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公开(公告)号：JP2008126391A
公开(公告)日：2008-06-05
申请号：JP2006317162
申请日：2006-11-24
Inventor： KUNIMATSU SHINYA , ONISHI HISAYOSHI , MATSUO MAKOTO
CPC classification number: B24B13/046 , B23B1/00 , B23B29/125 , B23B2226/31 , B23B2265/16 , B23C3/00 , B24B1/04 , Y10T82/10 , Y10T82/25 , Y10T83/04 , Y10T83/889
Abstract: PROBLEM TO BE SOLVED: To efficiently improve the productivity of an optical member molding mold (structure) when the mold (divided mold 19) for molding an optical member such as a Fresnel lens is manufactured by machining a mold material (workpiece material) 2 by means of a cutting tool 4 of a quadruple spindle lathe type machining device 1 provided with an X axis, a Y axis, a Z axis and a C rotation axis. SOLUTION: There is provided an optical member molding mold (structure) machining method which is implemented in the following manner. Firstly, the mold material 2 is mounted on a mold material mounting portion 7 in the machining device 1, and the mold material 2 is rotated about the C axis as a rotation center 8, followed by driving the cutting tool 4 for moving in the X axis direction and the Y axis direction. Next the mold material 2 is cut by the cutting tool 4 at a required cutting speed relatively generated at a required location 20 of the mold material 2, and elliptically vibrated and machined by the cutting tool 4, to thereby form a cavity recess 17 for molding the Flesnel lens formed with an opening of a required shape and a machined surface (e.g. a concave surface) of a required shape. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：当用于模制诸如菲涅尔透镜的光学部件的模具（分割模具19）通过加工模具材料（工件材料）制造时，有效地提高了光学部件成型模具（结构）的生产率 ）2通过具有X轴，Y轴，Z轴和C旋转轴的四轴主轴车床型加工装置1的切削工具4。 解决方案：提供了以下述方式实现的光学构件成型模具（结构）加工方法。 首先，将模具材料2安装在加工装置1中的模具材料安装部7上，并且将模具材料2作为旋转中心8围绕C轴旋转，然后驱动用于在X中移动的切割工具4 轴方向和Y轴方向。 接下来，模具材料2以在模具材料2的所需位置20相对产生的所需切割速度被切割工具4切割，并且由切割工具4椭圆形振动和加工，从而形成用于模制的凹槽17 所述Flesnel透镜形成有所需形状的开口和所需形状的加工表面（例如凹面）。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008114418A
公开(公告)日：2008-05-22
申请号：JP2006298031
申请日：2006-11-01
Applicant: Craft Techno:Kk , Kobe Steel Ltd , Towa Corp , Towa株式会社 , 有限会社クラフトテクノ , 株式会社神戸製鋼所
Inventor： KAWAMOTO YOSHIHISA , SAEKI KAORU , AKARI KOUICHIROU , KUMAKIRI TADASHI
Abstract: PROBLEM TO BE SOLVED: To provide a resin sealing mold for an electronic component which makes various resin materials (including a strong adhesion sealing material) satisfy both mold release properties and corrosion resistance of the mold and form the surface treatment layer of the mold enough in consideration of environmental problems.
SOLUTION: By forming a chromium carbide film A (surface treatment layer) in a necessary place of each of the surfaces of these molds 1 and 2 by depositing (surface treatment) by a vacuum film depositing method, the resin sealing molding of the electronic component 5 set on a substrate 6 can be carried out in mold cavities 3 and 4.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：为了提供使各种树脂材料（包括强粘合性密封材料）满足模具的脱模性和耐腐蚀性的电子部件用树脂密封模，形成表面处理层 考虑到环境问题足够模具。 解决方案：通过用真空膜沉积法沉积（表面处理）在这些模具1和2的每个表面的必要位置上形成碳化铬膜A（表面处理层），树脂密封成型 设置在基板6上的电子部件5可以在模腔3和4中进行。版权所有：（C）2008，JPO＆INPIT
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公开(公告)号：JP4052939B2
公开(公告)日：2008-02-27
申请号：JP2002364760
申请日：2002-12-17
Applicant: Towa株式会社
CPC classification number: H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
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公开(公告)号：JP2007281367A
公开(公告)日：2007-10-25
申请号：JP2006108867
申请日：2006-04-11
Inventor： MAEDA KEIJI , TOKUYAMA HIDEKI
Abstract: PROBLEM TO BE SOLVED: To provide a resin sealing molding apparatus for an electric component which can mainly improve the strength of a component single body and quality in accuracy in a press structure, and align the pressing center position of the press structure with the center position of a mold. SOLUTION: A hold frame (press frame) mechanism 55 of this apparatus 100 is provided so as to be reciprocated along a machine table frame 72 by a proper reciprocation driving mechanism 78. In an example shown in a figure, a pressing center position 79 in a hold frame (press frame) 77 and a pressing means 73 can move in the same direction (in this case, left direction) as the moving direction of the mechanism 78, and can be aligned with a center position 80 of a mold 51 in a mold region P including the mold 51 arranged between mounting blocks 68 and 71 and a mold opening/closing mechanism 54. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种能够主要提高部件单体的强度和压制结构的精度的电气部件的树脂密封成型装置，并且将压制结构的按压中心位置与 模具的中心位置。 解决方案：该装置100的保持架（压框）机构55设置成通过适当的往复运动驱动机构78沿着机台框架72往复运动。在图示的示例中，按压中心 位置79处于保持框架（压框）77中，并且按压装置73能够沿与机构78的移动方向相同的方向（在这种情况下为左方向）移动，并且可以与机构78的中心位置80对齐 模具51包括设置在安装块68和71之间的模具51和模具打开/关闭机构54的模具区域P.版权所有（C）2008，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP3996138B2
公开(公告)日：2007-10-24
申请号：JP2004090894
申请日：2004-03-26
Applicant: Towa株式会社 , 財団法人ファインセラミックスセンター
CPC classification number: B29C33/38 , B29C33/56 , G01N19/04 , H01L2224/48091 , Y10T428/2839 , H01L2924/00014
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268.发明专利
公开(公告)号：JP2007095804A
公开(公告)日：2007-04-12
申请号：JP2005280294
申请日：2005-09-27
Inventor： BANDO KAZUHIKO
CPC classification number: H01L21/565 , B29C45/02 , B29C45/14065 , B29C45/14655 , B29C45/32 , B29C45/64 , B29C2045/14147 , B29C2045/648 , H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To prevent formation of resin burrs on the front surface of substrate by simplifying total structure of die to form a resin seal of electronic component loaded on the substrate, and by absorbing fluctuation in thickness of substrate at the time of forming the resin seal of electronic component. SOLUTION: The resin seal forming apparatus is constituted by forming a die 110 to form resin seal of electronic component from a first die 111 and a second die 112, and by laminating and allocating, to the die contact surface P, L of both dies, a die structure unit (die 110) of a plurality of units in which a substrate supplying part (substrate supplying set surface 113) is provided for supplying a single sheet of preliminary substrate 400 loading electronic component. Moreover, a die closing mechanism (press frame mechanism 130) is also arranged to simultaneously apply the die tightening pressure to the laminated by arranged die structure unit (die 110). COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：为了通过简化模具的总体结构来形成树脂毛刺，以形成负载在基板上的电子部件的树脂密封，并且在此时吸收基板厚度的波动 形成电子部件的树脂密封。 解决方案：树脂密封形成装置通过形成模具110来形成，以从第一模具111和第二模具112形成电子部件的树脂密封，并且通过层压和分配到模具接触表面P，L 两个模具，设置有多个单元的模具结构单元（模具110），其中设置有基板供给部（基板供给设定面113），用于供给装载电子部件的一张预备基板400。 此外，还设置了模具关闭机构（压框架机构130），以通过配置的模具结构单元（模具110）同时将模具紧固压力施加到层压体。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2007095802A
公开(公告)日：2007-04-12
申请号：JP2005280292
申请日：2005-09-27
Inventor： MAEDA KEIJI
CPC classification number: H01L21/565 , H01L21/67126 , H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To prevent the formation of resin burrs on a substrate surface by simplifying the entire structure of a mold 110 used for resin-sealing molding an electronic component mounted on a substrate 400 and absorbing variations of the thickness of the substrate 400 in resin sealing molding the electronic component.
SOLUTION: The mold 110 used for resin sealing molding the electronic component is composed of a first mold 111 and a second mold 112, and planar substrate feed setting surfaces 113 having no step are formed on mold matching surfaces (P.L surfaces) of both the molds. Also, a pot block 140 is arranged on the side surface 110a of the mold 110 matching the mold matching surfaces (P.L surfaces) of both the molds so as to be freely joined and separated, and the mold matching surfaces are joined to the pot block 140 and a molten resin material in the pot block 140 is directly injected into a cavity 114.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：为了通过简化用于树脂密封成型的模具110的整体结构来防止在基板表面上形成树脂毛刺，并且安装在基板400上的电子部件的吸收变化 树脂中的基板400密封成型电子部件。 解决方案：用于树脂密封成型电子部件的模具110由第一模具111和第二模具112构成，并且在模具匹配表面（PL表面）上形成没有台阶的平面基板进给设定表面113 两个模具。 此外，在与模具的模具匹配表面（PL表面）匹配的模具110的侧表面110a上布置有罐块140，以便自由接合和分离，并且模具匹配表面接合到罐块 140和罐盆140中的熔融树脂材料直接注入空腔114.版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2007083365A
公开(公告)日：2007-04-05
申请号：JP2005276904
申请日：2005-09-22
Inventor： TAKEHARA KATSUNAO , YOSHIDA MASAHARU , KITAGAWA YASUYUKI , KISHIMOTO KAZUYUKI , KATO SEIJI
IPC: B24C5/02
Abstract: PROBLEM TO BE SOLVED: To dispense with replacement of a fixing base to fix a subject, and prevent abrasion of the fixing base in cutting the subject along mutually crossing cutting lines. SOLUTION: This cutting device is for cutting a subject 28 along the mutually crossing cutting lines 63 and 64 by injecting water including abrasive grains under high pressure. It is provided with the fixing base 66 for fixing the subject 28, groove parts 68X and 68Y provided at positions corresponding to and below the cutting lines 63 and 64 in the fixing base 66, projected parts 67 provided to get in contact with the subject 28 at other parts than the groove parts 68X and 68Y on the fixing base 66, base parts 69 provided to connect the projected parts 67 to each other almost in parallel to the cutting lines 64 extended in the Y-direction at the groove parts 68X and 68Y, a frame part 70 provided to connect the base parts 69 to each other at least in part of the outer circumference of the fixing base 67, and protective members 74 detachably provided to cover the base parts 69. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：不需要更换固定基座来固定物体，并且防止在相互交叉的切割线上切割物体时固定基座的磨损。 解决方案：该切割装置用于通过在高压下注入包括磨粒的水来沿着相互交叉的切割线63和64切割被检体28。 设置有用于固定被检体28的固定底座66，设置在固定基座66中的与切割线63和64相对应的位置处的凹槽部68X和68Y，设置成与被检体28接触的突出部67 在固定基座66上的凹槽部分68X和68Y的其他部分上，设置为将突出部分67彼此平行地连接到在凹槽部分68X和68Y处沿Y方向延伸的切割线64彼此平行的基部69 设置为将基部69彼此连接至固定基座67的外周的至少一部分的框架部70以及可拆卸地设置以覆盖基部69的保护构件74.权利要求（C） 2007年，日本特许厅和INPIT
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