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公开(公告)号：JP5128095B2
公开(公告)日：2013-01-23
申请号：JP2006228941
申请日：2006-08-25
Applicant: Towa株式会社
Inventor： 裕貴 岡本
CPC classification number: H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
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公开(公告)号：JP5128047B2
公开(公告)日：2013-01-23
申请号：JP2004294980
申请日：2004-10-07
Applicant: Towa株式会社
Inventor： 剛資 芦田
CPC classification number: G02B3/0031 , G02B3/0075 , H01L24/97 , H01L33/58 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12041 , H01L2924/12043 , H01L2924/15787 , H01L2924/00014 , H01L2224/85 , H01L2924/00
Abstract: In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.
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公开(公告)号：JP2012146808A
公开(公告)日：2012-08-02
申请号：JP2011003784
申请日：2011-01-12
Inventor： ONISHI YOHEI
Abstract: PROBLEM TO BE SOLVED: To prevent the overall shape of a sealing resin molding device for electronic components from being enlarged, and to improve quality and productivity of a seal resin molding (resin molded substrate 14) for the electronic components.SOLUTION: At least two sets of resin molds 6 and 7 are vertically and horizontally disposed in series, and tip pressurizing part 17a of a resin pressurizing plunger 17 is fitted into each of resin material supply pots 6f and 7f in the resin molds 6 and 7 in a slidable state from the same direction, and the overall shape of a resin molding device is prevented from being enlarged in the direction of the resin molds 6 and 7 disposed in series. A die opening and closing mechanism of each of the resin molds 6 and 7 can be used for both resin molds by disposing the resin molds 6 and 7 in series, and accordingly, equalization of resin molding conditions such as mold clamping pressure in the resin molds 6 and 7 and resin pressurizing force applied to a resin material can be achieved, and a seal resin molding 14 having equal and high quality for electronic components can be highly efficiently produced.
Abstract translation: 要解决的问题：为了防止电子部件的密封树脂成型装置的整体形状的扩大，并且提高用于电子部件的密封树脂成型（树脂成型基板14）的质量和生产率。 解决方案：至少两组树脂模具6和7被串联地竖直和水平设置，树脂加压柱塞17的末端加压部分17a装配到树脂模具中的每个树脂材料供应罐6f和7f中 6和7处于相同方向的滑动状态，并且防止树脂成型装置的整体形状沿着串联设置的树脂模具6和7的方向扩大。 通过将树脂模6和7串联配置，可以将树脂模6和7的模具开闭机构用于两树脂模具，由此树脂成型条件如树脂模具中的模压力均衡化 6和7以及施加在树脂材料上的树脂加压力可以高效率地生产出具有相同和高品质的密封树脂模制件14。 版权所有（C）2012，JPO＆INPIT
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Patent Agency Ranking226.发明专利
公开(公告)号：JP2012069719A
公开(公告)日：2012-04-05
申请号：JP2010213051
申请日：2010-09-24
Inventor： KO TAKEAKI
IPC: H01L21/56
Abstract: PROBLEM TO BE SOLVED: To provide a resin sealed molding die apparatus for which compression molding and deaeration molding can be carried out in combination and which permits a stroke of a pressure member to be increased at a resin compression time, and an outside air cutoff member for the resin sealed molding die apparatus.SOLUTION: A resin sealed molding die apparatus 10 includes an outside air cutoff member 16 for forming a sealed space around the periphery of a lower die 12, which is divided into an outer cylinder 161 and an inner cylinder 162, the two of which are slid each other in a vertical direction to change the height of the outside air cutoff member 16. Therefore, the resin sealed molding die apparatus 10 allows the height of the outside air cutoff member 16 to be changed according to the movement of a pressure member 17 at a resin compression time, thereby making it possible to secure an increased stroke of the pressure member 17 at the resin compression time. As a result, the thickness of a resin mold can be increased.
Abstract translation: 解决的问题：提供一种可以组合进行压缩成型和脱气成型的树脂密封成型模具装置，并且能够在树脂压缩时使压力部件的行程增加，外部 空气切断构件用于树脂密封成型模具装置。 解决方案：树脂密封成型模具装置10包括外部空气切断构件16，用于在被分成外筒161和内筒162的下模12的周围形成密封空间， 它们在垂直方向上彼此滑动以改变外部空气切断构件16的高度。因此，树脂密封成型模具装置10允许外部空气切断构件16的高度根据压力的移动而改变 构件17在树脂压缩时间，从而可以确保压力构件17在树脂压缩时间的行程增加。 结果，可以提高树脂模具的厚度。 版权所有（C）2012，JPO＆INPIT
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227.发明专利Method and apparatus for manufacturing resin encapsulation molded article having substrate exposure face 有权用于制造具有基板曝光面的树脂封装成型品的方法和装置
公开(公告)号：JP2012049414A
公开(公告)日：2012-03-08
申请号：JP2010191721
申请日：2010-08-30
Inventor： TANE YUKITOMO , MIYOSHI YORIYUKI
Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for resin encapsulation molding of a substrate for resin encapsulation molding of an outer surface part of a glass epoxy substrate 11, and in addition, for exposing a part of the substrate outside the resin encapsulation molded article.SOLUTION: Using an apparatus for resin encapsulation molding including die structures 21 and 22 for encapsulation molding of an outer surface part of a substrate 11 with a thermosetting epoxy resin R, the outer surface part of the glass epoxy substrate 11 is molded in a resin encapsulation manner. In addition, a member 23 for preventing resin burr formation is compressively brought into close contact with an exposure face 13 of the substrate in a portion of the die structures 21 and 22 in which part of the substrate is to be exposed outside the resin encapsulation molded article. Also, a resin coating layer 23a is provided at a tip of the member 23 for preventing resin burr formation.
Abstract translation: 要解决的问题：提供一种用于玻璃环氧树脂基板11的外表面部分的树脂封装成型用基板的树脂封装成型的方法和装置，另外，为了使一部分基板外露 树脂封装成型制品。 解决方案：使用包括模具结构21和22的树脂封装模塑装置，用于用热固性环氧树脂R封装模制基板11的外表面部分，将玻璃环氧基板11的外表面部分模制成 树脂封装方式。 此外，用于防止树脂毛刺形成的构件23在模具结构21和22的一部分被暴露在树脂封装模制的外部的部分中被压缩地与基板的曝光面13紧密接触 文章。 此外，树脂涂层23a设置在构件23的尖端处，用于防止树脂毛刺形成。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2012033584A
公开(公告)日：2012-02-16
申请号：JP2010170011
申请日：2010-07-29
Inventor： TAKADA NAOKI
CPC classification number: H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To appropriately preheat a pre-sealing substrate to be disposed on a mold for resin-sealing.SOLUTION: A resin sealing device 1 that resin-seals a chip attached to a pre-sealing substrate 5 includes: molding modules 3A to 3D; a lower mold 10 provided on each of the molding modules 3A to 3D; an upper mold provided to face the lower mold 10; a cavity 11 provided on the lower mold 10 to be filled with a fluid resin; a conveyance mechanism 9 that conveys the pre-sealing substrate 5 to each of the molding modules 3A to 3D; a first heater provided on the conveyance mechanism 9; a transfer mechanism 13 that transfers the pre-sealing substrate 5 received from the conveyance mechanism 9 to above the cavity 11 and delivers the pre-sealing substrate 5 to a mold-surface of the upper mold; and a second heater provided on the transfer mechanism 13. The first heater heats the pre-sealing substrate 5 by a surface during the conveyance of the pre-sealing substrate 5 to each of the molding modules 3A to 3D, and the second heater heats the received pre-sealing substrate 5 by a surface until the delivery to the mold-surface of the upper mold.
Abstract translation: 要解决的问题：适当地预热待设置在用于树脂密封的模具上的预密封基板。 解决方案：树脂密封安装在预密封基板5上的芯片的树脂密封装置1包括：模制模块3A至3D; 设置在每个模制模块3A至3D上的下模具10; 设置成面向下模具10的上模具; 设置在下模具10上以填充流体树脂的空腔11; 输送机构9，其将预密封基板5输送到每个模制模块3A至3D; 设置在输送机构9上的第一加热器; 将从输送机构9接收的预封封基板5转移到空腔11的上方的输送机构13，将预封封基板5输送到上模具的模具表面; 以及设置在传送机构13上的第二加热器。在将预密封基板5传送到每个模制模块3A至3D期间，第一加热器通过表面加热预密封基板5，并且第二加热器加热 通过表面接收预密封基板5，直到输送到上模具的模具表面。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP4855307B2
公开(公告)日：2012-01-18
申请号：JP2007063336
申请日：2007-03-13
Applicant: Towa株式会社
Inventor： 剛 天川
CPC classification number: H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/00014 , H01L2224/85 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To efficiently feed a granular resin material (granular resin) 6 into a lower mold cavity 5 provided in a set of mold 1 (both upper and lower molds 2 and 3) for compression molding for an electronic component. SOLUTION: At first, a required amount of the granular resin 6 is fed into a plate 21 for storing a resin (resin storing part 22), and a release film 11 with a required dimension covers on an opening part 23 side of the plate. The inside of a releasing film-covered plate 21 is set to a required degree of vacuum and the release film 11 covers fixedly on the plate to form a resin-distributed plate 25 and to turn it reversely. Then, the resin-distributed plate 25 turned reversely is transferred to a position of a mold cavity 5 by an in-loader 9. The vacuum condition in this reversely turned plate 25 is released and the releasing film 11 is covered on the inner face of the cavity 5, and the granular resin 6 is made to fall down into the mold cavity 5 covered with the release film 11 from the plate 21. COPYRIGHT: (C)2008,JPO&INPIT
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