公开(公告)号：US20080001283A1

公开(公告)日：2008-01-03

申请号：US11679268

申请日：2007-02-27

Applicant: Ha Na LEE ,  Seung Taek YANG

Inventor： Ha Na LEE ,  Seung Taek YANG

IPC: H01L23/34

CPC classification number: H01L25/0657 ,  H01L23/367 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A stack package includes a base substrate having connection pads on an upper surface thereof and ball lands on a lower surface thereof; at least two semiconductor chips stacked by intervening a spacer on the base substrate and defined with through-holes for electrical connections on positions corresponding to the connection pads; electrical connection members for electrically connecting the stacked semiconductor chips and the base substrate to each other; a pair of heat sinks formed such that they contact the side surfaces of the stacked semiconductor chips and extend in a direction perpendicular to the base substrate; and outside connection terminals attached to the ball lands located on the lower surface of the base substrate.

Abstract translation: 堆叠封装包括在其上表面上具有连接焊盘的基底基板，并且在其下表面上具有焊盘; 至少两个半导体芯片通过在基底衬底上插入间隔物并且与对应于连接焊盘的位置上的用于电气连接的通孔间隔开来堆叠; 用于将堆叠的半导体芯片和基底基板彼此电连接的电连接构件; 一对散热片形成为使得它们接触堆叠的半导体芯片的侧表面并且在垂直于基底基板的方向上延伸; 以及附接到位于基底基板的下表面上的球接头的外部连接端子。

公开(公告)号：USD535940S1

公开(公告)日：2007-01-30

申请号：US29235498

申请日：2005-08-03

Applicant: Chang Ho Lee ,  Ha Na Lee

Designer： Chang Ho Lee ,  Ha Na Lee

公开(公告)号：USD498458S1

公开(公告)日：2004-11-16

申请号：US29196461

申请日：2003-12-31

Applicant: Chang Ho Lee ,  Ha Na Lee ,  Dong-Hwa Lee

Designer： Chang Ho Lee ,  Ha Na Lee ,  Dong-Hwa Lee

公开(公告)号：USD497143S1

公开(公告)日：2004-10-12

申请号：US29196484

申请日：2003-12-31

Applicant: Chang Ho Lee ,  Ha Na Lee ,  Dong-Hwa Lee

Designer： Chang Ho Lee ,  Ha Na Lee ,  Dong-Hwa Lee