公开(公告)号：KR1020120073818A

公开(公告)日：2012-07-05

申请号：KR1020100135698

申请日：2010-12-27

Applicant: 제일모직주식회사

Inventor： 박정은 ,  하두한

IPC: C08L69/00 ,  C08L67/03 ,  C08L83/10 ,  C08L51/04

CPC classification number: C08L67/02 ,  C08L69/00 ,  C08L51/04 ,  C08L83/10 ,  C08L55/02

Abstract: PURPOSE: A polycarbonate resin composition and a molded product using the same are provided to be used for molded products such as various kinds electronic components, auto parts, and general merchandise. CONSTITUTION: A polycarbonate resin composition comprises polycarbonate resin, PBT(polybutylene terephthalate) resin, polycarbonate-polysiloxane copolymers, and graft-copolymer including acryl-based compound. 8-25 parts by weight of the graft-copolymer are included based on 100.0 parts by weight of total weight of polycarbonate resin, PBT(polybutylene terephthalate) resin, and polycarbonate-polysiloxane copolymers. The polycarbonate-polysiloxane copolymer comprises 1-99 weight% of polycarbonate block and 1-99 weight% of polysiloxane block.

Abstract translation: 目的：提供聚碳酸酯树脂组合物和使用其的成型体，用于各种电子部件，汽车部件和一般商品等成型品。 构成：聚碳酸酯树脂组合物包含聚碳酸酯树脂，PBT（聚对苯二甲酸丁二醇酯）树脂，聚碳酸酯 - 聚硅氧烷共聚物和包含丙烯酸类化合物的接枝共聚物。 基于100.0重量份的聚碳酸酯树脂，PBT（聚对苯二甲酸丁二醇酯）树脂和聚碳酸酯 - 聚硅氧烷共聚物的总重量，包括8-25重量份的接枝共聚物。 聚碳酸酯 - 聚硅氧烷共聚物包含1-99重量％的聚碳酸酯嵌段和1-99重量％的聚硅氧烷嵌段。

公开(公告)号：KR1020100072804A

公开(公告)日：2010-07-01

申请号：KR1020080131317

申请日：2008-12-22

Applicant: 제일모직주식회사

Inventor： 장영석 ,  김방덕 ,  이완희 ,  박정은

IPC: C08L67/03 ,  C08L67/00 ,  C08L69/00 ,  C08L51/04

Abstract: PURPOSE: A thermoplastic resin composition is provided to have a secured matter property including flexural modulus and to apply the composition for a molded product, including cellular phones or electronics. CONSTITUTION: A thermoplastic resin composition contains the following: 100 parts of base resin by weight containing 20~90wt% of polyester resin and 20~80wt% of polycarbonate resin; and 3~25 parts of reinforcing agent by weight containing glycidyl methacrylate. The polyester resin is selected from the group consisting of a polyethylene terephthalate resin, a polytrimethylene terephthalate resin, a polybutylene terephthalate resin, a polyhexamethylene terephthalate resin, a polycyclohexane dimethylene terephthalate resin, or their combination.

Abstract translation: 目的：提供热塑性树脂组合物以具有包括挠曲模量的固体物质性质并且应用包括蜂窝电话或电子设备在内的模制产品的组合物。 构成：热塑性树脂组合物含有：100重量份的含有20〜90重量％的聚酯树脂的基础树脂和20〜80重量％的聚碳酸酯树脂; 和3〜25份含有缩水甘油基甲基丙烯酸酯的增强剂。 聚酯树脂选自聚对苯二甲酸乙二醇酯树脂，聚对苯二甲酸丙二醇酯树脂，聚对苯二甲酸丁二醇酯树脂，聚对苯二甲酸己二醇酯树脂，聚环己烷二甲撑对苯二甲酸酯树脂或它们的组合。

公开(公告)号：KR1020100023654A

公开(公告)日：2010-03-04

申请号：KR1020080082537

申请日：2008-08-22

Applicant: 제일모직주식회사

Inventor： 박정은 ,  윤종태

IPC: C08L53/02 ,  C08L35/04

Abstract: PURPOSE: A styrenic resin composition is provided to ensure excellent paintability and impact resistance, to be broadly applied in the molding of various products, especially materials for motorcycle requiring relatively little demands of heat resistance. CONSTITUTION: A styrenic resin composition comprises (A) 20-40 weight% of styrenic graft resin graft-polymerized with a rubber polymer of which average particle size is 0.25-0.4 micron; and (B) 60-80 weight% of vinyl cyanide compound-aromatic vinyl compound copolymer which has 60,000-100,000 of average molecular weight and contains 30-45 weight% of vinyl cyanide compound. The styrenic graft resin is prepared by performing emulsion graft polymerization of a vinyl cyanide compound and an aromatic vinyl compound in the presence of a rubbery polymer.

Abstract translation: 目的：提供苯乙烯树脂组合物以确保优异的可涂覆性和耐冲击性，广泛用于各种产品的成型，特别是对于耐热性要求相对较低的摩托车材料。 构成：苯乙烯树脂组合物包含（A）20-40重量％的与平均粒径为0.25-0.4微米的橡胶聚合物接枝聚合的苯乙烯接枝树脂; 和（B）60-80重量％的乙烯基氰化合物 - 芳族乙烯基化合物共聚物，其具有60,000-100,000的平均分子量，并且含有30-45重量％的乙烯基氰化合物。 苯乙烯接枝树脂通过在橡胶状聚合物的存在下进行乙烯基氰化合物和芳族乙烯基化合物的乳液接枝聚合来制备。