-
公开(公告)号：KR100436778B1
公开(公告)日：2004-06-23
申请号：KR1020020061546
申请日：2002-10-09
Applicant: 한국전자통신연구원
IPC: G02B6/12
Abstract: PURPOSE: An optical module and a fabricating method thereof are provided to enhance a sealing characteristic and perform a passive alignment process by fabricating independently a lower sub module and an upper sub module and injecting a bonding agent into each groove to combine the lower sub module with the upper sub module. CONSTITUTION: An optical module includes a lower sub module(100) and an upper sub module(200). The lower sub module(100) includes a bottom substrate(110) and an optical active element(120). The optical active element(120) is installed at one side of the bottom substrate(110). The upper sub module(200) includes a top substrate(210) and an optical waveguide(230). The optical waveguide(230) is installed on a center part of the top substrate(210). An optical fiber(140) is located at one side of the top substrate or one side of the bottom substrate. The lower sub module(100) corresponds to the upper sub module(200).
Abstract translation: 目的：提供一种光学模块及其制造方法，以增强密封特性并且通过独立地制造下部子模块和上部子模块并且将粘合剂注入每个凹槽中以执行被动对准过程以将下部子模块与 上部子模块。 构成：一种光学模块包括下部子模块（100）和上部子模块（200）。 下部子模块（100）包括底部基板（110）和光学有源元件（120）。 光学有源元件（120）安装在底部基板（110）的一侧。 上部子模块（200）包括顶部基板（210）和光波导（230）。 光波导（230）安装在顶部基板（210）的中心部分。 光纤（140）位于顶部基板的一侧或底部基板的一侧。 下部子模块（100）对应于上部子模块（200）。
-
公开(公告)号：KR101835456B1
公开(公告)日：2018-03-09
申请号：KR1020100116815
申请日：2010-11-23
Applicant: 한국전자통신연구원
Abstract: 본발명의일 실시예에따른광섬유어레이블럭의제조방법은, 실리콘기판상에피식각될영역을노출시키는식각마스크패턴을형성하는단계; 노출된상기실리콘기판을건식식각하여트렌치를형성하는단계; 상기트렌치의바닥면에노출된상기실리콘기판을습식식각으로이방성식각하여복수개의브이홈(V-groove)들을형성하는단계; 상기브이홈들에광섬유들을안착시키는단계; 및상기안착된광섬유들에 UV 경화용에폭시를도포하고덮개판을올린후 UV를조사하여상기광섬유들을고정시키는단계를포함한다.
-
公开(公告)号：KR1020170099236A
公开(公告)日：2017-08-31
申请号：KR1020160021363
申请日：2016-02-23
Applicant: 한국전자통신연구원
Abstract: 본발명은시료케이블의벤딩품질및 광파이버성능을실시간파악할수 있는벤딩시험기에관한것으로, 모듈탑재공간또는보관함이마련된본체; 상기본체의내부에마련되어서, 벤딩시험에필요한회전력을발생시키는구동모듈조립체; 상기구동모듈조립체로부터전달받은정회전또는역회전방향의회전력에상응한벤딩하중을시료케이블에인가하는벤딩모듈; 상기시료케이블에분동의중량에대응한크기의중력하중을인가하는분동모듈; 상기시료케이블에광원의파워를입력한후 상기시료케이블로부터출력된광 신호를수신하는광원센서모듈; 및상기광원센서모듈의작동을제어하고, 수신된상기광 신호를컴퓨터분석가능하게정보로변환하는제어유니트를포함한다.
Abstract translation: 弯曲试验机技术领域本发明涉及一种能够实时地实现试样电缆的弯曲加工性和光纤性能的弯曲试验机，该弯曲试验机具有：具有模块安装空间的主体或收纳箱; 驱动模块组件，其设置在所述主体内并且产生弯曲测试所需的旋转力; 弯曲模块，用于将从所述驱动模块组件接收的与沿正向或反向旋转方向的旋转力对应的弯曲载荷施加到样本电缆; 重量模块，用于将与样品的重量对应的重力负荷施加到样品电缆; 一种光源传感器模块，用于将光源的功率输入到采样电缆并接收从采样电缆输出的光信号; 以及控制单元，用于控制光源传感器模块的操作并用于将接收到的光信号转换成计算机可分析的信息。
-
公开(公告)号：KR101546496B1
公开(公告)日：2015-08-25
申请号：KR1020100115480
申请日：2010-11-19
Applicant: 한국전자통신연구원
IPC: G02B6/125
Abstract: 본발명은분배효율및 생산성을극대화할수 있는대구경광분배기를개시한다. 그의광분배기는, 입력부와, 상기입력부에서분기되는제 1 및제 2 출력부들을포함하는코어와, 상기코어를둘러싸는클래딩과, 상기클래딩의상하를둘러싸는상부및 하부하우징들을포함한다. 상기제 1 및제 2 출력부들은상기입력부로부터 25도이하에서 0도이상까지의 V자모양으로사출된다.
-
公开(公告)号：KR101362728B1
公开(公告)日：2014-02-13
申请号：KR1020110079111
申请日：2011-08-09
Applicant: 한국전자통신연구원
Abstract: 본 발명은 칩을 기판 위에 고정하는 칩 고정 장치를 제공한다. 본 발명에 따른 칩 고정 장치는 칩 접합 장비와 결합하는 몸통부 및 일부는 몸통부에 고정되고, 다른 일부는 칩이 기판에 고정되도록 칩에 압력을 가하는 다리부를 포함한다.
-
Patent Agency Ranking
公开(公告)号：KR1020130016908A
公开(公告)日：2013-02-19
申请号：KR1020110079111
申请日：2011-08-09
Applicant: 한국전자통신연구원
CPC classification number: H01L24/75 , H01L21/67138
Abstract: PURPOSE: An apparatus for fixing a chip is provided to bond various devices on a substrate by using an Au/Sn process solder. CONSTITUTION: An apparatus for fixing a device(1000) includes a body(100) and legs(200a, 200b). The body is combined with an apparatus for boning a device. The legs are fixed to the body and compress the device. The upper part of the legs is connected to the body, and the lower part is in contact with the device. The apparatus for boning a device applies pressure to the device through the body and the legs. And then, the device is tightly fixed to a substrate even if other devices are bonded to the substrate.
Abstract translation: 目的：提供一种用于固定芯片的设备，通过使用Au / Sn工艺焊料将各种器件粘合在基板上。 构成：用于固定装置（1000）的装置包括主体（100）和支腿（200a，200b）。 身体与用于捣毁装置的装置组合。 腿固定在身体上并压缩装置。 腿的上部连接到主体，下部与装置接触。 用于捣固装置的装置通过身体和腿向装置施加压力。 然后，即使其他器件结合到衬底上，器件也紧密地固定到衬底上。
-
公开(公告)号：KR1020120055935A
公开(公告)日：2012-06-01
申请号：KR1020100117393
申请日：2010-11-24
Applicant: 한국전자통신연구원
IPC: G02B6/38
CPC classification number: G02B6/3849 , G02B6/381 , G02B6/3881
Abstract: PURPOSE: An optical connector which stores an optical ferrule protective cap is provided to prevent damage, malfunction, and loss of the ferrule protective cap. CONSTITUTION: An optical connector(10) comprises a connecting part(11), a ferrule(12), a guide protrusion(13), and a ferrule protective cap(14). The connecting part is installed by being extended from one end of an optical cable. The ferrule is attached to one end of the connecting part. One end of an optical cable is mounted in order to be optically connected with the optical connector at an opposite side thereof. The ferrule protective cap protects the ferrule from the external environment by covering the ferrule. The guide protrusion is attached on an external part of the connecting part and guides a connecting position and the connecting direction of the optical connectors of both sides while connecting the optical cables. The guide protrusion has the same shape as the ferrule for storing the ferrule protective cap.
Abstract translation: 目的：提供存储光学套圈保护盖的光学连接器，以防止套圈保护帽的损坏，故障和损失。 构成：光连接器（10）包括连接部分（11），套圈（12），引导突起（13）和套圈保护帽（14）。 连接部件通过从光缆的一端延伸而安装。 套圈连接到连接部件的一端。 安装光缆的一端，以在其相对侧与光连接器光学连接。 套圈保护帽通过覆盖套圈来保护套圈免受外部环境的影响。 引导突起安装在连接部分的外部，并在连接光缆的同时引导两侧光连接器的连接位置和连接方向。 引导突起具有与用于存储套圈保护盖的套圈相同的形状。
-
公开(公告)号：KR100524672B1
公开(公告)日：2005-11-01
申请号：KR1020030024634
申请日：2003-04-18
Applicant: 한국전자통신연구원
IPC: H01L21/60
CPC classification number: H01L2224/16 , H01L2924/00012
Abstract: 본 발명은 솔더범프가 저면에 구비된 반도체칩을 기판에 본딩하는 방법에 있어서, 상기 반도체칩 저면에 구비된 솔더범프와 대응하는 상기 기판 상에 포토레지스트 패턴을 형성하는 단계; 상기 기판 상에 형성된 포토레지스트 패턴을 따라 식각하여 본딩홈을 형성하는 단계; 상기 기판 상에 형성된 본딩홈에 금속다층막을 형성하는 단계; 상기 본딩홈에 상기 반도체칩의 솔더범프를 정렬시킨 상태에서 상기 솔더범프를 용융점 이상의 온도로 가열한 후 상기 반도체칩을 상기 본딩홈에 밀착시키는 단계; 및 상기 반도체칩을 상기 본딩홈에 밀착시킨 상태에서 가열된 솔더범프를 냉각시키는 것에 의해 상기 기판에 상기 반도체칩을 고정시키는 단계;의 플립칩 본딩방법을 개시하고, 상기 본딩방법을 이용하여 광섬유 또는 평면광도파로(PLC)와 LD칩을 고정밀 수동정렬하여 고효율 광결합의 광모듈을 제작할 수 있다.
Abstract translation: 目的：提供使用用于光学无源对准的倾斜槽的倒装焊接方法，以通过最小化半导体芯片和半导体芯片之后的衬底表面上的小的不对准来改善LD（激光二极管）芯片的结精度 光纤或平面光波导最初对齐。 构成：在与形成在半导体芯片的底表面上的焊料凸块（22）相对应的基板（30）上形成光致抗蚀剂图案。 沿着形成在基板上的光致抗蚀剂图案进行蚀刻处理，以形成接合槽（34）。 UBM（凸块下金属）（35）形成在接合槽中。 虽然半导体芯片中的焊料凸块与接合槽对准，但是将焊料凸点加热到低于熔点温度，并且半导体芯片紧密地附接到接合槽。 将加热的焊料凸块冷却以将半导体芯片固定到基板上。
-
公开(公告)号：KR1020040087058A
公开(公告)日：2004-10-13
申请号：KR1020030021298
申请日：2003-04-04
Applicant: 한국전자통신연구원
IPC: G02B6/42
Abstract: PURPOSE: A high-speed optical transmission module having a post-resistor is provided to reduce loss of signals and noise of signals by improving an impedance matching resistor. CONSTITUTION: A high-speed optical transmission module includes a driver IC, a matching circuit, a light emitting device, and an impedance matching resistor. The driver IC(60) is used for amplifying an RF input signal. The matching circuit(62) is connected to an output terminal of the driver IC. The light emitting device(64) is connected to the matching circuit. The impedance matching resistor(66) is connected to the light emitting device and a ground voltage source in order to compensate impedance. The impedance matching resistor is formed with a thin film resistor of 5 to 60 ohms or a chip resistor.
Abstract translation: 目的：提供具有后置电阻器的高速光传输模块，通过改进阻抗匹配电阻来减少信号的损耗和信号噪声。 构成：高速光传输模块包括驱动器IC，匹配电路，发光器件和阻抗匹配电阻器。 驱动器IC（60）用于放大RF输入信号。 匹配电路（62）连接到驱动器IC的输出端。 发光装置（64）连接到匹配电路。 阻抗匹配电阻器（66）连接到发光器件和接地电压源以补偿阻抗。 阻抗匹配电阻器由5至60欧姆的薄膜电阻器或片式电阻器形成。
-
公开(公告)号：KR1020040036409A
公开(公告)日：2004-04-30
申请号：KR1020020065429
申请日：2002-10-25
Applicant: 한국전자통신연구원
IPC: G02B6/42
Abstract: PURPOSE: An optical transmission module using a silicon optical bench is provided to perform an accurate monitoring by minimizing an optical path and to improve optical coupling efficiency between an optical fiber and an active device. CONSTITUTION: A projected part(12) is formed to convert an optical path, and a silicon optical bench(11) has an optical fiber alignment part(13). An optical fiber is embedded in the optical fiber alignment part. A light source(15) is installed on an upper part of the projected part. And a photo detector(16) is installed adjacently to the light source. Almost all of the light emitted from the light source is reflected from a surface of the projected part and then progresses along the optical fiber, and a part of the light is reflected from a groove(12c) formed on another plane of the projected part and then is incident on the photo detector.
Abstract translation: 目的：提供一种使用硅光学台的光传输模块，通过最小化光路并提高光纤与有源器件之间的光耦合效率来进行精确的监控。 构成：形成投射部（12）以转换光路，硅光学台（11）具有光纤对准部（13）。 光纤嵌入在光纤对准部中。 光源（15）安装在突出部分的上部。 并且光检测器（16）安装在光源附近。 从光源发出的几乎全部的光从突出部的表面反射，然后沿着光纤前进，并且一部分光从形成在突出部的另一平面上的凹槽（12c）反射，并且 然后入射到光电检测器上。
-
-
-
-
-
-
-
-
-
Search Results
37
records
(took 0.023 seconds)
