Abstract:
Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.
Abstract:
A string of coiled tubing for an electrical submersible well pump has insulated power conductors encased in an elastomeric jacket within the coiled tubing. A textured interface between the jacket and the inner side wall of the coiled tubing enhances frictional engagement between the jacket and the coiled tubing. The textured interface may be formed on the inner side wall of the coiled tubing and consist of a roughened or knurled surface. A tape may be wrapped helically around the jacket, the tape having an outer side with a textured surface in contact with the inner side wall of the coiled tubing. The textured interface may extend continuously for the length of the coiled tubing.
Abstract:
A curable composition for use in wound care comprising, apportioned between at least one Part A and at least one Part B: one or more alkenyl-group containing polymers (i) having at least one alkenyl group or moiety per molecule, one or more SiH-containing polymers (ii) having at least one Si—H unit per molecule; and a catalyst (iii) for curing by addition of alkenyl-containing polymer (i) to SiH-containing polymer (ii), Part A and Part B independently having viscosity at 23° C. in the range 5-300 Pa·s, preferably 10-100 Pa s, at a shearing rate of 10 s−1, and when combined in one Part having cure time at 23° C. in the range from 0.5 min to 25 min, wherein when dispensed into a location about a wound dressing, said wound dressing overlying a wound site and skin thereabout, said dispensing being so as to intimately contact and overlie an edge of said dressing and skin about said edge, the composition cures in contact with said edge and skin at 32° C. to an elastomer exhibiting zero or low tack at a time in the range from 0.5 to less than 30 minutes, apparatus for use with said composition comprising dispensing apparatus or wound dressing, a kit comprising the same, and methods of dispensing and curing the same and of using the same in sealing a wound dressing and in treating a wound site of a human in need thereof.
Abstract:
A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
Abstract:
This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.
Abstract:
A bioadhesive composition formed by polymerizing a homogeneous aqueous reaction mixture comprising from about 5% to about 50%, by weight of the reaction mixture, of at least one ionic water soluble monomer, from about 10% to about 50%, by weight of the reaction mixture, of at least one plasticizer (other than water), up to about 50%, by weight of the reaction mixture, of at least one non ionic water soluble monomer, up to about 40%, by weight of the reaction mixture, of water, optionally as well as up to about 10%, by weight of the reaction mixture, of at least one surfactant and from about 1% to about 30%, by weight of the reaction mixture, of at least one hydrophobic monomer and/or polymer. An electrolyte may be present, to enhance electrical conductivity, e.g. for use in biomedical electrodes.
Abstract:
Methods of bonding substrates, forming foams, and forming elastomers are provided, using compositions cured by the Michael addition reaction.
Abstract:
Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.
Abstract:
A pressure sensitive structural adhesive or sealant composition comprises a) a polymer system containing from 95 to 15 percent by weight of a telechelic polymer such as a polyhydroxylated diene block polymer and from 5 to 85 percent by weight of a heterotelechelic polymer such as an epoxidized monohydroxylated diene block polymer, and b) a dual curing system wherein one element such as a polyisocyanate cures the telechelic polymer at ambient temperature, and the other element such as an amino resin cures the heterotelechelic polymer.
Abstract:
An aqueous dispersed resin composition comprising (A) an aqueous dispersion of carbonyl-containing resin particles having an inner layer and an outermost layer, which is obtained by emulsion polymerization of a monomer mixture comprising (a) not less than 0.5% by weight of a carbonyl-containing monomer containing at least one aldo group or keto group and one polymerizable unsaturated double bond in the molecule thereof, (b) not less than 0.5% by weight of an ethylenically unsaturated carboxylic acid, (c) not more than 99% by weight of a monomer having a water-solubility of not more than 8 g/100 ml at 20.degree. C., and (d) not more than 99% by weight of an unsaturated monomer other than the monomers (a) to (c) in the presence of dispersed resin particles serving as an inner layer and (B) a hydrophilic compound comprising a hydrazine derivative containing at least two hydrazino groups in the molecule thereof, in which the resin constituting the outermost layer of the carbonyl-containing resin particles has a degree of solubilization of at least 5% by weight, and the resin constituting the inner layer has a degree of solubilization lower than that of the resin constituting the outermost layer. The composition provides a film excellent in water resistance, adhesion to a substrate, smoothness, gloss, and resistance to whitening on contact with water.