the first layer, support a larger, output optical mode size. Each tapered stage of the mode expander is formed of a portion of a respective layer of the chiplet. The first layer and the tapered stages form a waveguide mode expander that expands an optical mode of light traversing the chiplet.
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公开(公告)号:US20180123318A1
公开(公告)日:2018-05-03
申请号:US15685866
申请日:2017-08-24
Applicant: Skorpios Technologies, Inc.
Inventor: Hacene Chaouch , Guoliang Li
IPC: H01S5/12 , H01S5/30 , H01S5/14 , G02B6/125 , H01S3/03 , H01S3/063 , H01S5/0683 , H01S5/06 , H01S5/02 , H01S3/1055 , H01S3/10 , H01S3/08 , H01S3/067 , G02B6/12 , H01S5/10 , G02B6/122
CPC classification number: H01S3/1003 , G02B6/1228 , G02B6/125 , G02B2006/12097 , G02B2006/12147 , H01S3/0315 , H01S3/063 , H01S3/0635 , H01S3/0675 , H01S3/08009 , H01S3/1055 , H01S5/021 , H01S5/0612 , H01S5/0683 , H01S5/1032 , H01S5/12 , H01S5/1218 , H01S5/1234 , H01S5/141 , H01S5/3013
Abstract: A tunable laser has a first mirror, a second mirror, a gain medium, and a directional coupler. The first mirror and the second mirror form an optical resonator. The gain medium and the directional coupler are, at least partially, in an optical path of the optical resonator. The first mirror and the second mirror comprise binary super gratings. Both the first mirror and the second mirror have high reflectivity. The directional coupler provides an output coupler for the tunable laser.
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公开(公告)号:US09933575B2
公开(公告)日:2018-04-03
申请号:US15485858
申请日:2017-04-12
Applicant: Skorpios Technologies, Inc.
Inventor: Nikhil Kumar , Guoliang Li , Stephen Krasulick
IPC: G02B6/30
CPC classification number: G02B6/305
Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.
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公开(公告)号:US20170351028A1
公开(公告)日:2017-12-07
申请号:US15487918
申请日:2017-04-14
Applicant: Skorpios Technologies, Inc.
Inventor: Guoliang Li , Damien Lambert , Nikhil Kumar
CPC classification number: G02B6/14 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/305 , G02B2006/12038 , G02B2006/12061 , G02B2006/12097 , G02B2006/12147 , G02B2006/12152
Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
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公开(公告)号:US09829630B2
公开(公告)日:2017-11-28
申请号:US14806270
申请日:2015-07-22
Applicant: Skorpios Technologies, Inc.
Inventor: Derek Van Orden , Amit Mizrahi , Timothy Creazzo , Stephen B. Krasulick
IPC: G02B6/12 , G02B6/125 , G02F1/225 , G02F1/025 , H01S3/08 , H01S5/40 , G02F1/01 , G02B6/293 , G02B6/26 , H01S3/063 , G02F1/21
CPC classification number: G02B6/125 , G02B6/12007 , G02B6/26 , G02B6/29337 , G02B6/29359 , G02B2006/12104 , G02B2006/1215 , G02F1/011 , G02F1/0147 , G02F1/225 , G02F2001/213 , H01S3/0637 , H01S3/08027 , H01S5/4068
Abstract: A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structure further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors.
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公开(公告)号:US20170230117A1
公开(公告)日:2017-08-10
申请号:US15426823
申请日:2017-02-07
Applicant: Skorpios Technologies, Inc.
Inventor: Guoliang Li , Stephen B. Krasulick , Samir Desai
Abstract: A 400 Gb/s transmitter is integrated on a silicon substrate. The transmitter uses four gain chips, sixteen lasers, four modulators to modulate the sixteen lasers at 25 Gb/s, and four multiplexers to produce four optical outputs. Each optical output can transmit at 100 Gb/s to produce a 400 Gb/s transmitter. Other variations are also described.
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公开(公告)号:US20170227709A1
公开(公告)日:2017-08-10
申请号:US15426366
申请日:2017-02-07
Applicant: Skorpios Technologies, Inc.
Inventor: Damien Lambert
CPC classification number: G02B6/12002 , G02B6/12004 , G02B6/12007 , G02B6/122 , G02B6/136 , G02B2006/12061 , G02B2006/12104 , G02B2006/12121 , G02B2006/12142 , G02B2006/12147 , H01S5/0202 , H01S5/021 , H01S5/02252 , H01S5/026 , H01S5/028 , H01S5/22 , H01S5/3013 , H01S5/343 , H01S5/4025 , H01S5/4087 , H04B10/505 , H04J14/02
Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.
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