Light guide plate for surface light source device, and backlight unit using the same
    23.
    发明专利
    Light guide plate for surface light source device, and backlight unit using the same 有权
    用于表面光源装置的光导板和使用其的背光单元

    公开(公告)号:JP2012119305A

    公开(公告)日:2012-06-21

    申请号:JP2011206882

    申请日:2011-09-22

    Abstract: PROBLEM TO BE SOLVED: To provide a light guide plate for a surface light source device not only with high front-surface brightness but also with excellent uniformity of brightness, and further, capable of restraining a moire phenomenon.SOLUTION: In the light guide plate for a surface light source device including an incident surface with light incident from lamps arranged along a predetermined axis, an emission surface emitting the incident light and a rear surface facing the emission surface, a plurality of unit cells each with a microprism pattern carved on the rear surface are dispersedly arranged, wherein a crossing angle of a prism arrangement axis formed by an edge line direction of the microprism pattern and an arrangement axis of the lamps makes up an alternate angle. Furthermore, the light guide plate for a surface light source device has not only high front-surface brightness but also has excellent uniformity of brightness, and that, no moire phenomena is caused. When this is used for a backlight unit, use of an optical sheet laminated on the light guide plate can be reduced, thinning and simplification of manufacturing processes of a liquid crystal display module can be achieved, and also manufacturing cost can be reduced.

    Abstract translation: 要解决的问题:为了提供一种用于表面光源装置的导光板,不仅具有高的前表面亮度,而且具有优异的亮度均匀性,并且还能够抑制莫尔条纹现象。 解决方案:在用于表面光源装置的导光板中,包括从沿着预定轴排列的灯入射的入射表面的入射表面,发射入射光的发射表面和面向发射表面的后表面, 分散配置有分别配置在后表面上雕刻有微棱镜图案的单元电池,其中由微棱镜图案的边缘线方向形成的棱镜排列轴线与灯的布置轴线的交叉角成为交替的角度。 此外,用于表面光源装置的导光板不仅具有高的前表面亮度,而且具有优异的亮度均匀性,并且不会产生莫尔纹现象。 当将其用于背光单元时,可以减少层叠在导光板上的光学片的使用,从而可以实现液晶显示模块的制造工艺的薄化和简化,并且还可以降低制造成本。 版权所有(C)2012,JPO&INPIT

    複合長繊維不織布およびその製造方法
    27.
    发明专利
    複合長繊維不織布およびその製造方法 审中-公开
    连接纤维非织造织物及其制造方法

    公开(公告)号:JP2014227646A

    公开(公告)日:2014-12-08

    申请号:JP2014105102

    申请日:2014-05-21

    Abstract: 【課題】引張強度や剛軟度などの特性を損なうことなく、CO2の発生量を低減させた環境負荷の少ない不織布を、工業規模の生産において、高い生産性をもつ製造方法の提供。【解決手段】芯鞘型の長繊維をベルト上に積層してウェブを形成し、該ウェブを圧着することにより製造する不織布において、前記芯鞘型の長繊維を、石油由来組成物と植物由来組成物の含有割合が互いに異なる2つのビームとして、吐出し、冷却し、延伸することにより形成する繊維を形成する方法。具体的には、一方のビームを、芯成分をポリプロピレンとし、鞘成分を植物由来のポリエチレンとし、かつ、該芯成分と該鞘成分の質量比が50:50〜80:20となる様に構成し、他方のビームを、芯成分をポリプロピレンとし、鞘成分を石油由来のポリエチレンとし、かつ、該芯成分と該鞘成分の質量比が50:50となる様に構成する複合長繊維不織布の製造方法。【選択図】なし

    Abstract translation: 要解决的问题:提供一种通过在工业规模生产中以高生产率降低CO的产生而不降低特性如拉伸强度和耐弯曲性而降低环境负荷的方法。解决方案:在共轭长丝非织造织物 提供了通过在皮带上堆叠芯鞘型细丝以形成网状物并通过施加压力来固定网来制造的织物,提供了一种用于形成纤维的方法,包括:将芯鞘型细丝挤出成具有不同含量比的两束 石油衍生的组合物和植物来源的组合物之间的其它物质; 冷却挤压纤维; 并抽出冷却的纤维。 更具体地说,一根梁被构造成使得芯部件由聚丙烯构成,护套部件由植物来源的聚乙烯构成,核心部件与护套成分的质量比为50:50〜80:20, 其他梁被构造为使得芯部件由聚丙烯构成,鞘部件由石油衍生的聚乙烯组成,并且芯部件与鞘部件的质量比为50:50。

    Adhesive composition improved in electric reliability at high voltage, and adhesive tape for semiconductor packaging using the same
    28.
    发明专利
    Adhesive composition improved in electric reliability at high voltage, and adhesive tape for semiconductor packaging using the same 有权
    在高电压下改善电可靠性的胶粘组合物和使用其的半导体包装的胶粘带

    公开(公告)号:JP2014019869A

    公开(公告)日:2014-02-03

    申请号:JP2013125152

    申请日:2013-06-14

    CPC classification number: H01L2924/0002 H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition improved in electric reliability at high voltage, and an adhesive tape for semiconductor packaging using the same.SOLUTION: The adhesive composition of the present invention contains an epoxy hardener optimal for heightening fracture toughness of a hardened network by heightening a crosslink density in an epoxy resin base material, so that electric reliability is secured at a high voltage of not less than 30 V, and entanglement between molecules in the hardened network is strong to satisfy excellent adhesive strength at a high temperature of not less than 200°C. Thus, the adhesive composition, according to the present invention, is useful for an adhesive tape useful for a semiconductor-packaging field accompanying a high temperature process of not less than 200°C such as wire bonding and soldering, and can be usefully applied to a field such as elevator industry and semiconductor packaging for automobiles where high voltage is impressed.

    Abstract translation: 要解决的问题:提供改善高电压可靠性的粘合剂组合物和使用其的半导体封装用胶带。本发明的粘合剂组合物含有最佳的用于提高硬化的断裂韧性的环氧固化剂 网络通过提高环氧树脂基材中的交联密度,使得在不低于30V的高电压下确保电可靠性,并且硬化网络中的分子之间的缠结强,以在高温下满足优异的粘合强度 不低于200°C。 因此,根据本发明的粘合剂组合物可用于伴随着诸如引线键合和焊接等不低于200℃的高温工艺的半导体封装领域的粘合带,并且可以有用地应用于 诸如电梯行业和汽车的半导体封装领域,其中高压被印象深刻。

    Adhesive composition for masking tape of molded underfill process and masking tape using the same
    29.
    发明专利
    Adhesive composition for masking tape of molded underfill process and masking tape using the same 有权
    用于模制底片过程的屏蔽胶带和使用该胶带的胶带的胶粘组合物

    公开(公告)号:JP2013084873A

    公开(公告)日:2013-05-09

    申请号:JP2012006652

    申请日:2012-01-17

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition for a masking tape of a molded underfill process and to provide a masking tape using the adhesive composition.SOLUTION: According to the invention, an adhesive composition for a masking tape of a molded underfill process and the masking tape using the adhesive composition solve the problems of an existing acryl mold resealing adhesive layer, such as adhesive residue remaining on a PCB surface and marks on the surface occurring with several kinds of sealing materials (EMC), by forming an improved acryl mold releasing adhesive layer. Forming the improved acryl mold releasing adhesive layer prevents the adhesive residue on the PCB surface to improve the process failure rate and solves the problem of marks on the surface which occur with several kinds of EMC thereby allowing the masking tape using the adhesive composition to be applicable to several kinds of sealing materials used in MUF process. The invention makes such advantages.

    Abstract translation: 要解决的问题:提供一种用于模塑底部填充工艺的遮蔽胶带的粘合剂组合物,并使用该粘合剂组合物提供遮蔽胶带。 解决方案:根据本发明,用于模塑底部填充工艺的遮蔽胶带的粘合剂组合物和使用粘合剂组合物的胶带解决了现有的丙烯酸模塑密封粘合剂层的问题,例如留在PCB上的粘合剂残留物 通过形成改进的丙烯酸脱模粘合剂层,在几种密封材料(EMC)上发生表面和痕迹。 形成改进的丙烯酸脱模粘合剂层防止PCB表面上的粘合剂残留物提高工艺失效率并且解决由几种EMC发生的表面上的痕迹的问题,从而允许使用粘合剂组合物的胶带可应用 用于MUF工艺中使用的几种密封材料。 本发明具有这样的优点。 版权所有(C)2013,JPO&INPIT

    Polyester film for protecting polarizer
    30.
    发明专利
    Polyester film for protecting polarizer 审中-公开
    用于保护偏光片的聚酯膜

    公开(公告)号:JP2012133317A

    公开(公告)日:2012-07-12

    申请号:JP2011187785

    申请日:2011-08-30

    Abstract: PROBLEM TO BE SOLVED: To provide a polyester film for protecting a polarizer, which is excellent in transparency and antistatic property and also excellent in tape release and antifouling performance, by carrying out an accurate inspection of a polarizer by cross-Nicol method.SOLUTION: A polyester film for protecting a polarizer is characterized by comprising a polyester base film and an antistatic layer coated with an antistatic coating liquid containing a conductive polymer resin, a polyurethane resin, a crosslinking agent and a fluorine resin on at least one surface of the polyester base film, where the antistatic coating liquid desirably contains 100 to 1000 pts.wt. of the polyurethane resin, 100 to 2000 pts.wt. of the crosslinking agent and 30 to 300 pts.wt. of the fluorine resin based on 100 pts.wt. of the conductive polymer resin.

    Abstract translation: 解决的问题:为了提供透明性和抗静电性优异的防偏振片聚酯膜,并且通过用尼科尼克方法对偏振片进行精确的检查,还具有优异的带剥离和防污性能 。 < P>解决方案:一种用于保护偏振片的聚酯膜的特征在于,至少包括聚酯基膜和涂覆有抗静电涂布液的抗静电涂层,所述抗静电涂层液体至少包含导电聚合物树脂,聚氨酯树脂,交联剂和氟树脂 聚酯基膜的一个表面,其中抗静电涂布液体希望含有100至1000重量份。 的聚氨酯树脂,100〜2000重量份 的交联剂和30〜300重量份 的氟树脂基于100重量份 的导电性聚合物树脂。 版权所有(C)2012,JPO&INPIT

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