公开(公告)号：US20190081022A1

公开(公告)日：2019-03-14

申请号：US16189010

申请日：2018-11-13

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian ZHOU

IPC: H01L25/065 ,  H01L21/50 ,  H01L23/10 ,  H01L23/31 ,  H01L25/00

CPC classification number: H01L25/0655 ,  H01L21/50 ,  H01L23/10 ,  H01L23/3121 ,  H01L25/50

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.

公开(公告)号：US10147834B2

公开(公告)日：2018-12-04

申请号：US14885215

申请日：2015-10-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent Herard ,  David Gani

IPC: H01L31/167 ,  H01L25/16 ,  H01L31/18 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/58 ,  G01S17/02 ,  H01L31/16 ,  G01S7/481 ,  G01D5/347 ,  H01L33/54

Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.

公开(公告)号：US20180331236A1

公开(公告)日：2018-11-15

申请号：US16027647

申请日：2018-07-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN ,  Laurent HERARD ,  Yong Jiang LEI

IPC: H01L31/0203 ,  H01L31/153 ,  H01L31/18 ,  H01L31/12 ,  G01S7/481

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/46 ,  H01L25/50 ,  H01L31/125 ,  H01L31/153 ,  H01L31/173 ,  H01L31/18

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.

公开(公告)号：US10061057B2

公开(公告)日：2018-08-28

申请号：US14832971

申请日：2015-08-21

Applicant: STMicroelectronics Pte Ltd ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

IPC: G06M7/00 ,  G01V8/12 ,  H01L25/16 ,  H01L31/167

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

公开(公告)号：US20180151772A1

公开(公告)日：2018-05-31

申请号：US15880090

申请日：2018-01-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Cheng-Lay ANG

IPC: H01L31/173 ,  H01L31/12 ,  H01G9/20 ,  H01L31/046 ,  H01S5/183 ,  H01S5/022 ,  H01L31/042 ,  H01L31/0475 ,  H01L31/047

CPC classification number: H01L31/173 ,  G01S7/4813 ,  G01S17/08 ,  H01G9/20 ,  H01L31/0203 ,  H01L31/02366 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/0475 ,  H01L31/125 ,  H01S5/02252 ,  H01S5/183 ,  Y02E10/50

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US20180017536A1

公开(公告)日：2018-01-18

申请号：US15213100

申请日：2016-07-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Tien Choy Loh ,  Shian Yeu Kam ,  Ravi Shankar

IPC: G01N33/00 ,  G01N25/00

CPC classification number: G01N33/004 ,  G01N25/22 ,  G01N33/0047

Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.

公开(公告)号：US20180017513A1

公开(公告)日：2018-01-18

申请号：US15213230

申请日：2016-07-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Shian Yeu Kam ,  Tien Choy Loh

IPC: G01N27/12 ,  G01N25/56

CPC classification number: G01N27/128 ,  G01N33/0047

Abstract: A miniature gas analyzer capable of detecting VOC gases in ambient air as well as sensing relative humidity and ambient temperature can be used to monitor indoor air quality. The VOC gas sensor is thermally controlled and can be tuned to detect a certain gas by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the VOC gas sensor at a desired temperature. A local temperature sensor may be integrated with each gas sensor to provide feedback control. The heater, local temperature sensor, gas sensor(s), relative humidity sensor, and ambient temperature sensor are in the form of patternable thin films integrated on a single microchip, e.g., an ASIC. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.

公开(公告)号：US20170261458A1

公开(公告)日：2017-09-14

申请号：US15605825

申请日：2017-05-25

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/22 ,  H01L29/78 ,  G01L9/12 ,  G01L19/00 ,  G01K7/18 ,  G01K7/20 ,  H01L25/065

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US09754861B2

公开(公告)日：2017-09-05

申请号：US14512208

申请日：2014-10-10

Applicant: STMicroelectronics Pte Ltd

Inventor： Wing Shenq Wong

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.

公开(公告)号：US20170186644A1

公开(公告)日：2017-06-29

申请号：US14982103

申请日：2015-12-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent HERARD ,  David GANI

IPC: H01L21/78 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/565 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85

Abstract: A method for making at least one integrated circuit (IC) package includes positioning an electrically conductive shield layer adjacent an interior of a mold, and coupling the mold onto a substrate carrying at least one IC thereon. A molding material is supplied into the interior of the mold to form an encapsulated body over the at least one IC and substrate with the electrically conductive shield layer at an outer surface of the encapsulated body.