公开(公告)号：EP1040492B1

公开(公告)日：2002-03-20

申请号：EP98959979.0

申请日：1998-12-14

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： FOUILLET, Yves

IPC: H01H1/00

CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/016 ,  B81B2201/032 ,  H01G5/16 ,  H01H2001/0042 ,  H01H2037/008 ,  Y10T29/42 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155

公开(公告)号：EP1146533A1

公开(公告)日：2001-10-17

申请号：EP99959908.7

申请日：1999-12-20

Applicant: NEC Corporation

Inventor： SUZUKI, Kenichiro ,  MARUMOTO, Tsunehisa

IPC: H01H59/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: H01H59/0009 ,  B81B2201/014 ,  B81B2201/016 ,  B81C1/0015 ,  B81C2201/0133 ,  H01H1/20

Abstract: A micro-machine switch in accordance with the present invention includes a supporter having a predetermined height relative to a surface of a substrate, a flexible cantilever projecting from the supporter in parallel with a surface of the substrate, and having a distal end facing a gap formed between two signal lines, a contact electrode formed on the cantilever, facing the gap, a lower electrode formed on the substrate in facing relation with a part of the cantilever, and an intermediate electrode formed on the cantilever in facing relation with the lower electrode. The micro-machine switch can operate at a lower drive voltage than a voltage at which a conventional micro-machine switch operates, and can enhance a resistance of an insulating film against a voltage.

Abstract translation: 根据本发明的微型机器开关包括：相对于基板的表面具有预定高度的支撑件，从支撑件平行于基板的表面突出的柔性悬臂，并且具有面向间隙的远端 形成在两个信号线之间，形成在悬臂上的接触电极，面对间隙;与基板的一部分悬臂形成在基板上的下电极，以及形成在悬臂上的中间电极，与下电极 。 微机开关可以在比常规微机开关操作的电压低的驱动电压下工作，并且可以增强绝缘膜对电压的电阻。

公开(公告)号：EP0680064B1

公开(公告)日：1998-01-21

申请号：EP95106102.7

申请日：1995-04-24

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Zettler, Thomas, Dr.

IPC: H01H35/02 ,  H01H1/00

CPC classification number: B81C1/0096 ,  B81B2201/016 ,  B81C1/00142 ,  B81C1/00944 ,  H01H1/0036 ,  H01H35/02

公开(公告)号：EP0680064A2

公开(公告)日：1995-11-02

申请号：EP95106102.7

申请日：1995-04-24

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Zettler, Thomas, Dr.

IPC: H01H35/02 ,  H01H1/00

CPC classification number: B81C1/0096 ,  B81B2201/016 ,  B81C1/00142 ,  B81C1/00944 ,  H01H1/0036 ,  H01H35/02

Abstract: Die Erfindung betrifft ein mikromechanisches Bauteil mit einer festen mikromechanischen Struktur, die mindestens zwei aus einer oder mehreren leitenden Schichten gebildete Elektroden umfaßt, und einer beweglichen mikromechanischen Struktur in einem Hohlraum (H) , die ein leitendes Schaltelement (S) bildet, wobei mithilfe des Schaltelementes ein elektrischer Kontakt zwischen den Elektroden herstellbar ist. Der Hohlraum kann eine z.B. gitterförmige Sicherung gegen Herausfallen des Schaltelementes und/oder einen Verschluß nach oben aufweisen. Die Erfindung betrifft ferner ein Mikrosystem mit einer integrierten Schaltung und dem mikromechanischen Bauteil, sowie Herstellverfahren für das Bauteil und das Mikrosystem. Das Bauteil und die Schaltung können dabei auf sehr einfache Weise gleichzeitig hergestellt werden.

Abstract translation: 微机电部件（BT）具有固定的微机械结构，其包括由一个或多个导电层（3）形成并彼此绝缘的至少两个电极（E）。 它还包括形成导电开关元件（S）的中空空间（H）中的可移动微机械结构。 开关元件（S）能够在电极（E）之间形成电接触。 为了制造部件（BT），首先在基板（1）上形成下绝缘层（2）。 固定（E）和可移动（S）结构然后由一个或多个导电层（3）形成。 这些嵌入在中间绝缘层（4,5）中。 中空空间（H）通过蚀刻而除去开关元件（S）周围的绝缘层（4,5）和至少部分地在每个电极（E）的表面上而形成。

公开(公告)号：US09966194B2

公开(公告)日：2018-05-08

申请号：US15385431

申请日：2016-12-20

Applicant: Texas Instruments Incorporated

Inventor： Arun Gupta ,  William C. McDonald ,  Adam Fruehling ,  Ivan Kmecko ,  Lance Barron ,  Divyanshu Agrawal ,  Arthur M. Turner ,  John C. Ehmke

IPC: H01L27/20 ,  H01L29/84 ,  H01G5/16 ,  H01G5/40 ,  H01G5/011 ,  B81B7/00

CPC classification number: H01G5/16 ,  B81B3/0008 ,  B81B3/001 ,  B81B3/0013 ,  B81B7/0064 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/016 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2203/06 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00158 ,  H01G5/011 ,  H01G5/40

Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.

公开(公告)号：US20170271114A1

公开(公告)日：2017-09-21

申请号：US15073372

申请日：2016-03-17

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： XING LAN ,  Chunbo Zhang

IPC: H01H49/00 ,  H01H59/00 ,  H01H1/00

CPC classification number: H01H59/0009 ,  B81B2201/014 ,  B81B2201/016 ,  B81C1/00373 ,  H01H1/0036 ,  H01H2001/0052 ,  H01H2059/0072

Abstract: A method for fabricating an MEMS switch including providing a substrate and printing at least one metal bias electrode, at least one metal connection pad and at least one metal contact pad on the substrate. The method then prints a sacrificial layer on the substrate and over the at least one bias electrode, and prints a flexible beam structure on the sacrificial layer. The sacrificial layer is then removed by dissolving the sacrificial layer in a wet solution to release the beam structure so that the beam structure is spaced some distance from the at least one bias electrode and the contact pad.

公开(公告)号：US09517930B2

公开(公告)日：2016-12-13

申请号：US14047944

申请日：2014-01-29

Applicant: Maxim Integrated Products, Inc.

Inventor： Gabriele Cazzaniga ,  Luca Coronato ,  Barbara Simoni ,  Luciano Prandi

IPC: H01G5/00 ,  B81C1/00 ,  B81B3/00 ,  H01H1/00

CPC classification number: B81C1/00968 ,  B81B3/001 ,  B81B3/0056 ,  B81B2201/016 ,  H01H1/0036

Abstract: Various embodiments of the invention reduce stiction in a wide range of MEMS devices and increase device reliability without negatively impacting performance. In certain embodiments, stiction recover is accomplished by applying electrostatic forces to electrodes via optimized voltage signals that generate a restoring force that aids in overcoming stiction forces between electrodes. The voltage signals used within a stiction recovery procedure may be static or a dynamic, and may be applied directly to existing electrodes within a MEMS device, thereby, eliminating the need for additional components. In some embodiments, the voltage is estimated or calibrated and swept through a range of frequencies that contains one or more resonant frequencies of the mechanical structure that comprises the parts to be detached.

公开(公告)号：US20160297677A1

公开(公告)日：2016-10-13

申请号：US14916884

申请日：2015-04-23

Applicant: CAVENDISH KINETICS, INC.

Inventor： James Douglas HUFFMAN ,  Cong Quoc KHIEU ,  Robertus Petrus VAN KAMPEN ,  Karl F. SMAYLING ,  Vikram JOSHI

IPC: B81C99/00 ,  H01G5/16

CPC classification number: B81C99/003 ,  B81B2201/016 ,  B81B2207/015 ,  G01R27/2605 ,  H01G5/16 ,  H01L23/5228 ,  H01L29/93

Abstract: The present invention generally relates to a mechanism for testing a MEMS hysteresis. A power management circuit may be coupled to the electrodes that cause the movable plate that is disposed between the electrodes in a MEMS device to move. The power management circuit may utilize a charge pump, a comparator and a resistor ladder.

Abstract translation: 本发明一般涉及一种用于测试MEMS滞后的机构。 功率管理电路可以耦合到电极，其使得设置在MEMS器件中的电极之间的可移动板移动。 电源管理电路可以使用电荷泵，比较器和电阻梯。

公开(公告)号：US20160257556A1

公开(公告)日：2016-09-08

申请号：US15155417

申请日：2016-05-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Christopher V. JAHNES ,  Anthony K. STAMPER

IPC: B81B3/00 ,  H01H59/00

CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B7/0006 ,  B81B2201/016 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00293 ,  B81C2203/0145 ,  G06F17/5045 ,  G06F17/5068 ,  H01H1/0036 ,  H01H2001/0057 ,  Y10T29/49121

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

公开(公告)号：US09120667B2

公开(公告)日：2015-09-01

申请号：US13164331

申请日：2011-06-20

Applicant: Christopher V. Jahnes ,  Anthony K. Stamper

Inventor： Christopher V. Jahnes ,  Anthony K. Stamper

IPC: H02N1/00 ,  B81B3/00 ,  H05K13/00

CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B7/0006 ,  B81B2201/016 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00293 ,  B81C2203/0145 ,  G06F17/5045 ,  G06F17/5068 ,  H01H1/0036 ,  H01H2001/0057 ,  Y10T29/49121

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 形成MEMS结构的方法包括在基板上形成固定的致动器电极和接触点。 该方法还包括在固定的致动器电极和接触点上形成MEMS光束。 该方法还包括形成与固定致动器电极的部分对准的致动器电极阵列，其尺寸和尺寸被设计成防止MEMS光束在重复循环之后塌陷在固定的致动器电极上。 致动器电极阵列形成为与MEMS光束的下侧和固定的致动器电极的表面中的至少一个直接接触。