INTEGRATED CIRCUIT COMPRISING A MOS TRANSISTOR HAVING A SIGMOID RESPONSE AND CORRESPONDING METHOD OF FABRICATION
    221.
    发明申请
    INTEGRATED CIRCUIT COMPRISING A MOS TRANSISTOR HAVING A SIGMOID RESPONSE AND CORRESPONDING METHOD OF FABRICATION 有权
    包含具有SIGMOID响应的MOS晶体管的集成电路和相应的制造方法

    公开(公告)号:US20140124866A1

    公开(公告)日:2014-05-08

    申请号:US13853111

    申请日:2013-03-29

    Abstract: An integrated circuit may include at least one MOS transistor having a sigmoid response. The at least one MOS transistor may include a substrate, a source region, a drain region, a gate region, and insulating spacer regions on either side of the gate region. The substrate may include a first region situated under the gate region between the insulating spacer regions. At least one of the source and drain regions may be separated from the first region of the substrate by a second region of the substrate situated under an insulating spacer region, which may be of a same type of conductivity as the first region of the substrate.

    Abstract translation: 集成电路可以包括具有S形响应的至少一个MOS晶体管。 至少一个MOS晶体管可以包括栅极区域的任一侧上的衬底,源极区域,漏极区域,栅极区域和绝缘间隔区域。 衬底可以包括位于绝缘间隔区之间的栅极区域下方的第一区域。 源极和漏极区域中的至少一个可以通过位于绝缘间隔区域下方的衬底的第二区域与衬底的第一区域分离,绝缘间隔区域可以具有与衬底的第一区域相同类型的导电性。

    SEMICONDUCTOR DEVICE COMPRISING AN INTEGRATED CAPACITOR AND METHOD OF FABRICATION
    222.
    发明申请
    SEMICONDUCTOR DEVICE COMPRISING AN INTEGRATED CAPACITOR AND METHOD OF FABRICATION 有权
    包含集成电容器的半导体器件和制造方法

    公开(公告)号:US20140015102A1

    公开(公告)日:2014-01-16

    申请号:US13935813

    申请日:2013-07-05

    CPC classification number: H01L28/92 H01L27/0207 H01L27/0805 H01L28/91

    Abstract: A semiconductor device includes a substrate wafer and having a front face and a back face. A front hole is formed in the front face and a multilayer capacitor is formed in the front hole. A back hole is formed in the back face of the substrate wafer to expose at least a portion of the multilayer capacitor. A front electrical connection on the front face and a back electrical connection in the back hole are used to make electrical connection to first and second conductive plates of the multilayer capacitor which are separated by a dielectric layer. The front hole may have a cylindrical shape or an annular shape.

    Abstract translation: 半导体器件包括具有正面和背面的衬底晶片。 在前面形成有前孔,在前孔中形成有层叠电容器。 在基板晶片的背面形成有后孔,露出至少一部分多层电容器。 使用前表面上的前电连接和后孔中的背电连接来与层叠电容器的由电介质层隔开的第一和第二导电板电连接。 前孔可以具有圆柱形或环形。

    IMAGE SENSOR WITH A CURVED SURFACE
    223.
    发明申请
    IMAGE SENSOR WITH A CURVED SURFACE 有权
    具有弯曲表面的图像传感器

    公开(公告)号:US20140004644A1

    公开(公告)日:2014-01-02

    申请号:US13858481

    申请日:2013-04-08

    CPC classification number: H01L31/18 H01L27/14605

    Abstract: A method for manufacturing an image sensor, including the successive steps of: forming columns of a semiconductor material; forming one or several pixels at a first end of each of the columns; and deforming the structure so that the second ends of each of the columns come closer to each other or draw away from each other to form a surface in the shape of a polyhedral cap.

    Abstract translation: 一种用于制造图像传感器的方法,包括以下连续步骤:形成半导体材料的列; 在每个列的第一端形成一个或几个像素; 并且使结构变形,使得每个柱的第二端彼此靠近或彼此拉开,以形成多面体盖的形状的表面。

    3D INTEGRATED CIRCUIT
    224.
    发明申请
    3D INTEGRATED CIRCUIT 有权
    3D集成电路

    公开(公告)号:US20130193550A1

    公开(公告)日:2013-08-01

    申请号:US13751489

    申请日:2013-01-28

    Abstract: A method for manufacturing an integrated circuit, including the steps of forming first transistors on a first semiconductor layer; depositing a first insulating layer above the first semiconductor layer and the first transistors, and leveling the first insulating layer; depositing a conductive layer above the first insulating layer, and covering the conductive layer with a second insulating layer; bonding a semiconductor wafer to the second insulating layer; thinning the semiconductor wafer to obtain a second semiconductor layer; and forming second transistors on the second semiconductor layer.

    Abstract translation: 一种用于制造集成电路的方法,包括以下步骤:在第一半导体层上形成第一晶体管; 在所述第一半导体层和所述第一晶体管之上沉积第一绝缘层,以及对所述第一绝缘层进行调平; 在第一绝缘层上方沉积导电层,并用第二绝缘层覆盖导电层; 将半导体晶片接合到所述第二绝缘层; 使半导体晶片变薄以获得第二半导体层; 以及在所述第二半导体层上形成第二晶体管。

    COMPACT ELECTRONIC DEVICE FOR PROTECTING FROM ELECTROSTATIC DISCHARGE
    226.
    发明申请
    COMPACT ELECTRONIC DEVICE FOR PROTECTING FROM ELECTROSTATIC DISCHARGE 有权
    用于保护静电放电的紧凑型电子设备

    公开(公告)号:US20130155558A1

    公开(公告)日:2013-06-20

    申请号:US13705503

    申请日:2012-12-05

    Abstract: A device for protecting a set of N nodes from electrostatic discharges, wherein N is greater than or equal to three, includes a set of N units respectively possessing N first terminals respectively connected to the N nodes and N second terminals connected together to form a common terminal. Each unit includes at least one MOS transistor including a parasitic transistor connected between a pair of the N nodes and configured, in the presence of a current pulse between the pair of nodes, to operate, at least temporarily, in a hybrid mode including MOS-type operation in a sub-threshold mode and operation of the bipolar transistor.

    Abstract translation: 用于保护一组N个节点免受静电放电的装置,其中N大于或等于3,包括分别具有分别连接到N个节点的N个第一终端的N个单元的集合和连接在一起的N个第二终端以形成公共 终奌站。 每个单元包括至少一个MOS晶体管,其包括连接在一对N个节点之间的寄生晶体管,并且在所述一对节点之间存在电流脉冲的情况下,配置为至少临时地以包括MOS- 在亚阈值模式下工作和双极晶体管的工作。

    HARDENED PHOTODIODE IMAGE SENSOR
    227.
    发明申请
    HARDENED PHOTODIODE IMAGE SENSOR 有权
    硬化光电图像传感器

    公开(公告)号:US20130155283A1

    公开(公告)日:2013-06-20

    申请号:US13710260

    申请日:2012-12-10

    Abstract: An image sensor including a pixel array, each pixel including, in a substrate of a doped semiconductor material of a first conductivity type, a first doped region of a second conductivity type at the surface of the substrate; an insulating trench surrounding the first region; a second doped region of the first conductivity type, more heavily doped than the substrate, at the surface of the substrate and surrounding the trench; a third doped region of the second conductivity type, forming with the substrate a photodiode junction, extending in depth into the substrate under the first and second regions and being connected to the first region; and a fourth region, more lightly doped than the second and third regions, interposed between the second and third regions and in contact with the first region and/or with the third region.

    Abstract translation: 一种图像传感器,包括像素阵列,每个像素包括在第一导电类型的掺杂半导体材料的衬底中,在衬底的表面处具有第二导电类型的第一掺杂区域; 围绕所述第一区域的绝缘沟槽; 第一导电类型的第二掺杂区域,在衬底的表面上比衬底更重掺杂并且围绕沟槽; 第二导电类型的第三掺杂区域,与衬底一起形成光电二极管结,在第一和第二区域下方深度延伸到衬底中,并连接到第一区域; 以及介于所述第二和第三区域之间并与所述第一区域和/或与所述第三区域接触的比所述第二和第三区域更轻掺杂的第四区域。

    PROTECTION OF MEMORY AREAS
    228.
    发明申请
    PROTECTION OF MEMORY AREAS 有权
    保护记忆领域

    公开(公告)号:US20130138975A1

    公开(公告)日:2013-05-30

    申请号:US13751628

    申请日:2013-01-28

    Abstract: A method for loading a program, contained in at least a first memory, into a second memory accessible by an execution unit, in which the program is in a cyphered form in the first memory, a circuit for controlling the access to the second memory is configured from program initialization data, instructions of the program, and at least initialization data being decyphered to be transferred into the second memory after configuration of the circuit.

    Abstract translation: 一种用于将包含在至少第一存储器中的程序加载到执行单元可访问的第二存储器中的方法,其中程序处于第一存储器中的加密形式,用于控制对第二存储器的访问的电路是 由程序初始化数据,程序的指令,以及至少初始化数据被解密以在电路配置之后被传送到第二存储器中。

    Electronic component allowing the decoding of satellite digital television signals
    229.
    发明申请
    Electronic component allowing the decoding of satellite digital television signals 有权
    允许对卫星数字电视信号进行解码的电子元件

    公开(公告)号:US20040268396A1

    公开(公告)日:2004-12-30

    申请号:US10814818

    申请日:2004-03-31

    CPC classification number: H04N7/20 H04L27/148

    Abstract: An integrated circuit is embodied on a monolithic substrate and incorporates a tuning module of the direct sampling type that is able to receive satellite digital television analog signals composed of several channels, as well as several channel decoding digital modules connected at the output of the tuning module so as to deliver respectively simultaneously several streams of data packets corresponding to several different selected channels.

    Abstract translation: 集成电路体现在单片基板上,并且包括能够接收由几个通道组成的卫星数字电视模拟信号的直接采样类型的调谐模块,以及连接在调谐模块的输出端的多个通道解码数字模块 以便分别同时传送与若干不同选择的信道相对应的若干数据分组流。

    Process for sampling the signal delivered by an active pixel of an image sensor, and corresponding sensor
    230.
    发明申请
    Process for sampling the signal delivered by an active pixel of an image sensor, and corresponding sensor 审中-公开
    用于对由图像传感器的有源像素传送的信号以及相应的传感器进行采样的过程

    公开(公告)号:US20040263656A1

    公开(公告)日:2004-12-30

    申请号:US10827094

    申请日:2004-04-19

    Inventor: Laurent Simony

    CPC classification number: H04N5/378 H04N5/3575

    Abstract: The sampling of a pixel signal by a sampling capacitor is effectuated by applying to the sampling capacitor a voltage equal to the corresponding pixel voltage minus the value of the gate-source voltage of a follower transistor biased with a predetermined constant bias current for a first predetermined duration so as to obtain for the sampling capacitor a final state of stable charge. The bias current is then interrupted. Lastly, the end of the sampling pulse occurs on completion of a second predetermined duration after the said interruption of the current.

    Abstract translation: 通过对采样电容器施加等于相应像素电压的电压减去以预定的恒定偏置电流偏置的跟随器晶体管的栅极 - 源极电压的值来实现采样电容器的采样电容的第一预定 持续时间,以便为采样电容器获得稳定电荷的最终状态。 然后中断偏置电流。 最后,采样脉冲的结束在所述电流中断之后的第二预定持续时间完成。

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