Abstract:
Reducing the microvoid (MV) density in AlN ameliorates numerous problems related to cracking during crystal growth, etch pit generation during the polishing, reduction of the optical transparency in an AlN wafer, and, possibly, growth pit formation during epitaxial growth of AlN and/or AlGaN. This facilitates practical crystal production strategies and the formation of large, bulk AlN crystals with low defect densities - e.g., a dislocation density below 10 4 cm -3 and an inclusion density below 10 4 cm -3 and/or a MV density below 10 4 cm -3 .
Abstract translation:降低AlN中的微孔(MV)密度改善了与晶体生长期间的开裂有关的许多问题,抛光期间的蚀刻坑产生,AlN晶片中的光学透明度的降低以及可能的AlN的外延生长期间的生长凹坑形成和/ 或AlGaN。 这有助于实际的晶体生产策略和形成具有低缺陷密度的大的大块AlN晶体 - 例如,位错密度低于10 -4 cm -3,并且包含密度低于 而且,或者低于10 -4 cm -3的MV密度。
Abstract:
Reducing the microvoid (MV) density in AlN ameliorates numerous problems related to cracking during crystal growth, etch pit generation during the polishing, reduction of the optical transparency in an AlN wafer, and, possibly, growth pit formation during epitaxial growth of AlN and/or AlGaN. This facilitates practical crystal production strategies and the formation of large, bulk AlN crystals with low defect densities - e.g., a dislocation density below 10 4 cm -3 and an inclusion density below 10 4 cm -3 and/or a MV density below 10 4 cm -3 .
Abstract translation:减少AlN中的微空隙(MV)密度减少了与晶体生长期间的开裂,抛光期间的蚀刻坑生成,AlN晶片中的光学透明度降低以及可能的生长坑 在AlN和/或AlGaN的外延生长期间形成。 这有利于实际的晶体生产策略和形成具有低缺陷密度的大的块状AlN晶体 - 例如位错密度低于10 4 cm -3和夹杂物密度低于 10 4 cm -3和/或中密度密度低于10 4 cm -3。 p>
Abstract:
A pane is separated from a moving ribbon of brittle material by restraining the ribbon upstream of a score line prior to separating the pane. The ribbon is restrained by selectively contacting a first side and a second side of the ribbon in one of an opposite, overlapping or offset relation. The ribbon can be restrained prior to, substantially simultaneous with or subsequent to forming the score line. The restrained status of the ribbon is maintained during and immediately after separation of the pane from the ribbon, thereby reducing the introduction of a disturbance or bending moment into the upstream ribbon.
Abstract:
A hydraulic housing for a solenoid valve is provided having a polymeric housing body with at least three control volumes intersected by a central bore with at least two of said control volumes being intersected by a radial passage. At least three axially spaced annular metallic bearing members are provided with at least two annular metallic bearing members providing control volume boundaries. The bearing members are permanently affixed within the polymeric body and have concentric inner diameters for receipt of a spool valve. The inner diameters of the bearing members are machined after the bearing members are affixed within the polymeric body.
Abstract:
A method and appa ratus for recovering spent drilling mud, the apparatus comprising a mixer (20) to mix flocculants with spent drilling mud to produce a mixture, heating said mixture with a heating apparatus (314) to produce a heated mixture, and separating d rilling mud w ith a separating apparatus (330) from the heated mixture to produce separated drilling mud.
Abstract:
The complete genomic structure of the peroxisome proliferator-activated receptor alpha gene is described. Also described are the identification of novel single nucleotide polymorphisms and association with higher plasma LDL-cholesterol and total and LDL-apolipoprotein B concentrations.
Abstract:
Semiconductor structures and devices based thereon include an aluminum nitride single-crystal substrate and at least one layer epitaxially grown thereover. The epitaxial layer may comprise at least one of AlN, GaN, InN, or any binary or tertiary alloy combination thereof, and have an average dislocation density within the semiconductor heterostructure is less than about 10 6 cm -2 . Bulk single crystals of AlN have a diameter greater than about 25 mm and dislocation densities of about 10,000 cm -2 or less, and high-quality AlN substrates have surfaces of any desired crystallographic orientation fabricated from these bulk crystals.
Abstract translation:基于此的半导体结构和器件包括氮化铝单晶衬底和在其上外延生长的至少一个层。 外延层可以包括AlN,GaN,InN或其任何二元或三元合金组合中的至少一种,并且具有在半导体异质结构内的平均位错密度小于大约10 6 cm / cm -2 SUP>。 AlN的块状单晶具有大于约25mm的直径和约10,000cm -2或更小的位错密度,并且高质量的AlN衬底具有由这些块状晶体制造的任何期望的晶体取向的表面 。