Abstract:
A semiconductor device is provided that includes a semiconductor channel region extending above a semiconductor substrate in a longitudinal direction between a semiconductor source region and a semiconductor drain region, and a gate region extending in the transverse direction, coating the channel region, and insulated from the channel region. The source, channel, and drain regions are formed in a continuous semiconductor layer that is approximately plane and parallel to the upper surface of the substrate. Additionally, the source, drain, and gate regions are coated in an insulating coating so as to provide electrical insulation between the gate region and the source and drain regions, and between the substrate and the source, drain, gate, and channel regions. Also provided is an integrated circuit that includes such a semiconductor device, and a method for manufacturing such a semiconductor device.
Abstract:
A calibration device for a video circuit input stage comprises an analog-to-digital converter and an input capacitor constantly discharged by a power source and recharged by a charging circuit by means of a first and a second charging current. The charging circuit is controlled by a central processing unit receiving an estimate of the variation between the converter's output code and a clamp value.
Abstract:
A demodulator for an amplitude modulated alternating signal includes a peak detection circuit for extracting the reference modulating signal from the amplitude modulated alternating signal, and a first translation circuit for offsetting the level of the reference modulating signal by a value equal to the DC component to obtain an offset reference modulated signal. A comparison threshold generator circuit generates a comparison threshold to locate the start and the end of the modulation, and a comparator circuit compares the offset reference modulating signal with the comparison threshold for providing signals that cross the comparison threshold. An unregulated supply circuit provides a supply voltage to the different circuits.
Abstract:
The fabrication of an integrated circuit includes a first phase of producing an electronic chip and a second phase of producing at least one auxiliary component placed above the chip and of producing a protective cover which covers the auxiliary component. The first phase of producing the chip is effected from a first semiconductor substrate and comprises the formation of a cavity lying in a chosen region of the chip and emerging at the upper surface of the chip. The second production phase includes the production of the auxiliary component from a second semiconductor substrate, separate from the first, and then the placement in the cavity of the auxiliary component supported by the second substrate and the mutual adhesion of the second substrate to the upper surface of the chip lying outside the cavity. The second substrate then also forms the protective cover.
Abstract:
A receiver of a frequency-modulated signal representing a digital signal includes a down conversion unit or frequency translation unit to lower the frequency of the frequency-modulated signal and a digital demodulator to regenerate the digital signal from the lowered-frequency signal. The receiver furthermore includes a counter circuit to determine the number of periods of a reference signal from the frequency translation unit during a period of the lowered-frequency signal. The digital demodulator includes a computer unit to compute the period of the lowered-frequency signal from the number of periods of the reference signal.
Abstract:
A method for defining, on the upper surface of a substrate, two self-aligned areas, including the steps of depositing a protective layer; depositing a covering layer; opening the protective and covering layers at a location substantially corresponding to the desired border of the two areas; forming a spacer along the side of the opening, this spacer having a rear portion against said border and an opposite front portion; opening the protective and covering layers behind the rear portion of the spacer; and removing the protection layer to reach the rear portion of the spacer; whereby two self-aligned areas are defined on either side of the spacer length.
Abstract:
The present invention relates to a read amplifier (SA2) comprising a read stage (RDST), a reference stage (RFST) and a differential output stage comprising PMOS and NMOS type transistors. According to the present invention, the transistors of the differential stage (DIFST2) comprise only one PMOS transistor (TP3) and one NMOS transistor (TN3) in series, the PMOS transistor (TP3) having its gate linked to one node of the read stage (RDST), the NMOS transistor (TN3) having its gate linked to one node of the reference stage (RFST), the mid-point of the PMOS and NMOS transistors of the differential stage forming a data output node (DATAOUT) of the read amplifier. The read amplifier according to the present invention has the combined advantages of a short read time and a low electrical consumption. Application to EPROM, EEPROM and FLASH type non-volatile memories.
Abstract:
An electrically erasable and programmable memory (EEPROM) includes a memory array containing memory cells connected to word lines arranged in rows and to bit lines arranged in columns. The memory array includes a first special zone for storing special bits of a first type, and a second special zone for storing special bits of a second type. The first special zone includes a first row of memory cells connected to a first word line, wherein N1 memory cells are connected to N1 bit lines of a determined column of the memory array. The second special zone includes a second row of memory cells connected to a second word line, wherein N2 memory cells are connected to N2 other bit lines of the determined column. The N1 bit lines are not connected to the second row of memory cells, and the N2 bit lines are not connected to the first row of memory cells.
Abstract:
A class AB amplifier circuit includes a complementary output stage and a biasing circuit for biasing the output stage. The complementary output stage includes a P-type MOS transistor and an N-type MOS transistor, and the biasing circuit includes a bipolar transistor. The emitter and collector of the bipolar transistor are respectively connected to the gates of the P-type and N-type MOS transistors. The bipolar transistor is biased for controlling a bias voltage between the respective gates of the P-type and N-type MOS transistors.
Abstract:
The FAMOS memory location comprises a single floating gate (GR) overlapping an active surface of a semiconductor substrate according to at least two asymmetrical overlap profiles (PF1, PF2) so as to define at least two electrodes in the active region. Memory location programming means (MC, SW) are capable of selectively applying different predetermined sets of bias voltages to the electrodes so as to confer at least three programming logic levels on the memory location.