Abstract:
A low voltage isolation switch (1) is described, inserted between an input terminal (HVout) suitable for receiving a high voltage signal (IM) and an output terminal (pzt) suitable for transmitting this high voltage signal (IM) to a load (PZ) of the type comprising at least one driving block (5) being inserted between a first and a second voltage reference (Vss, -Vss) and comprising a first driving transistor (M1), inserted, in series to a first driving diode (D1), between the first voltage reference (Vss) and a first driving central circuit node (Xd) and a second driving transistor (M2), in turn inserted, in series with a second driving diode (D2), between the driving central circuit node (Xd) and the second supply voltage reference (-Vss) as well as a control transistor (MD) connected across a diode block (7) comprising at least one first and one second transmission diode (DN1, DN2), connected in antiparallel, i.e. by having the anode terminal of the first diode connected to the cathode terminal of the second one and vice versa, between the input (HVout) and output (pzt) terminals of the low voltage isolation switch (1), this control transistor (MD) having a control terminal connected to the driving central circuit node (Xd) through a low voltage decoupling block (6), in turn inserted between a first and a second substrate terminal (SS1, SS2) and also comprising a first and a second parasite capacitive element (Par1, Par2) connected to these first and second substrate terminals (SS1, SS2) as well as comprising at least one first decoupling transistor (M3) and one second decoupling transistor inserted (M4), being in parallel to each other and having control terminals connected to the first and second parasite capacitive elements (Par1, Par2), respectively.
Abstract:
Bistable carbazole compounds of formula (I) are described, wherein M is Fe, Co, Ru or Os, preferably Fe, useful as basic functional units for computing systems based on the QCA (Quantum Cellular Automata) paradigm; a process for their preparation is also described.
Abstract:
An integrated buffer device (2) for a switched capacity circuit is described, comprising: - a buffer (7) having an output (OUT) for an output voltage dependent upon an input voltage (VIN) that can be supplied by a source (1) to the buffer device; - a capacitative switching component (C I ) that can be switched between a first and second condition in which it is connected, respectively, to the source and to the buffer to transfer the input voltage onto the output; said component being provided with a terminal (N2) having an associated stray capacity (C pi ). The device also comprises a charging and discharging device (SW CPIR , SW G ) configured to pre- charge the stray capacity at a reference voltage (REFM) before taking up the second condition and to pre-discharge the stray capacity before taking up the first condition.
Abstract:
In a microfluidic assembly (20), a microfluidic device (I1) is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (I1) . The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10')/ adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.
Abstract:
Described herein is a process for manufacturing an interaction structure for a storage medium, which envisages forming a first interaction head provided with a first conductive region having a sub-lithographic smaller dimension (W 1 ). The step of forming a first interaction head (7) envisages: forming on a surface (14) a first delimitation region (15) having a side wall; depositing a conductive portion (16b) having a deposition thickness substantially matching the sub- lithographic smaller dimension (W 1 ) on the side wall; and then defining the conductive portion. The sub- lithographic smaller dimension (W 1 ) is between 1 and 50 nm, preferably 20 nm.
Abstract:
An optical apparatus for the inspection of nucleic acid probes includes: a holder (22) for housing a chip (1) for analysis of nucleic acids, containing nucleic acid probes (12, 12' ); a light (24), for supplying an excitation radiation (WE) to the holder (22); and an optical sensor (25) for detecting images (IMG) of the nucleic acid probes (12, 12'), when a chip (1) is housed in the holder (22). The light source (24) is configured for polarizing the excitation radiation (WE) according to a excitation polarization direction (DE). Furthermore, the apparatus is provided with a sensing polarizing filter (27), which is arranged so as to intercept a reflected portion (WR) of the excitation radiation (WE), directed towards the optical sensor (25). The sensing polarizing filter (27) has a direction of the sensing polarization (D3) transverse to the excitation polarization direction (DE).
Abstract:
Method for manufacturing a vertical power MOS transistor on a semiconductor substrate (10) with wide band gap comprising a first superficial semiconductor layer (11) with wide band gap of a first type of conductivity, comprising the steps of: forming trench regions (13) in the first superficial semiconductor layer (H), filling in said trench regions (13) by means of a second semiconductor layer (14) with wide band gap of a second type of conductivity, so as to form semiconductor portions (15) of the second type of conductivity contained in the first superficial semiconductor layer (11), carrying out at least one ion implantation of a first type of dopant in the semiconductor portions (15) for forming respective implanted body regions (19) of said second type of conductivity, carrying out at least one ion implantation of a second type of dopant in each of the implanted body regions (19) for forming at least one implanted source region (23) of the first type of conductivity inside the implanted body regions (19), carrying out an activation thermal process of the first and second type of dopant with low thermal budget suitable to complete said formation of the implanted body and source regions (19, 23).
Abstract:
Process for manufacturing a power electronic device (30) comprising the following steps: forming a first semiconductor layer (21) of the first type of conductivity forming at least a second semiconductor layer (22) of a second type of conductivity value on the first semiconductor layer (21), forming, in this at least a second semiconductor layer (22), a first plurality of implanted regions (D1) of the first type of conductivity forming, above said at least a second semiconductor layer (22), a superficial semiconductor layer (26) of the first type of conductivity, forming in the surface semiconductor layer (26) body regions (40) of the second type of conductivity, the body regions (40) being aligned with portions of semiconductor layer (22) free from the plurality of said at least second implanted regions (D1), carrying out a thermal diffusion step so that the plurality of implanted regions (D1) form a plurality of electrically continuous implanted column regions (D).
Abstract:
A microfluidic device for nucleic acid analysis includes a monolithic semiconductor body (13), a microfluidic circuit (10), at least partially accommodated in the monolithic semiconductor body (13), and a micropump (11). The microfluidic circuit (10) includes a sample preparation channel (18) formed on the monolithic semiconductor body (13) and at least one microfluidic channel (20, 22) buried in the monolithic semiconductor body (13). The micropump (11), includes a plurality of sealed chambers (40) provided with respective openable sealing elements (41) and having a first pressure therein that is different from a second pressure in the microfluidic circuit (10). In addition, the micropump (11) and the microfluidic circuit (10) are configured so that opening the openable sealing elements (41) provides fluidic coupling between the respective chambers (40) and the microfluidic circuit (10). The openable sealing elements (41) are integrated in the monolithic semiconductor body (13).
Abstract:
A method for facilitating the determination of the end point of a dry plasma etching process of a material, is proposed. The method includes performing an analysis of the whole spectrum of a radiation generated during the plasma etching process of the material, the analysis comprising evaluating the time trend of a plurality of spectral components of the radiation, each spectral component indicating the time trend of the radiation intensity of a corresponding wavelengths interval of the radiation. The method further includes, on the basis of such analysis, selecting at least one of the spectral components, wherein the at least one spectral component has a time trend indicative of the evolution of the etching process of the material. The performing of the spectral analysis comprises performing a statistical analysis of the time trend of the whole spectrum of the radiation and, on the basis of the results of the statistical analysis, selecting the at least one spectral component.