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公开(公告)号:US11162790B2
公开(公告)日:2021-11-02
申请号:US16452813
申请日:2019-06-26
Applicant: STMicroelectronics, Inc.
Inventor: Deyou Fang , Chao-Ming Tsai , Yamu Hu
IPC: G01C19/5719 , G01C19/5607 , G01C19/5642 , G01C19/56 , G01C19/5649
Abstract: A drive signal is applied to a MEMS gyroscope having several intrinsic resonant modes. Frequency and amplitude of mechanical oscillation in response to the drive signal is sensed. At startup, the drive signal frequency is set to a kicking frequency offset from a resonant frequency corresponding to a desired one of the intrinsic resonant modes. In response to sufficient sensed amplitude of mechanical oscillation at the kicking frequency, a frequency tracking process is engaged to control the frequency for the drive signal to sustain mechanical oscillation at the frequency of the desired one of the plurality of intrinsic resonant modes as the oscillation amplitude increases. When the increasing amplitude of the mechanical oscillation exceeds a threshold, a gain control process is used to exercise gain control over the applied drive signal so as to cause the amplitude of mechanical oscillation to match a further threshold. At that point start-up terminates.
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公开(公告)号:US11152326B2
公开(公告)日:2021-10-19
申请号:US16664568
申请日:2019-10-25
Applicant: STMicroelectronics, Inc.
Inventor: Rennier Rodriguez , Rammil Seguido , Raymond Albert Narvadez , Michael Tabiera
IPC: H01L23/00 , H01L23/495
Abstract: The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.
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公开(公告)号:US11084283B2
公开(公告)日:2021-08-10
申请号:US16676070
申请日:2019-11-06
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor: Domenico Giusti , Marco Ferrera , Carlo Luigi Prelini , Simon Dodd
Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
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公开(公告)号:US11081778B2
公开(公告)日:2021-08-03
申请号:US16123908
申请日:2018-09-06
Applicant: STMicroelectronics, Inc.
Inventor: Pierre Rizzo , Christophe Henri Ricard
Abstract: A method and apparatus for performing a low-power presence check are provided. In the method and apparatus, a controller detects a presence of a tag by at least causing the antenna to generate a magnetic field over a first time period for detecting the tag, measuring an antenna voltage over a second time period, causing the antenna to cease generating a magnetic field over a third time period longer than the first time period and comparing the antenna voltage to an antenna reference voltage to determine whether the tag is present. The controller detects the presence of the tag in response to receiving a command from a host device for performing the low-power presence check. The command may be a one-time command for every presence check stage or a command that is repeatedly received each time the controller detects the presence of the tag.
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公开(公告)号:US20210191755A1
公开(公告)日:2021-06-24
申请号:US16721331
申请日:2019-12-19
Applicant: STMicroelectronics, Inc.
Inventor: Karimuddin SAYED , Ashish BHARGAVA , Chandandeep Singh PABLA , Mahesh CHOWDHARY
Abstract: Systems, methods and devices are provided to improve management and accuracy of timestamps associated with sensor-based data. An indication is received of a sensor event associated with data samples provided from a sensor having an output data rate. A respective timestamp is assigned to each of the data samples. Assigning the respective timestamp may include, responsive to a determination that the indicated event is an interrupt event, calculating an actual data sampling interval based at least in part on time intervals between previous sensor events and a on a quantity of the one or more data samples. Assigning the respective timestamp may alternatively include, responsive to a determination that the event type is a data flush event, assigning the respective timestamp based on an actual data sampling interval associated with one or more previous sensor events if the actual data sampling interval has been previously stored, and otherwise assigning the respective timestamp based at least in part on the output data rate. Correction logic and drift compensation may be applied to the assigned respective timestamps.
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公开(公告)号:US20210190640A1
公开(公告)日:2021-06-24
申请号:US16719004
申请日:2019-12-18
Applicant: STMicroelectronics, Inc.
Inventor: Cheng PENG , Xiaoyong YANG
IPC: G01M99/00 , G01S17/58 , G01S7/4865
Abstract: Disclosed herein is a system for detecting rotational speed and early failures of an electronic device. The system includes a rotating disk affixed to a rotating shaft of the electronic device. The rotating disk has projections extending from its periphery. A time of flight ranging system determines distance to the projections extending from the rotating disk. Processing circuitry determines a rotational speed of the rotating shaft from the determined distances to the projections extending from the rotating disk, and detects whether the electronic device is undergoing an early failure from the determined distances to the projections extending from the rotating disk. Rotational speed is determined from the time between successive peaks in the determined distances, and early failures (for example, due to wobble of the shaft) are determined where the peaks vary unexpectedly in magnitude.
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公开(公告)号:US11037864B2
公开(公告)日:2021-06-15
申请号:US16264824
申请日:2019-02-01
Applicant: STMicroelectronics, Inc.
Inventor: Rennier Rodriguez , Maiden Grace Maming , Jefferson Talledo
IPC: H01L23/495 , H01L21/48 , H01L23/00
Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.
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公开(公告)号:US11031350B2
公开(公告)日:2021-06-08
申请号:US16223582
申请日:2018-12-18
Applicant: STMICROELECTRONICS, INC.
Inventor: Jefferson Talledo
IPC: H01L23/00 , H01L23/31 , H01L23/495 , H01L21/56 , H01L21/48
Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.
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公开(公告)号:US11004776B2
公开(公告)日:2021-05-11
申请号:US15912193
申请日:2018-03-05
Applicant: STMicroelectronics, Inc.
Inventor: Jefferson Talledo , Rammil Seguido
IPC: H01L23/495 , H01L23/48 , H01L23/52 , H01L23/00 , H01L21/56 , H01L23/498 , H01L23/31
Abstract: A semiconductor device may include a circuit board having an opening, and a frame. The frame may have an IC die pad in the opening, and arms extending outwardly from the IC die pad and coupled to the circuit board. The semiconductor device may include an IC mounted on the IC die pad, bond wires coupling the circuit board with the IC, and encapsulation material surrounding the IC, the bond wires, and the arms.
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公开(公告)号:US20210111109A1
公开(公告)日:2021-04-15
申请号:US17131222
申请日:2020-12-22
Applicant: STMICROELECTRONICS, INC.
Inventor: Rennier RODRIGUEZ , Aiza Marie AGUDON , Maiden Grace MAMING
IPC: H01L23/495 , H01L23/64
Abstract: The present disclosure is directed to a flat no-lead semiconductor package with a surfaced mounted structure. An end portion of the surface mounted structure includes a recessed member so that the surface mounted structure is coupled to leads of the flat no-lead semiconductor package through, among others, the sidewalls of the recessed members.
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