Abstract:
A limiter circuit for the maximum current passed from a power transistor (T'p) to a load (ZL) connected to an output terminal of the transistor, being of a type which comprises an error amplifier (1'), a driver circuit (P') for said transistor (T'p), and a means of detecting the current (IL) flowing through said load (ZL) provided with at least first and second terminals, is characterized in that it comprises a circuit block (2) having an input terminal connected to the control terminal of (T'p) and an output terminal connected to the current generator internal of the amplifier (1'), one input (B') of said amplifier (1') being connected to said first terminal of (Rs)and the other input (A') connected to said second terminal of (Rs). The introduction of said circuit block lowers the open-ring system gain making it stable and producing a smooth reduction of any rise in the load current (IL).
Abstract:
The transistor comprises a buried base P region (13), a buried emitter N+ region (14) with elongate portions (fingers), deep contact P+ base regions (15), emitter N+ interconnection regions (16,17) serving balancing resistor functions, and base, emitter, and collector surface contact electrodes. To provide a higher current gain and a larger safe operation area, with each emitter "finger" (14) there are associated a screening P region (22) interposed between the "finger" (14) and a part (16) of the respective N+ interconnection region, and a contact N+ region (17A) which extends to the "finger" and is surface connected to the screening P region (22) by a dedicated electrode (23).
Abstract translation:晶体管包括掩埋基极P区域(13),具有细长部分(指状物),深触点P +基极区域(15),用于平衡电阻器功能的发射极N +互连区域(16,17)的掩埋发射极N +区域(14) 和基极,发射极和集电极表面接触电极。 为了提供更高的电流增益和更大的安全操作区域,对于每个发射器“手指”(14),存在插入在“手指”(14)和相应的“手指”(14)的部分(16)之间的屏蔽P区域(22) N +互连区域和延伸到“手指”并且通过专用电极(23)表面连接到屏蔽P区域(22)的触点N +区域(17A)。
Abstract:
The invention relates to semiconductor devices having improved quality and reliability features, wherein the wire leads which connect the semiconductor chip to the pins extend unbroken and are bonded twice on each pin to improve the bonding reiability. The invention also concerns a method for manufacturing such a semiconductor device.