公开(公告)号：KR1020030071418A

公开(公告)日：2003-09-03

申请号：KR1020020011105

申请日：2002-02-28

Applicant: 한국교통대학교산학협력단 ,  (주)세원하드페이싱

Inventor： 어순철 ,  김일호 ,  이영근 ,  이정일

IPC: H01L23/36

Abstract: PURPOSE: A method of producing heat sink package by rotating jig type plasma thermal spray is provided to efficiently and economically fabricate a heat sink substrate adaptable to an IC package of a hermetic 4 sided seal type by performing a plasma spraying process using alumina powder. CONSTITUTION: Oxygen free high-conductive copper(OFHC) as a raw material and coating powder are prepared. A grit blasting(G/B) process is performed. The surface of copper is plated. A black oxide process is carried out. A spraying process is performed.

Abstract translation: 目的：提供通过旋转夹具式等离子体热喷涂制造散热器封装的方法，以通过使用氧化铝粉末进行等离子体喷涂工艺来有效且经济地制造适用于密封型四面密封型IC封装的散热片基板。 构成：制备作为原料的无氧高导电铜（OFHC）和涂料粉末。 进行喷砂（G / B）处理。 镀铜表面。 进行黑色氧化物处理。 进行喷雾处理。