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公开(公告)号：KR1020110069288A
公开(公告)日：2011-06-23
申请号：KR1020090125961
申请日：2009-12-17
Applicant: 한국전자통신연구원
IPC: H01L21/306
CPC classification number: H01L21/76802 , H01L21/7621
Abstract: PURPOSE: A method for forming a through silicon via is provided to prevent the performance deterioration of a device after a final packaging process by obtaining a uniform step coverage when a dielectric layer, a diffusion preventing layer, and a seed layer are deposited. CONSTITUTION: A via is formed on a silicon substrate by etching the silicon substrate(10). A part of a scallop on the sidewall of the via is removed(20). The surface of the scallop is oxidized(30). The scallop is removed by etching an oxide layer formed on the surface of the scallop(40).
Abstract translation: 目的：提供一种用于形成贯通硅通孔的方法，以防止在最终封装过程中器件的性能恶化，通过在沉积介电层，扩散防止层和籽晶层时获得均匀的台阶覆盖。 构成：通过蚀刻硅衬底（10）在硅衬底上形成通孔。 通孔的侧壁上的扇贝的一部分被去除（20）。 扇贝的表面被氧化（30）。 通过蚀刻形成在扇贝（40）的表面上的氧化物层来除去扇贝。
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公开(公告)号：KR101830600B1
公开(公告)日：2018-02-21
申请号：KR1020110103495
申请日：2011-10-11
Applicant: 한국전자통신연구원
IPC: G02F1/1335 , G02F1/13357
Abstract: 광손실이큰 컬러필터를사용하지않고컬러영상을구현함으로써광효율을향상시키고고휘도의영상을얻을수 있는백라이트유닛및 이를포함하는액정표시장치를제안한다. 본발명에의한백라이트유닛은, 백색광을발생시키는백색광원, 상기백색광이입사되는도광판, 상기도광판상부에형성되며, 상기백색광을투과시키는청색형광시트및 상기청색형광시트상부의동일평면에형성되며, 상기청색형광시트를투과한광을다시투과시키는다수의적색형광층, 녹색형광층및 투명층을포함하는다색형광시트를포함한다.
Abstract translation: 本发明提供一种不使用光损失大的彩色滤光片而实现彩色图像，从而提高发光效率，并且获得高亮度图像的背光单元以及具备该背光单元的液晶显示装置。 根据本发明的背光单元包括用于产生白光的白光源，用于接收白光的导光板，形成在导光板上用于透射白光的蓝色荧光片， 以及多色荧光片，其包括多个红色荧光层，绿色荧光层和用于再次透射透过蓝色荧光片的光的透明层。
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23.发明授权
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Patent Agency Ranking
公开(公告)号：KR101386241B1
公开(公告)日：2014-04-17
申请号：KR1020100096841
申请日：2010-10-05
Applicant: 한국전자통신연구원
Abstract: 본 발명은 무기발광소자 및 그 제조방법에 관한 것으로, 무기발광소자에 있어서, 기 설정된 간격을 갖도록 주기적으로 배치된 구조를 갖는 패턴된 금속전극; 및 상기 패턴된 금속전극의 상부에 위치하는 형광층을 포함하며, 상기 패턴된 금속전극이 배치된 순서에 따라 양극과 음극이 교대로 인가됨에 따라 상기 형광층에서 발광한 빛이 상기 패턴된 금속전극의 사이로 방출되는 것을 특징으로 한다.
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公开(公告)号：KR1020130067907A
公开(公告)日：2013-06-25
申请号：KR1020110134949
申请日：2011-12-14
Applicant: 한국전자통신연구원
CPC classification number: H02J50/00 , H04B5/0037 , Y02D70/00
Abstract: PURPOSE: An active wireless power apparatus which has an energy harvest function and a method thereof are provided to supply power to reduce power consumption of a wireless communication device, to enable the wireless communication device to be operated mainly in a power down mode state, and to supply power to the wireless communication device when communications are required. CONSTITUTION: An active wireless power apparatus includes a gathering unit(21) which receives a radio signal of light or frequency which is transmitted from the outside, and a power generation unit(22) which processes a signal which is outputted through the gathering unit, and outputs a fixed level of a voltage signal. A wireless communication device, which is in a power down mode, is woken up and operated in an operation mode according to the voltage signal. [Reference numerals] (12) Matching unit; (13) RF signal processing unit; (14) Battery; (21) Gathering unit; (22) Power generation unit; (23) Switch unit; (3) Reader; (AA) Frequency & Light
Abstract translation: 目的：提供具有能量收集功能的有源无线电力装置及其方法，以提供功率以减少无线通信装置的功耗，使得无线通信装置主要以断电模式状态运行，以及 当需要通信时向无线通信设备供电。 构成：有源无线电力装置包括：接收从外部发送的光或频率的无线电信号的收集单元（21），以及处理通过收集单元输出的信号的发电单元（22） 并输出电压信号的固定电平。 处于断电模式的无线通信装置根据电压信号被唤醒并在操作模式下操作。 （附图标记）（12）匹配单元; （13）射频信号处理单元; （14）电池; （21）收集单位; （22）发电机组; （23）开关单元; （3）读者; （AA）频率与光
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公开(公告)号：KR101215304B1
公开(公告)日：2012-12-26
申请号：KR1020090105358
申请日：2009-11-03
Applicant: 한국전자통신연구원
IPC: H01L21/027
CPC classification number: G03F7/0002 , B82Y10/00 , B82Y40/00
Abstract: 나노임프린트리소그라피공정용템플릿의제조방법이제공된다. 이방법은기판상에그 상부표면으로부터기판의표면으로내리막경사의적어도하나의측면을갖는양각제 1 증착막패턴을형성하는단계, 양각제 1 증착막패턴의내리막경사의적어도하나의측면을덮되, 양각제 1 증착막패턴의측면상부에서측면하부로갈수록폭이줄어드는형태를갖는제 2 증착막패턴을형성하는단계, 제 2 증착막패턴이형성된결과물의전면상에제 3 증착막을형성하는단계, 양각제 1 증착막패턴및 제 2 증착막패턴의상부표면들이동시에노출되도록제 3 증착막을평탄화하여, 양각제 1 증착막패턴과평탄화된제 3 증착막사이에개재된제 2 증착막나노패턴을형성하는단계, 평탄화된제 3 증착막을선택적으로식각하여음각마이크로패턴을형성하는단계, 및양각제 1 증착막패턴과평탄화된제 3 증착막사이에개재된제 2 증착막나노패턴을제거하여, 양각제 1 증착막패턴및 평탄화된제 3 증착막의상부표면들로부터기판의표면으로내리막경사의측면들에의해구성되는음각나노패턴을형성하는단계를포함한다.
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公开(公告)号：KR1020120074495A
公开(公告)日：2012-07-06
申请号：KR1020100136352
申请日：2010-12-28
Applicant: 한국전자통신연구원
IPC: G06K19/07
CPC classification number: G06K19/07345
Abstract: PURPOSE: An RFID(Radio Frequency ID) tag equipped with a physical switch is provided to increase recognition ratio of an RFID tag by supplying a physical switch. CONSTITUTION: An antenna receives an RF signal from a reader. An AFE(Analog Front End)(110) generates voltage by using the RF signal. The switch is inserted between the antenna and the AFE and controls connection between the antenna and the AFE through switching operation. The switch includes first and third switches, a control module(120), and a rechargeable battery(140).
Abstract translation: 目的：提供配有物理开关的RFID（射频识别）标签，通过提供物理开关提高RFID标签的识别率。 构成：天线从读取器接收RF信号。 AFE（模拟前端）（110）通过使用RF信号产生电压。 开关插在天线和AFE之间，通过切换操作控制天线与AFE之间的连接。 开关包括第一和第三开关，控制模块（120）和可再充电电池（140）。
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公开(公告)号：KR1020110046141A
公开(公告)日：2011-05-04
申请号：KR1020090102999
申请日：2009-10-28
Applicant: 한국전자통신연구원
IPC: H01L21/288 , H01L21/60 , H01L23/48 , H01L23/12
CPC classification number: H01L21/76898 , H01L23/3128 , H01L24/03 , H01L24/05 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/05599 , H01L2224/13025 , H01L2224/16147 , H01L2224/16237 , H01L2224/81141 , H01L2224/81191 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2224/05552 , H01L2924/00
Abstract: PURPOSE: A method for forming a via and a method for manufacturing a stack chip package using the same are provided to supply a solution with metal particles to a via hole to process a substrate at a lower temperature, thereby quickly and simply forming a via. CONSTITUTION: A via hole(103) is formed in a substrate(102). The substrate is dipped in a first solution(30) so that the via hole is filled with the first solution. A second solution(32) with a metal particle is provided to the first solution so that the metal particle is sunken in the via hole. The substrate with the via hole is processed by heat. A via is formed in the via hole.
Abstract translation: 目的：提供一种用于形成通孔的方法和使用该方法制造堆叠芯片封装的方法，以将金属颗粒的溶液提供给通孔，以在较低温度下处理基板，从而快速且简单地形成通孔。 构成：在基板（102）中形成通孔（103）。 将衬底浸入第一溶液（30）中，使得通孔填充第一溶液。 向第一溶液提供具有金属颗粒的第二溶液（32），使得金属颗粒在通孔中下沉。 具有通孔的基板通过加热处理。 在通孔中形成通孔。
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