公开(公告)号：WO2006036904A1

公开(公告)日：2006-04-06

申请号：PCT/US2005/034465

申请日：2005-09-23

Applicant: IDC, LLC ,  TUNG, Ming-Hau ,  ARBUCKLE, Brian, W. ,  FLOYD, Philip, D. ,  CUMMINGS, William, J.

Inventor： TUNG, Ming-Hau ,  ARBUCKLE, Brian, W. ,  FLOYD, Philip, D. ,  CUMMINGS, William, J.

IPC: G02B26/00

CPC classification number: G02B26/001

Abstract: A support structure (18) within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure (18) and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure (18) and a substrate layer (20). In another embodiment, increased adhesion is achieved between a support structure (18) and a moveable layer (14). Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Abstract translation: 干涉式调制器装置内的支撑结构（18）可接触装置内的各种其它结构。 支撑结构（18）和其它结构之间的增加的结合强度可以以各种方式实现，例如通过在支撑结构和其它结构之间的界面处提供粗糙化的表面和/或粘合材料。 在一个实施例中，在支撑结构（18）和基底层（20）之间实现增加的粘合。 在另一个实施例中，在支撑结构（18）和可移动层（14）之间实现增加的附着。 增加的粘合力可以减少支撑结构和它们在干涉式调制器内附着的其它结构之间的不希望的滑动。