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公开(公告)号：JP2017047448A
公开(公告)日：2017-03-09
申请号：JP2015172345
申请日：2015-09-01
Applicant: 古河電気工業株式会社 , FCM株式会社
Abstract: 【課題】本発明は、Cuパイプ相当部の厚さを厚くした、Al材およびCuパイプを一体化してなる銅被覆アルミニウム複合押出材の製造方法等を提供する。 【解決手段】Cu系材料からなる円筒状のCuパイプ22、およびAl系材料からなる円柱状のAl材21を、500℃における変形抵抗値の比が10未満になるようにそれぞれ選択する第1工程S1と、Cuパイプ22にAl材21を装入する第2工程S2と、Al材21が装入されたCuパイプ22内を真空引きした状態でCuパイプ22の両端開口を密封して、Al材21が真空封入されたCuパイプ22の複合ビレット23を形成する第3工程S3と、複合ビレット23を400〜450℃に加熱しながら熱間押出しすることにより、Al材21およびCuパイプ22が一体化してなる棒状の銅被覆アルミニウム複合押出材20を得る第4工程S4とを含む銅被覆アルミニウム複合押出材20の製造方法。 【選択図】図2
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公开(公告)号：JP2014007195A
公开(公告)日：2014-01-16
申请号：JP2012139934
申请日：2012-06-21
Inventor： SHIROSAKI KENJI , AKUTA YASUO
Abstract: PROBLEM TO BE SOLVED: To provide a coil whose space factor can be improved by increasing the integration of conductor base wires forming a flat wire.SOLUTION: A coil 10 is formed by winding a flat wire 20 which has, on each of its both end sides in a thickness direction X, a lamination face 21 with a width greater than the thickness. The flat wire 20 is wound along a spiral axis direction in such a manner that a spiral face is formed by the lamination face 21. The flat wire 20 is formed by arranging, along a width direction Y, a plurality of conductor base wires 50 which are narrower than the lamination face 21. Among the plurality of conductor base wires 50, a pair of conductor base wires 50, 50 facing each other in the width direction Y of the flat wire 20 are provided with fitting means 70 for fitting the pair of conductor base wires 50, 50 to each other.
Abstract translation: 要解决的问题：提供一种线圈，其可以通过增加形成扁线的导体基线的集成来提高空间系数。解决方案：线圈10通过卷绕扁线20形成，扁平线20在其两端 在厚度方向X侧，宽度大于厚度的层叠面21。 扁平线20沿着螺旋轴方向缠绕，使得螺旋面由层叠面21形成。扁线20通过沿宽度方向Y布置多个导体基底线50而形成， 比层叠面21窄。在多根导体基线50中，在扁线20的宽度方向Y上彼此面对的一对导体基线50,50设置有装配装置70，用于将一对 导体基线50,50彼此连接。
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公开(公告)号：JP2007115882A
公开(公告)日：2007-05-10
申请号：JP2005305455
申请日：2005-10-20
Applicant: Fcm Kk , Fcm株式会社 , Fujimori Kogyo Co Ltd , 藤森工業株式会社
Inventor： NAGATSUKA TOMOSHI , HIRANO MASAYOSHI , OISHI NORIO , MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding material having high conductivity and transmittivity which can prevent the corrosion of a metal silver of a fine wiring pattern formed on a transparent base material and the peeling of the fine wiring pattern from the transparent base material, and to provide a manufacturing method thereof.
SOLUTION: The electromagnetic wave shielding material having a fine wiring pattern formed on one surface of the transparent base material is characterized in that the fine wiring pattern of a developed silver layer generated by a photographic method is formed on the one surface of the transparent base material, and a copper (Cu) plating layer is laminated on the developed silver layer.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供一种具有高导电性和透射率的电磁波屏蔽材料，其能够防止形成在透明基材上的精细布线图案的金属银的腐蚀和精细布线图案从 透明基材，并提供其制造方法。 解决方案：具有形成在透明基材的一个表面上的精细布线图案的电磁波屏蔽材料的特征在于，通过照相方法产生的显影银层的精细布线图形形成在 透明基材，并且在显影的银层上层叠铜（Cu）电镀层。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2007115880A
公开(公告)日：2007-05-10
申请号：JP2005305453
申请日：2005-10-20
Applicant: Fcm Kk , Fcm株式会社 , Fujimori Kogyo Co Ltd , 藤森工業株式会社
Inventor： NAGATSUKA TOMOSHI , FUCHU JUNKO , OISHI NORIO , MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding material having high conductivity and transmittivity which can prevent the corrosion of a metal silver of a fine wiring pattern formed on a transparent base material and the peeling of the fine wiring pattern from the transparent base material, and to provide a manufacturing method thereof. SOLUTION: The electromagnetic shielding material is characterized in that a fine wiring pattern of a developed silver layer formed by a photographic method is provided on one surface of the transparent material, and a metal nickel layer made of plating is laminated on the developed silver layer. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：提供一种具有高导电性和透射率的电磁波屏蔽材料，其能够防止形成在透明基材上的精细布线图案的金属银的腐蚀和精细布线图案从 透明基材，并提供其制造方法。 解决方案：电磁屏蔽材料的特征在于，在透明材料的一个表面上设置通过照相方法形成的显影银层的精细布线图案，并且将由电镀制成的金属镍层层压在显影剂 银层。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2006118001A
公开(公告)日：2006-05-11
申请号：JP2004307115
申请日：2004-10-21
Inventor： MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide a method for forming an Sn alloy thin film which has adequate solderability (low melting point) while preventing a whisker from forming, and has thin and uniform thickness.
SOLUTION: The method for forming the thin film of the Sn-Ag-Cu ternary alloy on a substrate comprises immersing the substrate into a plating bath and electroplating it to form the thin film of the Sn-Ag-Cu ternary alloy on the whole area or a part of the substrate. The plating bath includes at least an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent. The inorganic chelating agent is blended at a ratio of 1 to 300 pts. by mass with respect to the Ag compound of 1 pt. by mass, and the organic chelating agent is blended at a ratio of 1 to 200 pts. by mass with respect to the Cu compound of 1 pt. by mass.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种形成Sn合金薄膜的方法，其具有足够的可焊性（低熔点），同时防止晶须形成，并且具有薄且均匀的厚度。 解决方案：在基板上形成Sn-Ag-Cu三元合金薄膜的方法包括将基板浸入镀浴中并对其进行电镀以形成Sn-Ag-Cu三元合金薄膜 整个区域或基底的一部分。 镀浴至少包含Sn化合物，Ag化合物，Cu化合物，无机螯合剂和有机螯合剂。 将无机螯合剂以1〜300个比例混合。 相对于1重量％的Ag化合物。 ，有机螯合剂以1〜200个比例混合。 相对于1重量份的Cu化合物。 的质量。 版权所有（C）2006，JPO＆NCIPI
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Patent Agency Ranking26.发明专利
公开(公告)号：JP2005149871A
公开(公告)日：2005-06-09
申请号：JP2003384787
申请日：2003-11-14
Inventor： MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide a wire for electric wire cable forming a protective layer not spoiling resistivity provided to the conductor itself and without the occurrence of pin holes.
SOLUTION: The wire for the electric wire cable has the protective layer consisting of zinc or zinc alloy over a whole surface or a part of the conductor made of copper or copper alloy. The conductor has an activating process carried out on it beforehand to the surface the protective layer is formed. Moreover, the protective layer is formed in a thickness of 0.001 to 1 μm on the surface of the conductor which has activating process carried out to it.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供一种形成保护层的电线电缆，不会破坏导体本身的电阻率，而不会产生针孔。
解决方案：电线电缆的导线在整个表面或由铜或铜合金制成的导体的一部分上具有由锌或锌合金构成的保护层。 导体具有预先在其上形成保护层的表面上进行的激活处理。 此外，在对其进行了激活处理的导体的表面上形成厚度为0.001〜1μm的保护层。 版权所有（C）2005，JPO＆NCIPI
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27.发明专利Conductive sheet for non-contact ic card with built-in antenna, and non-contact ic card with built-in antenna 审中-公开具有内置天线的非接触式IC卡和内置天线的非接触式IC卡的导电片
公开(公告)号：JP2005025514A
公开(公告)日：2005-01-27
申请号：JP2003190319
申请日：2003-07-02
Inventor： MIURA SHIGENORI
IPC: B42D15/10 , G06K19/07 , G06K19/077 , H01Q1/22 , H01Q7/00 , H05K1/16 , H05K3/06 , H05K3/38 , H05K3/42
CPC classification number: H01Q1/2225 , G06K19/07779 , G06K19/07783 , H01Q1/22 , H01Q7/00 , H05K1/165 , H05K3/064 , H05K3/388 , H05K3/426 , H05K2203/1394
Abstract: PROBLEM TO BE SOLVED: To provide a conductive sheet for a non-contact IC card with a built-in antenna whose electric connectivity is highly reliable, whose circuit pattern formation is satisfactory, and whose producing efficiency is satisfactory. SOLUTION: This conductive sheet for a non-contact IC card with a built-in antenna is constituted by forming conductive layers on both faces of an insulating substrate, and electrically connecting the conductive layers on both faces through a through-hole or via-hole opened so as to be put through the insulating substrate. The conductive layers are directly formed on the insulating substrate, and configured in the same way on the wall face of the through-hole or the inside of the via-hole and on both faces of the insulating substrate, and the conductive layers constitutes a circuit including an antenna. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种具有电气连接性高可靠性的内置天线的非接触IC卡的导电片，其电路图形形成令人满意，其制造效率令人满意。 解决方案：用于具有内置天线的非接触IC卡的导电片通过在绝缘基板的两个表面上形成导电层，并且通过通孔或两个表面电连接两个导电层， 通孔打开以穿过绝缘基板。 导电层直接形成在绝缘基板上，并且以相同的方式配置在通孔的壁面或通孔的内侧以及绝缘基板的两个面上，导电层构成电路 包括天线。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2004143547A
公开(公告)日：2004-05-20
申请号：JP2002311001
申请日：2002-10-25
Inventor： MIURA SHIGENORI
IPC: B32B15/01 , B32B15/08 , C23C14/16 , C23C28/00 , C23C28/02 , C23C30/00 , C25D5/10 , C25D5/30 , C25D5/44 , C25D5/50 , C25D7/00 , H01L21/28 , H01L21/288
CPC classification number: B32B15/08 , B32B7/12 , B32B15/017 , B32B15/20 , B32B2309/105 , B32B2311/24 , C23C14/165 , C23C28/023 , C23C30/00 , C25D5/10 , C25D5/50 , Y10T428/12438 , Y10T428/12569 , Y10T428/12736
Abstract: PROBLEM TO BE SOLVED: To provide an aluminum stabilized laminate in which the aluminum surface of an aluminum-based material used for electrical and electronic parts, semiconductor circuits, automobile-related products, etc., is stabilized by a simplified method. SOLUTION: In the aluminum stabilized laminate, a stabilizing layer composed of metal and having 0.001 to 1μm thickness is laminated by sputtering, vapor deposition or ion plating on the whole surface of a thin film whose surface is composed of at least aluminum. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2004128158A
公开(公告)日：2004-04-22
申请号：JP2002288995
申请日：2002-10-01
Inventor： MIURA SHIGENORI
CPC classification number: H05K9/0084 , C23C14/20
Abstract: PROBLEM TO BE SOLVED: To provide an electromagnetic shielding material which is abundant in flexibility and can simultaneously shield electromagnetic waves of a low frequency and a high frequency by thinning the material so as to make it correspond to thinned and miniaturized various products.
SOLUTION: In the electromagnetic wave shielding material, a shielding layer 103 whose thickness is 1 to 8μm and which is formed of at least one type selected from a group comprising Ni, Fe, Co, Ti, Zn, Cr, Sn and Cu and alloy comprising at least one type of the metals is formed on a surface of a polymer film 101 by one or two or above layers by a vapor deposition method or plating method.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2004071695A
公开(公告)日：2004-03-04
申请号：JP2002226036
申请日：2002-08-02
Inventor： MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide a conductive sheet where an insulating film and a conductive layer have sufficient coherency, and hence the separation of the insulating film from the conductive layer is prevented, the thickness of the conductive layer becomes moderate, and a pattern can be fined.
SOLUTION: In the conductive sheet, the conductive layer is formed on at least one surface of the insulating film. The insulating film contains a filler, or a layer containing the filler is formed on at least one surface of the insulating film. The filler is removed by etching treatment for allowing the surface to be subjected to roughening treatment, and the conductive layer is formed on the surface that has been subjected to the roughening treatment.
COPYRIGHT: (C)2004,JPO
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