公开(公告)号：US20240352282A1

公开(公告)日：2024-10-24

申请号：US18574785

申请日：2022-06-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Yasuhiro Kono

IPC: C09J7/20 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/36 ,  B32B43/00 ,  C09J5/00 ,  C09J7/40

CPC classification number: C09J7/201 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/36 ,  B32B43/006 ,  C09J5/00 ,  C09J7/401 ,  B32B2250/02 ,  B32B2250/244 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/4026 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/558 ,  B32B2307/748 ,  C09J2301/124 ,  C09J2301/502 ,  C09J2400/24

Abstract: To provide a double-sided adhesive tape with both high adhesive force and excellent ease of disassembly. A double-sided adhesive tape including a first adhesive layer; a separation layer containing a pigment, the separation layer being provided on the first adhesive layer; a film substrate directly laminated on the separation layer; and a second adhesive layer provided on the film substrate, wherein the pigment contains at least one selected from the group consisting of carbon black, titanium oxide, and phthalocyanine blue.

公开(公告)号：US11993737B2

公开(公告)日：2024-05-28

申请号：US16618162

申请日：2018-05-29

Applicant: BANDO CHEMICAL INDUSTRIES, LTD.

Inventor： Yutaka Kamada ,  Arata Tani ,  Toshihiko Horie ,  Soh Kato

IPC: C09J7/29 ,  B32B7/12 ,  B32B27/36 ,  B32B27/40 ,  C09J7/20 ,  C09J7/25 ,  C09J7/40 ,  G02B1/14

CPC classification number: C09J7/29 ,  B32B7/12 ,  B32B27/36 ,  B32B27/40 ,  C09J7/201 ,  C09J7/25 ,  C09J7/405 ,  G02B1/14 ,  B32B2307/748 ,  B32B2571/00 ,  C09J2203/326 ,  C09J2475/006

Abstract: The present invention addresses the problem of providing a surface protection film which provides an excellent writing sensation when a touch pen is used thereon and excellent scratch resistance against a touch pen. As a solution, provided is a surface protection film which has on the outermost surface thereof a protection layer formed of a polyurethane, wherein the polyurethane has an international rubber hardness degree (IRHD) of 87.0-98.0 and a tan δ peak value of 0.6 or more.

公开(公告)号：US11852275B2

公开(公告)日：2023-12-26

申请号：US17343520

申请日：2021-06-09

Applicant: Avery Dennison Corporation

Inventor： David J. Shuey

IPC: F16L59/02 ,  C09J7/38 ,  B32B27/06 ,  F16L59/08 ,  B32B7/06 ,  B32B7/12 ,  F24F13/02 ,  B32B5/18 ,  C09J7/20 ,  B32B29/00 ,  B32B19/04 ,  B32B27/32 ,  B32B3/26 ,  C09J7/22 ,  C09J7/21 ,  C09J7/40 ,  B32B5/02 ,  B32B27/12 ,  B32B29/02 ,  F16L59/04 ,  B32B37/30 ,  B32B37/12 ,  B32B38/10 ,  B29C65/48 ,  F16L59/14 ,  B32B37/26 ,  B29L31/26

CPC classification number: F16L59/028 ,  B29C65/48 ,  B32B3/266 ,  B32B5/02 ,  B32B5/18 ,  B32B7/06 ,  B32B7/12 ,  B32B19/04 ,  B32B27/06 ,  B32B27/065 ,  B32B27/12 ,  B32B27/32 ,  B32B29/002 ,  B32B29/007 ,  B32B29/02 ,  B32B37/12 ,  B32B37/1292 ,  B32B37/30 ,  B32B38/10 ,  C09J7/201 ,  C09J7/21 ,  C09J7/22 ,  C09J7/38 ,  C09J7/40 ,  F16L59/022 ,  F16L59/029 ,  F16L59/04 ,  F16L59/08 ,  F16L59/14 ,  F24F13/0263 ,  B29L2031/26 ,  B32B2037/268 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/304 ,  B32B2307/748 ,  B32B2317/12 ,  B32B2405/00 ,  B32B2597/00 ,  C09J2301/122 ,  C09J2301/124 ,  C09J2301/20 ,  C09J2301/204 ,  C09J2301/302 ,  C09J2400/283 ,  C09J2421/00 ,  C09J2423/046 ,  C09J2433/00 ,  C09J2483/00 ,  C09J2483/005 ,  Y10T428/14

Abstract: A multilayer tape assembly is described which can be used with insulation jacketing and particularly for self-sealing lap (SSL) applications. The tape assembly includes two adhesive layers with associated carrier and release layers in conjunction with a differential release system. Various methods of use are also described, including a method of forming a securable insulation jacket.

公开(公告)号：US20180264797A1

公开(公告)日：2018-09-20

申请号：US15916263

申请日：2018-03-08

Applicant: DIDREW TECHNOLOGY (BVI) LIMITED

Inventor： Chunbin Zhang

IPC: B32B38/10 ,  H01L21/67 ,  C09J7/20 ,  H01L21/683 ,  H01L21/78 ,  B32B43/00

CPC classification number: B32B38/10 ,  B32B43/003 ,  B32B43/006 ,  B32B2457/14 ,  C09J5/00 ,  C09J7/201 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/7813 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: In debonding a temporarily adhesive-bonded carrier-workpiece pair by a combination of chemical and mechanical methods, solvents or chemicals are used to remove the adhesives primarily through dissolution, and a thin wire, filament, or blade is used to exert a cutting or wedging action between the carrier and workpiece. The two methods are used together during the debonding process. In the carrier-workpiece pair, the workpiece can be a semiconductor wafer that has been thinned and processed. The carrier and the workpiece are temporarily bonded using an adhesive dissolvable in a selected chemical or solvent. The chemical and mechanical debonding (CMDB) method can be carried out in solvent immersion or in solvent spray to provide high throughput debonding. The dissolved adhesives can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.

公开(公告)号：US20180163094A1

公开(公告)日：2018-06-14

申请号：US15517463

申请日：2017-03-11

Applicant: entrotech, inc.

Inventor： James E. McGuire, JR. ,  Andrew C. Strange ,  Matthew J. Canan ,  Gregory E. Booth

IPC: C09J7/25 ,  C09J7/38 ,  C09J7/20 ,  C09J5/00 ,  B29C65/48

CPC classification number: C09J7/25 ,  B29C65/4825 ,  B29K2675/00 ,  B29L2031/3091 ,  C09J5/00 ,  C09J7/201 ,  C09J7/29 ,  C09J7/385 ,  C09J2203/306 ,  C09J2433/00 ,  C09J2475/005 ,  C09J2475/006

Abstract: Multi-layer protective sheets of the invention are useful in a range of indoor and outdoor applications in, for example, the transportation, architectural and sporting goods industries. In one embodiment, a multi-layer protective sheet comprises at least one defect-free carrier layer. In another embodiment, a multi-layer protective sheet comprises an in-situ polymerized carrier layer. In yet another embodiment, a multi-layer protective sheet comprises a carrier layer having a peak loss factor of at least about 0.5 when tested as a standalone film according to the Loss Factor Test Method described herein.

公开(公告)号：US20180030314A1

公开(公告)日：2018-02-01

申请号：US15220784

申请日：2016-07-27

Applicant: TESA SE

Inventor： NIELS CZERWONATIS ,  KERSTIN GÖTZ ,  JENS NOOTBAAR ,  MARCO WALPER

IPC: C09J7/02 ,  C09J5/00 ,  C09J7/04

CPC classification number: C09J5/00 ,  B65H19/102 ,  B65H2301/41766 ,  C09J7/201 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2203/342 ,  C09J2400/283

Abstract: Adhesive tape for the on-the-fly roll changeover of flat web material wound up into rolls, comprising a carrier layer having a first surface and a second surface, a first layer of adhesive on the side of the first surface over at least part of the area, and a second layer of adhesive on one or more areas of the second surface, wherein the adhesive tape has regions suitable for areal splitting, at least those areal regions of the second surface on which the second layer of adhesive is provided being surface coated, the forces of adhesion of the lower layer of adhesive to the surface coating being greater than the forces of adhesion of the surface coating to the carrier layer, and/or the forces of adhesion of the lower layer of adhesive to the surface coating being greater than the forces of cohesion within the surface coating.

公开(公告)号：US20180015762A1

公开(公告)日：2018-01-18

申请号：US15665856

申请日：2017-08-01

Applicant: MJ Solutions GmbH

Inventor： Scott Williams

IPC: B41M5/382 ,  B41M5/50 ,  B41M3/12 ,  B41M5/035 ,  B44C1/17 ,  B41M5/48 ,  B41M7/00 ,  B41M5/52 ,  D06P5/24 ,  C08L23/08 ,  C09J7/02 ,  B41M5/44 ,  C08L53/00

CPC classification number: B41M5/382 ,  B41M3/12 ,  B41M5/035 ,  B41M5/0355 ,  B41M5/38214 ,  B41M5/44 ,  B41M5/48 ,  B41M5/502 ,  B41M5/504 ,  B41M5/52 ,  B41M5/5218 ,  B41M5/5236 ,  B41M5/5245 ,  B41M5/5254 ,  B41M7/00 ,  B41M7/0027 ,  B41M2205/06 ,  B41M2205/30 ,  B44C1/17 ,  B44C1/1712 ,  C08L23/0853 ,  C08L53/00 ,  C09J7/201 ,  C09J7/22 ,  C09J7/35 ,  D06P5/003 ,  Y10T428/24893 ,  Y10T428/2813 ,  Y10T428/2839 ,  C08L2666/24

Abstract: Provided is an image transfer material, comprising a support, optionally at least one barrier layer, a melt transfer layer, and an image receiving layer. Also provided is a process for preparing the image transfer material. Further provided is a heat transfer process using the disclosed material. In the heat transfer process, after imaging, the image receiving layer and melt transfer layer are peeled away from the optionally barrier-coated support material and placed, preferably image side up, on top of a receptor element. A non-stick sheet is then optionally placed over the imaged peeled material and heat is applied to the top of the optional non stick sheet. The melt transfer layer then melts and adheres the image to the receptor element. A composition comprising: at least one self-crosslinking polymer, and at least one dye retention aid.

公开(公告)号：US20170247580A1

公开(公告)日：2017-08-31

申请号：US15509211

申请日：2015-09-17

Applicant: Rohm and Haas Company ,  Dow Global Technologies LLC

Inventor： Swapnil Chandak ,  Rajen M. Patel ,  William B. Griffith, JR. ,  Daniel W. Himmelberger

IPC: C09J7/02

CPC classification number: C09J7/38 ,  C09J7/201 ,  C09J7/203 ,  C09J7/22 ,  C09J7/28 ,  C09J153/00 ,  C09J157/06 ,  C09J2201/122 ,  C09J2201/16 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2423/04 ,  C09J2423/045 ,  C09J2423/105 ,  C09J2433/00 ,  C09J2453/00 ,  C09J2483/005

Abstract: A cling foil comprising an outermost adhesive layer comprising a pressure sensitive adhesive, an outermost release layer, the outermost release layer comprising a release material, and a foil layer positioned between the outermost adhesive layer and the outermost release layer.

公开(公告)号：US09663684B2

公开(公告)日：2017-05-30

申请号：US13474133

申请日：2012-05-17

Applicant: Joseph T. Bartusiak ,  Ramesh C. Kumar

Inventor： Joseph T. Bartusiak ,  Ramesh C. Kumar

IPC: B32B7/12 ,  C09J7/02

CPC classification number: C09J7/0271 ,  B05B12/24 ,  B05D1/32 ,  C09J7/201 ,  C09J7/22 ,  C09J7/241 ,  C09J107/00 ,  C09J2201/20 ,  C09J2203/31 ,  C09J2407/00 ,  C09J2423/006 ,  C09J2423/046 ,  C09J2433/005 ,  C09J2483/005 ,  Y10T428/14 ,  Y10T428/15

Abstract: A hand-tearable masking tape, comprising a plastic backing with a low adhesion backsize on the first major side of the backing and a pressure-sensitive adhesive on the second major side of the backing; wherein the second major side of the backing comprises a microstructured hand-tear pattern and wherein the low adhesion backsize comprises the reaction product of a mercapto-functional silicone macromer.

公开(公告)号：US20170069521A1

公开(公告)日：2017-03-09

申请号：US15122493

申请日：2015-03-03

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Michihiro SUGO ,  Hiroyuki YASUDA ,  Shohei TAGAMI ,  Masahito TANABE

IPC: H01L21/683 ,  C09J183/04 ,  B32B37/12 ,  B32B27/08 ,  B32B27/28 ,  C08G77/20 ,  H01L23/00

CPC classification number: H01L21/6836 ,  B32B7/04 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/283 ,  B32B37/12 ,  B32B2037/1269 ,  B32B2250/03 ,  B32B2264/00 ,  B32B2264/02 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/08 ,  B32B2457/14 ,  C08G77/12 ,  C08G77/20 ,  C08K5/56 ,  C08L83/00 ,  C09J7/201 ,  C09J7/203 ,  C09J7/30 ,  C09J7/401 ,  C09J7/403 ,  C09J7/50 ,  C09J183/04 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2224/13147 ,  H01L2924/0715 ,  H01L2924/10253

Abstract: A temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, contains a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer laminated on the second temporary adhesive layer and capable of releasably adhering to the support. A wafer processing laminate and temporary adhesive material for a wafer processing facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method manufactures a thin wafer using the same.

Abstract translation: 用于临时粘合支撑体的临时粘合材料和具有电路形成前表面和待加工后表面的晶片包含具有三层结构的复合临时粘合材料层，其包括第一 由能够可剥离地粘附在晶片前表面的非硅氧烷热塑性树脂层构成的临时胶粘剂层，层叠在第一临时粘合剂层上的由热固性硅氧烷聚合物层组成的第二临时粘合剂层和第三临时粘合剂层 由层压在第二临时粘合剂层上并能够可释放地粘附到载体上的热固性硅氧烷改性聚合物层组成。 用于晶片处理的晶片加工层压板和临时粘合材料便于临时粘合和分离，具有优异的耐CVD性，并且可以提高薄晶片的生产率，并且制造使用其的薄晶片的方法。