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    Elliptically vibrating cutting device
    272.
    发明专利
    Elliptically vibrating cutting device 有权
    非线性振动切割装置

    公开(公告)号：JP2006205291A

    公开(公告)日：2006-08-10

    申请号：JP2005019744

    申请日：2005-01-27

    Applicant: Honda Electronic Co Ltd ,  Towa Corp ,  Towa株式会社 ,  Univ Nagoya ,  国立大学法人名古屋大学 ,  本多電子株式会社

    Inventor： SHAMOTO EIJI ,  SUZUKI NORIKAZU ,  KOSAKA HIDEO ,  SHIBUYA NOBUNAGA ,  MATSUO MAKOTO ,  HARADA KAZUHIRO

    IPC: B23B1/00

    Abstract: PROBLEM TO BE SOLVED: To provide an elliptically vibrating cutting device capable of reducing restriction on a processible shape.
    SOLUTION: This elliptically vibrating cutting device 1 performs cutting while elliptically vibration (including circularly vibrating) an edge of a cutting tool by using longitudinal vibration; and has a longitudinal vibrator 2 for generating the longitudinal vibration, a longitudinal vibrator 3 for generating longitudinal vibration in the direction different from the longitudinal vibrator 2, a connecting member 5 for connecting mutual tip parts of the longitudinal vibrator 2 and the longitudinal vibrator 3, the cutting tool 6 installed in the connecting member 5, and a driving device 7 for elliptically vibrating the edge of the cutting tool 6 by driving the longitudinal vibrators 2 and 3.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供能够减少可加工形状的限制的椭圆振动切割装置。 解决方案：该椭圆振动切割装置1通过使用纵向振动来进行切割，同时对切割工具的边缘进行椭圆振动（包括圆周振动） 并具有用于产生纵向振动的纵向振动器2，用于在与纵向振动器2不同的方向上产生纵向振动的纵向振动器3，用于连接纵向振动器2和纵向振动器3的相互顶端部分的连接构件5， 安装在连接构件5中的切割工具6以及通过驱动纵向振动器2和3来对切割工具6的边缘进行椭圆振动的驱动装置7.（C）2006，JPO＆NCIPI

    Resin molding mold and resin molding method
    277.
    发明专利
    Resin molding mold and resin molding method 有权
    树脂模具和树脂模塑方法

    公开(公告)号：JP2006168256A

    公开(公告)日：2006-06-29

    申请号：JP2004365973

    申请日：2004-12-17

    Applicant: Towa Corp ,  Towa株式会社

    Inventor： KUNO KOUKI ,  MAEDA KEIJI

    IPC: B29C45/33 ,  B29C45/37 ,  B29C45/40 ,  B29K101/10 ,  H01L21/56

    CPC classification number: B29C41/42 ,  B29C39/36 ,  B29C43/18 ,  B29C45/14639 ,  B29C45/40 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a resin molding mold and resin molding method which do not need an ejector pin, a high pressure fluid ejection mechanism, etc., and make the demolding of a molding possible by a simple structure.
    SOLUTION: The resin molding mold 3 which forms a cured resin 19 by curing a fluid resin after a cavity 12 is filled with the fluid resin and is used when the molding 20 containing at least the cured resin 19 is completed is provided with at least a block 7 constituting the inner bottom surface 13 of the cavity 12 and a driving mechanism 10 displacing the block 7 in the direction along the inner bottom surface 13 by applying force to the block 7. The driving mechanism 10, while the cured resin 19 is formed, separates the cured resin 19 from the inner bottom surface 13 by displacing the block 7. In this way, the molding 20 is demolded from the mold 3 without applying force in the thickness direction of the molding 20.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种不需要顶针，高压流体喷射机构等的树脂成型模具和树脂模制方法，并且通过简单的结构使成型件脱模成为可能。 解决方案：树脂模制品3通过在空腔12填充流体树脂之后固化流体树脂而形成固化树脂19，并且当至少含有固化树脂19的模制品20完成时使用 构成空腔12的内底表面13的至少块7和通过向块7施加力沿着内底面13的方向移动块7的驱动机构10.驱动机构10，同时固化树脂 19，通过使块7移位而将固化树脂19从内底面13分离。以这种方式，模制件20在模制件20的厚度方向上施加力而不从模具3脱模。版权所有 （C）2006，JPO＆NCIPI

    Resin seal molding method and device of semiconductor chip
    278.
    发明专利
    Resin seal molding method and device of semiconductor chip 审中-公开
    树脂密封成型方法及半导体芯片设备

    公开(公告)号：JP2006156796A

    公开(公告)日：2006-06-15

    申请号：JP2004346787

    申请日：2004-11-30

    Applicant: Towa Corp ,  Towa株式会社

    Inventor： URAGAMI HIROSHI ,  TAKAHASHI MASANOBU ,  NAKAMURA MAMORU ,  OBATA TAKASHI

    IPC: H01L21/56 ,  B29C45/14 ,  B29C45/26 ,  B29C45/56

    Abstract: PROBLEM TO BE SOLVED: To provide resin seal molding method and device of a semiconductor chip in which the merit of saving the work time (cycle time) and performing automatic control of resin molding can be enhanced by resin sealing a plurality of required semiconductor chips mounted on two substrates individually while compression molding substantially simultaneously with a uniform pressure.
    SOLUTION: The resin seal molding device 1 comprises members 38 sliding on the horizontal surface of each cavity 37 provided on the lower die 5b side individually, and a means 42 for regulating a resin material 18 to a required pressure through each sliding member 38. At the time of mold clamping a die 5 under that state, each sliding member 38 slides and the regulation means 42 presses the resin material 18 with a uniform regulated pressure through each sliding member thus resin sealing chips 15 mounted on two substrates 14 while compression molding individually and substantially simultaneously with a uniform pressure.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 解决的问题：提供树脂密封成型方法和半导体芯片的装置，其中可以通过树脂密封多个所需要的材料来提高节省工作时间（循环时间）和执行树脂成型的自动控制的优点 半导体芯片分别安装在两个基板上，同时以均匀的压力基本上同时压缩成型。 解决方案：树脂密封成型装置1包括在设置在下模5b侧的每个空腔37的水平表面上分别滑动的构件38和用于通过每个滑动构件将树脂材料18调节到所需压力的装置42 在这种状态下模具夹紧模具5时，每个滑动构件38滑动，调节装置42通过每个滑动构件以均匀的调节压力挤压树脂材料18，因此树脂密封芯片15安装在两个基板14上，同时 在均匀的压力下单独地和基本上同时地进行压缩成型。 版权所有（C）2006，JPO＆NCIPI

    Method of separating sealed substrate and separating mechanism
    279.
    发明专利
    Method of separating sealed substrate and separating mechanism 审中-公开
    分离密封基材和分离机理的方法

    公开(公告)号：JP2006134923A

    公开(公告)日：2006-05-25

    申请号：JP2004319105

    申请日：2004-11-02

    Applicant: Towa Corp ,  Towa株式会社

    Inventor： TOKUYAMA HIDEKI ,  TAMURA KOJI

    IPC: H01L21/56 ,  B29C45/40 ,  B29L31/34

    Abstract: PROBLEM TO BE SOLVED: To solve the problem that a resin mold (package) formed in a substrate and reduced in thickness is difficult to efficiently prevent the deformation (warp) of the substrate, a crack, etc. of a chip and a package in a conventional separating mechanism projected by a plurality of separating pins.
    SOLUTION: A separating mechanism 29 having a projecting plate 30 which projects the predetermined part of the periphery 23 in the sealed substrate 25 in the state of surface contact is adopted, even if it is a resin mold 22 which is formed in the substrate 9 and which is reduced in thickness. Accordingly, the deformation of the substrate 9 can be suppressed to the minimum limit, and a stable separate state can be assured.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 解决问题：为了解决在基板上形成的树脂模具（封装）的厚度变薄难以有效地防止基板的变形（翘曲），芯片的裂纹等的问题，以及 在由多个分离销突出的常规分离机构中的包装。 解决方案：采用具有突出板30的分离机构29，该突出板30以表面接触的状态将周边23的预定部分突出在密封基板25中，即使它是形成在树脂模具22中的树脂模具22 基板9，并且其厚度减小。 因此，可以将基板9的变形抑制到最小限度，能够确保稳定的分离状态。 版权所有（C）2006，JPO＆NCIPI

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