公开(公告)号：US10477679B2

公开(公告)日：2019-11-12

申请号：US15864301

申请日：2018-01-08

Applicant: Toppan Forms Co., Ltd.

Inventor： Kumi Hirose ,  Takuya Sekiguchi ,  Nariaki Nawa

IPC: H05K1/09 ,  G06F3/044 ,  H05K1/02 ,  H05K3/12 ,  G06F3/041

Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

公开(公告)号：US10303994B2

公开(公告)日：2019-05-28

申请号：US15519029

申请日：2015-10-28

Applicant: Toppan Forms Co., Ltd.

Inventor： Norihiro Ooishi ,  Hitoshi Kagaya ,  Yoshihiro Mizunuma

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q7/00 ,  H01Q1/38

Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.

公开(公告)号：US10074818B2

公开(公告)日：2018-09-11

申请号：US14906000

申请日：2014-07-09

Applicant: Toppan Forms Co., Ltd. ,  Osaka University ,  The University of Tokyo

Inventor： Takafumi Matsumoto ,  Junichi Takeya

IPC: H01L51/05 ,  H01L51/00 ,  H01L51/10

CPC classification number: H01L51/055 ,  H01L51/0091 ,  H01L51/0545 ,  H01L51/105

Abstract: The transistor includes a gate electrode, an insulating layer, a semiconductor layer, a source electrode, and a drain electrode on a substrate, in which the gate electrode is formed by using silver β-ketocarboxylate denoted by General Formula (1) described below.

公开(公告)号：US10040960B2

公开(公告)日：2018-08-07

申请号：US14431092

申请日：2013-09-27

Applicant: Toppan Forms Co., LTD.

Inventor： Takuya Sekiguchi ,  Keiko Omata

IPC: C09D11/52 ,  H05K1/09

Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition. Such a silver ink composition is characterized by being obtained by blending: a silver carboxylate having a group represented by a formula “—COOAg”; one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the above amine compounds or ammonia with an acid; and one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below (in the formula, R21 represents an alkyl group, alkoxy group or N,N-dialkylamino group of not more than 20 carbon atoms, a hydroxyl group or an amino group): or obtained by preparing a second mixture by supplying carbon dioxide to a first mixture formed by mixing a silver carboxylate having a group represented by a formula “—COOAg” and one or more nitrogen-containing compounds selected from the group consisting of amine compounds and quaternary ammonium salts of not more than 25 carbon atoms, ammonia, and ammonium salts obtained by reacting the amine compounds or ammonia with an acid; and further mixing one or more reducing compounds selected from the group consisting of oxalic acid, hydrazine and compounds represented by a general formula (5) shown below to the mixture: H—C(═O)—R21 (5).

公开(公告)号：US20160155969A1

公开(公告)日：2016-06-02

申请号：US14906000

申请日：2014-07-09

Applicant: TOPPAN FORMS CO., LTD. ,  OSAKA UNIVERSITY ,  THE UNIVERSITY OF TOKYO

Inventor： Takafumi Matsumoto ,  Junichi Takeya

IPC: H01L51/05 ,  H01L51/00 ,  H01L51/10

CPC classification number: H01L51/055 ,  H01L51/0091 ,  H01L51/0545 ,  H01L51/105

Abstract: The transistor includes a gate electrode, an insulating layer, a semiconductor layer, a source electrode, and a drain electrode on a substrate, in which the gate electrode is formed by using silver β-ketocarboxylate denoted by General Formula (1) described below.

Abstract translation: 晶体管包括在基板上的栅电极，绝缘层，半导体层，源电极和漏电极，其中通过使用由下述通式（1）表示的银 - 酮 - 羧酸盐形成栅电极 。

公开(公告)号：TW201727541A

公开(公告)日：2017-08-01

申请号：TW106102341

申请日：2017-01-23

Applicant: 富士軟片股份有限公司 ,  FUJIFILM CORPORATION ,  凸版福姆斯股份有限公司 ,  TOPPAN FORMS CO., LTD. ,  國立大學法人東京大學 ,  THE UNIVERSITY OF TOKYO

Inventor： 宇佐美由久 ,  USAMI, YOSHIHISA ,  横山嵩祥 ,  YOKOYAMA, TAKAYOSHI ,  大鷲祐貴 ,  OWASHI, YUKI ,  松井弘之 ,  MATSUI, HIROYUKI ,  竹谷純一 ,  TAKEYA, JUNICHI

IPC: G06K17/00 ,  G06K19/06

CPC classification number: G06K7/10 ,  G06K19/07 ,  H04B1/59

Abstract: 資訊收集系統具有多個無線標籤及讀取裝置。各無線標籤記憶識別資訊，且包括：感測器；天線，接收來自讀取裝置的載波；以及資料傳送部，在利用天線接收到載波後，將包含識別資訊與由感測器獲得的資訊的測定資料發送至讀取裝置。多個無線標籤從資料傳送部以各不相同的固有週期發送識別資訊與由感測器獲得的資訊。讀取裝置對各無線標籤傳送載波，並接收來自各無線標籤的資料，而獲得資料。

Abstract in simplified Chinese: 信息收集系统具有多个无线标签及读取设备。各无线标签记忆识别信息，且包括：传感器；天线，接收来自读取设备的载波；以及数据发送部，在利用天线接收到载波后，将包含识别信息与由传感器获得的信息的测定数据发送至读取设备。多个无线标签从数据发送部以各不相同的固有周期发送识别信息与由传感器获得的信息。读取设备对各无线标签发送载波，并接收来自各无线标签的数据，而获得数据。

公开(公告)号：TW201720720A

公开(公告)日：2017-06-16

申请号：TW105126305

申请日：2016-08-18

Applicant: 凸版福姆斯股份有限公司 ,  TOPPAN FORMS CO., LTD.

Inventor： 青野弘嗣 ,  AONO, HIROSHI

IPC: B65D6/10 ,  B65D81/38

CPC classification number: B65D81/38 ,  F25D3/00

Abstract: 本發明之保冷箱1，具有：外裝箱10，以頂面可自由開閉之方式構成；內裝箱20，收容在外裝箱10；以及內盒30，收容在內裝箱20。內裝箱20藉由彼此獨立之絕熱板21a~21d、22而分別構成複數個側面及底面，且在複數個側面及底面各自的邊界，將二個絕熱板中之一絕熱板的端面抵接於另一絕熱板而成為箱體。內盒30由非透氣性構件形成，具有沿著內裝箱20的複數個側面及底面之形狀，且相向於前述邊界之邊部係由彎折非透氣性構件而構成。

Abstract in simplified Chinese: 本发明之保冷箱1，具有：外装箱10，以顶面可自由开闭之方式构成；内装箱20，收容在外装箱10；以及内盒30，收容在内装箱20。内装箱20借由彼此独立之绝热板21a~21d、22而分别构成复数个侧面及底面，且在复数个侧面及底面各自的边界，将二个绝热板中之一绝热板的端面抵接于另一绝热板而成为箱体。内盒30由非透气性构件形成，具有沿着内装箱20的复数个侧面及底面之形状，且相向于前述边界之边部系由弯折非透气性构件而构成。

公开(公告)号：TWI567001B

公开(公告)日：2017-01-21

申请号：TW102147777

申请日：2013-12-23

Applicant: 凸版福姆斯股份有限公司 ,  TOPPAN FORMS CO., LTD.

Inventor： 田中康弘 ,  TANAKA, YASUHIRO ,  森田翔 ,  MORITA, SHO

IPC: B65D81/18 ,  F25D3/00

CPC classification number: B65D81/18 ,  B65D81/3813 ,  B65D81/3825 ,  F25D3/08 ,  F25D2303/08221 ,  F25D2303/0843 ,  F25D2331/804

公开(公告)号：TWI312319B

公开(公告)日：2009-07-21

申请号：TW093125781

申请日：2004-08-27

Applicant: 凸版福姆斯股份有限公司 TOPPAN FORMS CO., LTD.

Inventor： 伊勢谷之彥 ISETANI, YUKIHIKO ,  岡田貴章 OKADA, TAKAAKI ,  清水秀郎 SHIMIZU, HIDEO ,  井手義章 IDE, YOSHIAKI ,  福田泰弘 FUKUDA, YASUHIRO ,  山上剛 YAMAGAMI, TAKESHI ,  花澤文浩 HANAZAWA, FUMIHIRO ,  山崎晃 YAMAZAKI, AKIRA

IPC: B42D ,  G10K

CPC classification number: H01M2/10 ,  B42D15/022 ,  H01M6/40

Abstract: 一種能夠記錄/重現聲頻資訊的片狀聲頻資訊記錄/重現裝置,僅在其局部區域之中被二支撐片從正面及背面包夾在中間,且此二支撐片係進一步被二表面片包夾在中間,而該等支撐片與該等表面片係接合在一起。

Abstract in simplified Chinese: 一种能够记录/重现声频信息的片状声频信息记录/重现设备,仅在其局部区域之中被二支撑片从正面及背面包夹在中间,且此二支撑片系进一步被二表面片包夹在中间,而该等支撑片与该等表面片系接合在一起。

公开(公告)号：TWI285214B

公开(公告)日：2007-08-11

申请号：TW092107032

申请日：2003-03-27

Applicant: 凸版福姆斯股份有限公司 TOPPAN FORMS CO., LTD.

Inventor： 平澤朗 HIRASAWA, AKIRA

IPC: C09J

CPC classification number: C09J107/00 ,  C09J4/00 ,  C09J4/06 ,  C09J7/38 ,  C09J7/381 ,  C09J11/08 ,  C08F253/00

Abstract: 一種將天然橡膠系微粒子均勻分散於放射線硬化性化合物中的黏接劑組成物，藉由利用放射線將之硬化而於基材上製作感壓黏接劑層，具有足夠之黏接力，能夠充分填充各種之填充劑，塗布後之乾燥時間短，容易進行任意之整面塗布或圖案塗布，能夠塗布於各種之基材，便能夠實現基材與感壓黏接劑層之足夠的黏接強度。此黏接劑組成物係混合含有天然橡膠系微粒子30的水溶性乳液31與放射線硬化性化合物32，一面攪拌混合物並一面昇溫，使水溶性乳液之水予以氣化而被去除，將分散天然橡膠系微粒子的媒介，由水置換成放射線硬化性化合物而能夠予以製作。

Abstract in simplified Chinese: 一种将天然橡胶系微粒子均匀分散于放射线硬化性化合物中的黏接剂组成物，借由利用放射线将之硬化而于基材上制作感压黏接剂层，具有足够之黏接力，能够充分填充各种之填充剂，涂布后之干燥时间短，容易进行任意之整面涂布或图案涂布，能够涂布于各种之基材，便能够实现基材与感压黏接剂层之足够的黏接强度。此黏接剂组成物系混合含有天然橡胶系微粒子30的水溶性乳液31与放射线硬化性化合物32，一面搅拌混合物并一面升温，使水溶性乳液之水予以气化而被去除，将分散天然橡胶系微粒子的媒介，由水置换成放射线硬化性化合物而能够予以制作。