LOW PROFILE PROCESS KIT
    21.
    发明申请
    LOW PROFILE PROCESS KIT 审中-公开
    低配置工艺包

    公开(公告)号:WO2009132181A3

    公开(公告)日:2010-02-18

    申请号:PCT/US2009041528

    申请日:2009-04-23

    Abstract: Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in a radially outward direction from the inner edge toward the outer edge.

    Abstract translation: 本文提供了半导体衬底处理腔的衬底支撑件的工艺组件的实施例。 在一些实施例中,用于半导体处理室的处理套件可以包括基本上水平的并具有内部和外部边缘以及上部和下部表面的环形体; 靠近所述内边缘并从所述上表面垂直延伸的内唇缘; 以及设置在所述外边缘和所述下表面附近并且具有与所述基板支撑基座的表面相符的形状的外唇缘。 在一些实施例中,用于半导体处理室的处理套件包括具有内边缘和外边缘的环形体,并且具有上表面和下表面,所述上表面以约5-65度的向下角度设置在 从内缘朝向外缘的径向向外方向。

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