Abstract:
PROBLEM TO BE SOLVED: To provide a light guide plate for a surface light source device not only with high front-surface brightness but also with excellent uniformity of brightness, and further, capable of restraining a moire phenomenon.SOLUTION: In the light guide plate for a surface light source device including an incident surface with light incident from lamps arranged along a predetermined axis, an emission surface emitting the incident light and a rear surface facing the emission surface, a plurality of unit cells each with a microprism pattern carved on the rear surface are dispersedly arranged, wherein a crossing angle of a prism arrangement axis formed by an edge line direction of the microprism pattern and an arrangement axis of the lamps makes up an alternate angle. Furthermore, the light guide plate for a surface light source device has not only high front-surface brightness but also has excellent uniformity of brightness, and that, no moire phenomena is caused. When this is used for a backlight unit, use of an optical sheet laminated on the light guide plate can be reduced, thinning and simplification of manufacturing processes of a liquid crystal display module can be achieved, and also manufacturing cost can be reduced.
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition improved in electric reliability at high voltage, and an adhesive tape for semiconductor packaging using the same.SOLUTION: The adhesive composition of the present invention contains an epoxy hardener optimal for heightening fracture toughness of a hardened network by heightening a crosslink density in an epoxy resin base material, so that electric reliability is secured at a high voltage of not less than 30 V, and entanglement between molecules in the hardened network is strong to satisfy excellent adhesive strength at a high temperature of not less than 200°C. Thus, the adhesive composition, according to the present invention, is useful for an adhesive tape useful for a semiconductor-packaging field accompanying a high temperature process of not less than 200°C such as wire bonding and soldering, and can be usefully applied to a field such as elevator industry and semiconductor packaging for automobiles where high voltage is impressed.
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition for a masking tape of a molded underfill process and to provide a masking tape using the adhesive composition.SOLUTION: According to the invention, an adhesive composition for a masking tape of a molded underfill process and the masking tape using the adhesive composition solve the problems of an existing acryl mold resealing adhesive layer, such as adhesive residue remaining on a PCB surface and marks on the surface occurring with several kinds of sealing materials (EMC), by forming an improved acryl mold releasing adhesive layer. Forming the improved acryl mold releasing adhesive layer prevents the adhesive residue on the PCB surface to improve the process failure rate and solves the problem of marks on the surface which occur with several kinds of EMC thereby allowing the masking tape using the adhesive composition to be applicable to several kinds of sealing materials used in MUF process. The invention makes such advantages.
Abstract:
PROBLEM TO BE SOLVED: To provide a polyester film for protecting a polarizer, which is excellent in transparency and antistatic property and also excellent in tape release and antifouling performance, by carrying out an accurate inspection of a polarizer by cross-Nicol method.SOLUTION: A polyester film for protecting a polarizer is characterized by comprising a polyester base film and an antistatic layer coated with an antistatic coating liquid containing a conductive polymer resin, a polyurethane resin, a crosslinking agent and a fluorine resin on at least one surface of the polyester base film, where the antistatic coating liquid desirably contains 100 to 1000 pts.wt. of the polyurethane resin, 100 to 2000 pts.wt. of the crosslinking agent and 30 to 300 pts.wt. of the fluorine resin based on 100 pts.wt. of the conductive polymer resin.