公开(公告)号：US20080278540A1

公开(公告)日：2008-11-13

申请号：US11871582

申请日：2007-10-12

Applicant: Chun-Hung Lin ,  Chia-Chiang Chang ,  Chao-Kai Cheng ,  Chieh-Yi Huang ,  Wan-Wen Chiu

Inventor： Chun-Hung Lin ,  Chia-Chiang Chang ,  Chao-Kai Cheng ,  Chieh-Yi Huang ,  Wan-Wen Chiu

IPC: B41J2/135

CPC classification number: G02B5/201

Abstract: Atmospheric plasma inkjet printing apparatus and methods for fabricating color filters using the same. The atmosphere plasma inkjet printing apparatus includes a nozzle plate having a first column of nozzles and a second column of nozzles. An inkjet printhead module corresponds to the first column of nozzles. An atmospheric plasma module is corresponds to the second column of nozzles.

Abstract translation: 大气等离子体喷墨印刷装置及其制造方法。 气氛等离子体喷墨打印设备包括具有第一列喷嘴和第二喷嘴列的喷嘴板。 喷墨打印头模块对应于第一列喷嘴。 大气等离子体模块对应于第二列喷嘴。

公开(公告)号：US07446407B2

公开(公告)日：2008-11-04

申请号：US11217978

申请日：2005-08-31

Applicant: Chun-Hung Lin ,  Geng-Shin Shen

Inventor： Chun-Hung Lin ,  Geng-Shin Shen

IPC: H01L23/12 ,  H01L23/34 ,  H01L23/10 ,  H01L23/31 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L23/3114 ,  H01L23/13 ,  H01L23/36 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A chip package structure includes a substrate, a chip, a first B-stage adhesive, bonding wires, a heat sink and a molding compound. The substrate comprises a first surface, a second surface and a through hole. The chip is arranged on the first surface of the substrate and electrically connected thereto while the through hole of the substrate exposes a portion of the chip. The first B-stage adhesive is arranged between the chip and the first surface of the substrate, and the chip is attached to the substrate through the first B-stage adhesive. The bonding wires are connected between the chip exposed by the through hole and second surface of the substrate. The heat sink is arranged on the first surface of the substrate, covering the chip. The molding compound is arranged on the second surface of the substrate, covering a portion of the substrate and bonding wires.

Abstract translation: 芯片封装结构包括基板，芯片，第一B阶粘合剂，接合线，散热片和模塑料。 基板包括第一表面，第二表面和通孔。 芯片布置在基板的第一表面上并与之电连接，同时基板的通孔暴露芯片的一部分。 第一B级粘合剂布置在芯片和基板的第一表面之间，并且芯片通过第一B级粘合剂附接到基板。 接合线连接在由通孔暴露的芯片和基板的第二表面之间。 散热器布置在基板的第一表面上，覆盖芯片。 模塑料配置在基板的第二表面上，覆盖基板的一部分和接合线。

公开(公告)号：US20080195243A1

公开(公告)日：2008-08-14

申请号：US11674497

申请日：2007-02-13

Applicant: Chun-Hung Lin ,  Shy-Jay Lin ,  Heng-Hsin Liu ,  Chien-Hsun Lin ,  Jui-Chung Peng ,  Yao-Wen Guo

Inventor： Chun-Hung Lin ,  Shy-Jay Lin ,  Heng-Hsin Liu ,  Chien-Hsun Lin ,  Jui-Chung Peng ,  Yao-Wen Guo

IPC: G06F19/00

CPC classification number: H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for improving critical dimension of a substrate is provided. Manufacturing data of a plurality of critical dimension deviations corresponding to a plurality of areas on the substrate is collected. A plurality of sensitivity data corresponding to the plurality of areas is also collected. A plurality of exposure dosage offsets corresponding to the plurality of areas are calculated based on the plurality of critical dimension deviations and the plurality of sensitivity data.

Abstract translation: 提供了一种改善基板临界尺寸的方法。 收集对应于基板上的多个区域的多个临界尺寸偏差的制造数据。 还收集对应于多个区域的多个灵敏度数据。 基于多个临界尺寸偏差和多个灵敏度数据来计算对应于多个区域的多个曝光剂量偏移量。

公开(公告)号：US20080099429A1

公开(公告)日：2008-05-01

申请号：US11828321

申请日：2007-07-25

Applicant: Chao-Kai Cheng ,  Chieh-Yi Huang ,  Wan-Wen Chiu ,  Chun-Hung Lin ,  Chia-Chang Chang

Inventor： Chao-Kai Cheng ,  Chieh-Yi Huang ,  Wan-Wen Chiu ,  Chun-Hung Lin ,  Chia-Chang Chang

IPC: H01B13/00

CPC classification number: G02B5/201 ,  G03F7/0007 ,  G03F7/405

Abstract: Methods for repairing patterned structure of electronic devices. A first substrate with a patterned structure thereon is provided, wherein the patterned structure includes at least one defect. The defect corresponds to a defect region while the patterned structure corresponds to a main region. A first surface treatment is performed on the defect region such that the surface characteristics on the defect region are different from those on the main region. The defect region is repaired by inkjet printing. A second surface treatment is performed on the defect region such that the surface characteristics on the defect region are the same as those on the main region.

Abstract translation: 修复电子设备图案化结构的方法。 提供其上具有图案化结构的第一衬底，其中所述图案化结构包括至少一个缺陷。 缺陷对应于缺陷区域，而图案化结构对应于主要区域。 对缺陷区域进行第一表面处理，使得缺陷区域上的表面特性与主区域上的表面特性不同。 缺陷区域通过喷墨印刷修复。 对缺陷区域进行第二表面处理，使得缺陷区域上的表面特性与主区域上的表面特性相同。

公开(公告)号：US20080079749A1

公开(公告)日：2008-04-03

申请号：US11536078

申请日：2006-09-28

Applicant: Chun-Hung Lin ,  Tzu-Lan Shen

Inventor： Chun-Hung Lin ,  Tzu-Lan Shen

IPC: G09G5/02

CPC classification number: H04N9/73

Abstract: A white balance method is disclosed for image processing. Characteristic information of a portion of pixels in a first frame is detected. First pixels are selected when the characteristic information of the first pixels in the first frame meets an optical requirement. An average hue of the selected first pixels is obtained. A hue range the average hue belongs to is determined. Characteristic information of a portion of the pixels in a second frame is detected. Second pixels are selected when the characteristic information of the second pixels in the second frame meets the optical requirement and a pixel hue of the second pixels is within the hue range. A first average red-channel value, a first average green-channel value, and a first average blue-channel value of the selected second pixels are obtained for acquiring a gain of each color component of an image. The gain of each color component of the image is adjusted according to the hue range.

Abstract translation: 公开了用于图像处理的白平衡方法。 检测第一帧中的一部分像素的特征信息。 当第一帧中的第一像素的特征信息满足光学要求时，选择第一像素。 获得所选择的第一像素的平均色调。 色调范围所属的平均色调是确定的。 检测第二帧中的像素的一部分的特征信息。 当第二帧中的第二像素的特征信息满足光学要求并且第二像素的像素色调在色相范围内时，选择第二像素。 获得所选择的第二像素的第一平均红色通道值，第一平均绿色通道值和第一平均蓝色通道值，用于获取图像的每个颜色分量的增益。 图像的每个颜色分量的增益根据色调范围进行调整。

公开(公告)号：US20080066679A1

公开(公告)日：2008-03-20

申请号：US11564826

申请日：2006-11-29

Applicant: Chi-Hung Liu ,  Wen-Tzong Hsieh ,  Chen-Der Tsai ,  Chun-Hsien Su ,  Chih Wei Chen ,  Chun-Hung Lin

Inventor： Chi-Hung Liu ,  Wen-Tzong Hsieh ,  Chen-Der Tsai ,  Chun-Hsien Su ,  Chih Wei Chen ,  Chun-Hung Lin

IPC: C23F1/00 ,  C23C16/00

CPC classification number: H01J37/32366 ,  C23C16/513 ,  C23C16/54 ,  H01J37/32357 ,  H01J2237/032 ,  H05H1/2406 ,  H05H2001/2462

Abstract: A processing system is used for processing an object by a first fluid. The processing system includes a base and a plasma generation device. The base supports the object and the plasma generation device ionizes the first fluid. The plasma generation device includes at least one guiding element comprising a path guiding the first fluid to sequentially flow through a first position and a second position and at least one electrode element including a first electrode corresponding to the first position and a second electrode corresponding to the second position. The first and second electrodes energize the first fluid located between the first and second electrodes to form a second fluid, to thereby utilize the second fluid to perform surfacing, activating, cleaning, photoresist ashing or etching process on the object supported by the base.

Abstract translation: 处理系统用于通过第一流体处理物体。 处理系统包括基座和等离子体产生装置。 基座支撑物体，等离子体发生装置离子化第一流体。 等离子体产生装置包括至少一个引导元件，该引导元件包括引导第一流体顺序地流过第一位置和第二位置的路径，以及包括对应于第一位置的第一电极和对应于第一位置的第二电极的至少一个电极元件 第二名 第一和第二电极激励位于第一和第二电极之间的第一流体以形成第二流体，从而利用第二流体对由基座支撑的物体进行表面，活化，清洁，光致抗蚀剂灰化或蚀刻过程。

公开(公告)号：US20080063290A1

公开(公告)日：2008-03-13

申请号：US11896962

申请日：2007-09-07

Applicant: Chun-Hung Lin ,  Tung-Hai Wu

Inventor： Chun-Hung Lin ,  Tung-Hai Wu

IPC: G06K9/36

CPC classification number: H04N19/184 ,  H04N19/109 ,  H04N19/11 ,  H04N19/12 ,  H04N19/152 ,  H04N19/16 ,  H04N19/196 ,  H04N19/463 ,  H04N19/91

Abstract: A coding method and system with an adaptive bitplane coding mode is provided to code multiple bitplanes of a frame consisting of multiple macroblocks. Each bitplane consists of macroblock modes used by the macroblocks of the frame. The method includes the steps of: (A) initializing a bitplane coding mode of the frame as a compress mode; (B) coding the frame and the bitplanes to thereby obtain coded bitplanes, and calculating the bit number of coded bitplanes; (C) calculating the bit number of uncoded bitplanes; (D) executing step (A) when the bit number of coded bitplanes is smaller than the bit number of uncoded bitplanes; (E) initializing the bitplane coding mode of the frame as a raw mode when the bit number of coded bitplanes is not smaller than the bit number of uncoded bitplanes.

Abstract translation: 提供具有自适应位平面编码模式的编码方法和系统来对由多个宏块组成的帧的多个位平面进行编码。 每个位平面由帧的宏块使用的宏块模式组成。 该方法包括以下步骤：（A）将帧的位平面编码模式初始化为压缩模式; （B）对帧和位平面进行编码，从而获得编码位平面，并计算编码位面的比特数; （C）计算未编码位面的位数; （D）执行步骤（A），当编码位平面的位数小于未编码位板的位数时; （E）当编码位平面的位数不小于未编码位板的位数时，初始化帧的位平面编码模式为原始模式。

公开(公告)号：US20080048410A1

公开(公告)日：2008-02-28

申请号：US11507251

申请日：2006-08-22

Applicant: Chun-Hung Lin

Inventor： Chun-Hung Lin

IPC: B62K13/06

CPC classification number: B62K19/28 ,  B62K19/34

Abstract: A bicycle tube connector is a hollow body formed by the coupling of a left shell and a right shell. The tube connector further comprises a transverse rotational shaft connected with two branches of a chain stay, a down tube hole for retaining an obliquely downward down tube. When the bicycle tubes are connected within the tube connector, the left and the right shells are soldered together along the engaged border therebetween. Therefore, the various tubes of the bicycle are more firmly secured and the outlook of the bicycle frame is slick.

Abstract translation: 自行车管连接器是通过左壳和右壳的联接形成的中空体。 管连接器还包括与链条的两个分支连接的横向旋转轴，用于保持斜下方的管的下管孔。 当自行管连接在管连接器内时，左壳和右壳沿它们之间的接合边界被焊接在一起。 因此，自行车的各种管子更牢固地固定，并且自行车车架的外观是光滑的。

公开(公告)号：US20070290781A1

公开(公告)日：2007-12-20

申请号：US11695060

申请日：2007-04-02

Applicant: Wen-Sheng Chen ,  Chun-Hung Lin

Inventor： Wen-Sheng Chen ,  Chun-Hung Lin

IPC: H01F27/30

CPC classification number: H01F27/326 ,  H01F3/10 ,  H01F27/303 ,  H01F27/325 ,  H01F30/10 ,  H01F2005/022

Abstract: Coil frames and transformers are provided. A coil frame includes a sub-coil-frame and an extended frame. The sub-coil-frame is utilized for winding a metal coil thereon. The extended frame is attached to the sub-coil-frame. The extended frame has a hole and a protrusion. The hole of the coil frame can be connected with the protrusion of another coil frame.

Abstract translation: 提供线圈框架和变压器。 线圈框架包括子线圈框架和延伸框架。 子线圈框架用于在其上缠绕金属线圈。 延伸框架连接到子线圈框架。 延伸框架具有孔和突起。 线圈框架的孔可以与另一个线圈架的突起连接。

公开(公告)号：US20070235871A1

公开(公告)日：2007-10-11

申请号：US11400182

申请日：2006-04-10

Applicant: Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Chiu

Inventor： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Chiu

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.

Abstract translation: 高频IC封装主要包括衬底，凸起芯片和多个导电填料，其中衬底具有从顶表面到底表面穿透的多个凸起孔。 芯片的有源表面以分别插入到凸块孔中的方式附接到基板的顶表面。 导电填料形成在凸起孔中，以将凸块电连接到基板的电路层。 高频IC封装具有更短的电路径和更薄的封装厚度。