公开(公告)号：WO2011122846A3

公开(公告)日：2012-01-12

申请号：PCT/KR2011002177

申请日：2011-03-30

Applicant: POINT ENGINEERING CO LTD ,  NAM KI-MYUNG ,  SONG TAE-HWAN ,  JUN YOUNG-CHUL

Inventor： NAM KI-MYUNG ,  SONG TAE-HWAN ,  JUN YOUNG-CHUL

IPC: H01L33/62 ,  H01L33/64

CPC classification number: H01L25/0753 ,  H01L24/73 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K1/05 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention relates to an optical device and to a method for manufacturing same. The technical aim of the invention is to easily dissipate heat generated by a light-emitting chip, and configure a surface light-emitting body having a single or a plurality of light-emitting chips arranged in series, in parallel, or in series and in parallel on the surface light-emitting body, without requiring a separate wiring layer. To achieve said aim, an optical device of the present invention comprises: a substrate; a plurality of light-emitting chips disposed on the substrate; a plurality of conductive wires electrically connecting the substrate and the light-emitting chips, such that the plurality of light-emitting chips are connected to the substrate in series, in parallel, or in series and in parallel; and a protective layer covering the light-emitting chips and the conductive wires on the substrate.

Abstract translation: 光学装置及其制造方法技术领域本发明涉及光学装置及其制造方法。 本发明的技术目的是容易地散发由发光芯片产生的热量，并且构成具有单个或多个发光芯片的表面发光体，其串联，并联或串联布置 平行于表面发光体，而不需要单独的布线层。 为了实现上述目的，本发明的光学装置包括：基板; 设置在所述基板上的多个发光芯片; 电连接所述基板和所述发光芯片的多个导线，使得所述多个发光芯片串联连接到所述基板，并联或并联连接; 以及覆盖基板上的发光芯片和导线的保护层。

公开(公告)号：WO2011034304A3

公开(公告)日：2011-05-19

申请号：PCT/KR2010006037

申请日：2010-09-06

Applicant: POINT ENGINEERING CO LTD ,  AHN BUM MO ,  NAM KI MYUNG ,  SONG TAE HWAN

Inventor： AHN BUM MO ,  NAM KI MYUNG ,  SONG TAE HWAN

IPC: H01L33/64

CPC classification number: H01L33/62 ,  H01L24/73 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2933/0066 ,  H05K1/05 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention relates to a substrate for an optical device, which can easily dissipate heat from the optical device, to an optical device, and to a method for manufacturing same. According to one embodiment, a substrate for an optical device is disclosed, comprising: a metal substrate having an upper surface on which the optical device is mounted; a pair of insulating layers formed on the metal substrate and spaced apart from each other with the optical device interposed therebetween; and a pair of electrode layers formed on the insulating layers.

Abstract translation: 光学装置用基板及光学装置及其制造方法技术领域本发明涉及能够容易地从光学装置散热的光学装置用基板，光学装置及其制造方法。 根据一个实施例，公开了一种用于光学装置的基板，包括：金属基板，具有上表面，光学装置安装在该上表面上; 一对绝缘层，形成在所述金属基板上并且隔着所述光学器件而相互隔开; 以及形成在绝缘层上的一对电极层。

公开(公告)号：WO2023033417A1

公开(公告)日：2023-03-09

申请号：PCT/KR2022/012377

申请日：2022-08-19

Applicant: POINT ENGINEERING CO., LTD.

Inventor： AHN, Bum Mo ,  PARK, Seung Ho ,  HONG, Chang Hee

IPC: G01R1/067 ,  G01R1/073

Abstract: Proposed are an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof, and a vertical probe card having the same.

公开(公告)号：WO2010095811A3

公开(公告)日：2010-10-14

申请号：PCT/KR2009007852

申请日：2009-12-29

Applicant: POINT ENGINEERING CO LTD ,  NAM KI MYUNG

Inventor： NAM KI MYUNG

IPC: H01L33/64

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/053 ,  H05K1/183 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: The present invention relates to a substrate for an optical device, to an optical device package comprising the same and to a production method for the same. According to the present invention, the substrate for an optical device, the optical device package comprising the same and the production method for the same may comprise: a metal substrate; a first anodised layer which is formed on the top surface of the metal substrate and insulates the metal substrate; and a first and a second electrode formed insulated from each other on top of the first anodised layer.

Abstract translation: 本发明涉及一种用于光学器件的基板，涉及包括该光学器件的光学器件封装及其制造方法。 根据本发明，用于光学器件的基板，包括该光学器件的光学器件封装及其制造方法可以包括：金属基板; 第一阳极氧化层，其形成在所述金属基板的顶表面上并使所述金属基板绝缘; 以及在第一阳极氧化层的顶部彼此绝缘的第一和第二电极。

公开(公告)号：WO2022139511A1

公开(公告)日：2022-06-30

申请号：PCT/KR2021/019741

申请日：2021-12-23

Applicant: POINT ENGINEERING CO., LTD.

Inventor： AHN, Bum Mo ,  PARK, Seung Ho ,  SONG, Tae Hwan

IPC: H01L33/20 ,  H01L33/48 ,  H01L23/00 ,  H01L25/075

Abstract: A micro device, an alignment apparatus for a micro device, and an alignment method using the same are proposed. The micro device, the alignment apparatus for a micro device, and the alignment method using the same, the micro device being surface-aligned at at least any one of an upper surface and a lower surface thereof when being mounted to a substrate and are direction-aligned in any one direction when being mounted to the substrate, are configured to achieve surface alignment and direction alignment simultaneously of a plurality of micro devices, the micro devices being not surface-aligned at at least any one of the upper and lower surfaces thereof and not direction-aligned in any one direction simultaneously.

公开(公告)号：WO2022108332A1

公开(公告)日：2022-05-27

申请号：PCT/KR2021/016894

申请日：2021-11-17

Applicant: POINT ENGINEERING CO., LTD.

Inventor： AHN, Bum Mo ,  PARK, Seung Ho ,  SONG, Tae Hwan

IPC: C23C16/509 ,  C23C16/44 ,  C23C16/455 ,  C23C16/40 ,  H01J37/32 ,  H01L21/67

Abstract: Proposed are a gas supplier and a substrate deposition apparatus. The gas supplier is made of a material different from that of conventional gas suppliers so as to exhibit minimized bending deformation in a high-temperature environment, thereby enabling improvement in the quality of a fine pattern.

公开(公告)号：WO2013009082A2

公开(公告)日：2013-01-17

申请号：PCT/KR2012005479

申请日：2012-07-11

Applicant: POINT ENGINEERING CO LTD ,  NAM KI MYUNG ,  JUN YOUNG CHUL ,  SONG TAE HWAN

Inventor： NAM KI MYUNG ,  JUN YOUNG CHUL ,  SONG TAE HWAN

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/647 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48505 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated with the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprise: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, is connected to both side surfaces of the optical element substrate, respectively, and is wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which is made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and is wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means.

Abstract translation: 本发明涉及一种用于光学器件的基板，其被配置为以适配的方式连接光学元件基板和电极基板，并且同时形成一个或多个桥接垫，所述一个或多个桥接垫与光学元件基板通过 水平绝缘层，在光学元件基板上。 根据本发明第一方面的用于光学器件的基板包括：光学元件基板，其由金属板制成并且其中包含多个光学元件; 一对由绝缘材料制成以在其上表面的至少一部分上形成导电层的电极基板分别连接到光学元件基板的两个侧表面，并且电极引线接合到电极 的光学元件; 以及配合装置，其形成在电极基板和光学元件基板的侧表面上以配合光学元件基板和电极基板。 根据本发明的第二方面的用于光学器件的基板包括：由金属板制成并且其中包含多个光学元件的光学元件基板; 一对电极基板，其由金属材料分别连接到所述光学元件基板的两个侧表面，并且与所述光学元件的所述电极导线接合; 配合装置，其形成在电极基板和光学元件基板的侧表面上以配合光学元件基板和电极基板; 以及配合型垂直绝缘层，其介于所述光学元件基板和所述电极基板之间以连接至所述配合装置。

公开(公告)号：WO2011115395A3

公开(公告)日：2011-12-29

申请号：PCT/KR2011001756

申请日：2011-03-14

Applicant: POINT ENGINEERING CO LTD ,  NAM KI-MYUNG ,  SONG TAE-HWAN ,  JUN YOUNG-CHUL

Inventor： NAM KI-MYUNG ,  SONG TAE-HWAN ,  JUN YOUNG-CHUL

IPC: H01L33/64

CPC classification number: H01L33/642 ,  F21V19/045 ,  F21V29/004 ,  F21V29/74 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides an optical element substrate, an optical element device, and a manufacturing method thereof, in which heat of an optical element can be radiated easily. As one example, the optical element substrate comprises: a substrate which is made of metal and on which the optical element is settled on an upper side thereof; one pair of insulation layers which are formed in an upper part of the substrate and are isolated from each other around the optical element; and one pair of electrode layers which are formed in upper parts of the insulation layers.

Abstract translation: 本发明提供一种光学元件基板，光学元件装置及其制造方法，其中能够容易地照射光学元件的热量。 作为一个示例，光学元件基板包括：由金属制成并且光学元件在其上侧上安置的基板; 一对绝缘层，其形成在基板的上部并且围绕光学元件彼此隔离; 以及形成在绝缘层的上部的一对电极层。

公开(公告)号：WO2023033382A1

公开(公告)日：2023-03-09

申请号：PCT/KR2022/011456

申请日：2022-08-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： AHN, Bum Mo ,  PARK, Seung Ho ,  HONG, Chang Hee

IPC: G01R1/067 ,  G01R1/073

Abstract: Proposed are an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof, and a vertical probe card having the same.

公开(公告)号：WO2022139483A1

公开(公告)日：2022-06-30

申请号：PCT/KR2021/019652

申请日：2021-12-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： AHN, Bum Mo ,  PARK, Seung Ho ,  BYUN, Sung Hyun

IPC: H01F17/04 ,  H01F27/255 ,  H01F27/28 ,  H01F27/02

Abstract: An inductor and a body part for an inductor are proposed. The inductor and the body part satisfy needs for miniaturization and low resistance and increase a value of inductance thereof.