公开(公告)号：EP0809924A1

公开(公告)日：1997-12-03

申请号：EP96905530.0

申请日：1996-02-16

Applicant: MICROMODULE SYSTEMS, INC.

Inventor： MOK, Sammy, L.

IPC: H01L25 ,  H01L23 ,  H05K7

CPC classification number: H05K7/1061 ,  H01L23/4006 ,  H01L23/552 ,  H01L24/73 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A mounting assembly for a multiple chip module (13) or other circuit module, which includes a board (11) having a surface including an array of board contacts (22) such as a printed wiring board in a computer system. A circuit module, such as multiple chip module (13), having a first surface and a second surface is included. The circuit module includes an array of circuit contacts (23) on the first surface of the module. An interposer (12) between the board (11) and the first surface of the circuit module, includes conductors (21) between the circuit contacts in the array of circuit contacts (23) on the circuit module and board contacts in the array of board contacts (22) on the board. A thermal bridge member (15) contacts the second surface of the circuit module.

公开(公告)号：EP0779989A1

公开(公告)日：1997-06-25

申请号：EP95931069.0

申请日：1995-09-08

Applicant: MICROMODULE SYSTEMS, INC.

Inventor： LIU, Ken, Kuang-Fu ,  MIN, Byoung-Youl ,  MOTI, Robert, John ,  HUSAIN, Syed, A.

IPC: G01R1 ,  H01L21

CPC classification number: G01R1/0735

Abstract: First and second bumps (9) electrically connected at first and second positions (62, 63) along a conductive run (52) borne by a flexible substrate (10) are respectively oriented for contact with a pad (8) of a die (2) under test and a pad (20) of a tester structure (1). Second (66, 98) and third (68, 100) conductive regions are electrically connected respectively to the power (Vcc) and ground (Vss) terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region (68, 91) to filter high-frequency noise components from power and ground potentials provided by the power source.

公开(公告)号：EP0779987A1

公开(公告)日：1997-06-25

申请号：EP95931721.0

申请日：1995-09-08

Applicant: MICROMODULE SYSTEMS, INC. ,  TOKYO ELECTRON LIMITED

Inventor： LIU, Ken, Kuang-Fu ,  MIN, Byoung-Youl ,  SATO, Kunio ,  SATO, Takashi

IPC: G01R1 ,  H01L21

CPC classification number: G01R1/0735

Abstract: First (46) and second (62, 63) bumps electrically connected at first and second positions along a conductive run (52) borne by a flexible substrate (10) are respectively oriented for contact with a pad (8) of a die under test (2) and a pad (88, 89) of a tester. A probe frame (32) is bonded to the substrate between connector frames (34) bonded at opposite ends of the substrate (10). Alternatively, a pair of bumps (46, and 62, 63) exposed on the same surface of a flexible substrate (10) are electrically connected at different positions along on conductive run (52). One of the bumps (46) is oriented for contact with a pad (8) of a die under test (2), and the other (62, 63) is in contact with a pad (88, 89) on a surface of a printed circuit board (5) directed away from the die (2). The pad (88, 89) of the printed circuit board (5) is provided for electrical connection to a tester.

Abstract translation: 沿着由柔性基板（10）承载的导电路径（52）在第一位置和第二位置处电连接的第一（46）和第二（62,63）凸块分别定向用于与被测试芯片的焊盘（8） （2）和测试器的衬垫（88,89）。 探针框架（32）在基底（10）的相对端处结合的连接器框架（34）之间结合到基底。 或者，暴露在柔性衬底（10）的同一表面上的一对凸块（46和62,63）在导电线路（52）上沿不同位置电连接。 其中一个凸起（46）被定向用于与被测试的模具（2）的垫（8）接触，并且另一个（62,63）与一个表面上的垫（88,89）接触 印制电路板（5）远离模具（2）。 印刷电路板（5）的垫（88,89）被提供用于电连接到测试器。