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21.发明公开비대칭 아닐린기를 말단에 도입한 컬러필터용 적색 퍼릴렌계 염료 화합물, 적색 잉크 및 컬러필터 无效用于红色彩色滤光片，红色墨水和彩色滤光片的终端位置中含有不对称苯胺基团的PERYLENE DYES
公开(公告)号：KR1020150115550A
公开(公告)日：2015-10-14
申请号：KR1020140040780
申请日：2014-04-04
Applicant: 서울대학교산학협력단
CPC classification number: C09B5/62 , G02B5/223 , G02F1/133509 , G03F7/0007 , G03F7/0045
Abstract: 본발명은하기화학식 1로표시되는퍼릴렌계화합물을포함하는퍼릴렌계염료화합물, 적색잉크및 컬러필터가제공된다. [화학식 1](상기화학식 1에서, R1 내지 R2는수소원자, 할로겐원자, 에테르기, 또는에스테르기이고, R3 내지 R4는수소원자, 또는 C1 내지 C5이고, R5 내지 R6는수소원자, 또는 C1 내지 C5이다.) 본발명은퍼릴렌단위를포함하는적색퍼릴렌계염료화합물, 그제조방법및 컬러필터에관한것으로, 더욱상세하게는, 퍼릴렌계염료화합물의말단에아닐린기를도입하여적색컬러필터에적합한흡수스펙트럼을가지며, 내열성및 용해도가우수한적색퍼릴렌계염료화합물, 그제조방법및 컬러필터에관한것이다.
Abstract translation: 本发明提供了包含由以下化学式1表示的苝系化合物，红色油墨和滤色器的苝系染料化合物。 在化学式1中，R 1〜R 2为氢原子，卤原子，醚基或酯基。 R_3至R_4是氢原子，或具有C1至C5。 R 5〜R 6为氢原子，或具有C 1〜C 5。 本发明涉及包含苝单元的红苝系染料化合物及其制造方法和滤色器，更具体地说，涉及具有适合于红色滤色片的吸收光谱的红色苝系染料化合物 通过将苯胺基施加到苝系染料化合物的末端，具有优异的耐热性和溶解性。
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Patent Agency Ranking
公开(公告)号：KR101885365B1
公开(公告)日：2018-08-06
申请号：KR1020170041588
申请日：2017-03-31
Applicant: 서울대학교산학협력단
CPC classification number: D06M15/21 , D03D15/00 , D03D23/00 , D06M2200/12 , D10B2401/021
Abstract: 본발명은비용매유도상분리법을이용한초소수성직물제조방법에있어서,(1) 비정질폴리프로필렌을사이클로헥세인(cyclohexane)용매에농도 30~40mg/ml로투입하고온도 75~80℃로 30~60분간처리하는단계; (2) 상기처리된용매를비용매인아세톤(acetone)과부피비 9:1~8:2로 2~4분간혼합하는단계; 및(3) 상기혼합된용매및 비용매용액을직물에 1~5 초간침지하고건조온도 25~35℃로 2~3시간동안처리하는단계로구성되는비용매유도상분리법을이용한초소수성직물제조방법에관한것이다.
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公开(公告)号：KR1020120073838A
公开(公告)日：2012-07-05
申请号：KR1020100135724
申请日：2010-12-27
Applicant: 주식회사 케이씨 , 서울대학교산학협력단
CPC classification number: C11D7/3245 , C11D7/3281 , C23G5/036
Abstract: PURPOSE: A cleaning solution for cleaning process after copper chemical mechanical polishing is provided to improve manufacture yield of semiconductor device and removal strength. CONSTITUTION: A cleaning solution for cleaning process after copper chemical mechanical polishing comprises ethylenediaminetetraacetate, 5-aminotetrazole, and a pH adjusting agent consisting of a basic compound. The concentration of the ethylenediaminetetraacetate is 0.006-0.3 M. The concentration of 5- aminotetrazole is 0.001-0.15 M. The basic compound is one or more selected from potassium hydroxide, tetramethylammonium hydroxide, and sodium hydroxide. The washing solution additionally includes one or more components selected from tetramethylammonium hydroxide, RE610, and alcohol ether sulfate.
Abstract translation: 目的：提供铜化学机械抛光后的清洗工艺清洗液，提高半导体器件的制造成本和去除强度。 构成：铜化学机械抛光后的清洗工艺的清洗液包括乙二胺四乙酸酯，5-氨基四唑和由碱性化合物组成的pH调节剂。 乙二胺四乙酸酯的浓度为0.006-0.3M。5-氨基四唑的浓度为0.001-0.15M。碱性化合物是选自氢氧化钾，四甲基氢氧化铵和氢氧化钠中的一种或多种。 洗涤液还包括一种或多种选自四甲基氢氧化铵，RE610和醇醚硫酸盐的组分。
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公开(公告)号：KR1020120117513A
公开(公告)日：2012-10-24
申请号：KR1020110035310
申请日：2011-04-15
Applicant: 주식회사 케이씨 , 서울대학교산학협력단
IPC: C09K3/14 , H01L21/304
Abstract: PURPOSE: A slurry composition is provided to have excellent dispersion stability and polishing ratio in chemical mechanical polishing process, especially in copper CMP, and to improve polishing rate, polishing selectivity ratio, etc. CONSTITUTION: A slurry composition comprises: abrasive selected from a group consisting of ceria, alumina, silica, titania and zirconia and of which solid content is 0.5-10 weight%; a complexing agent having a carboxy group and amino group at the same time, and a corrosion inhibitor comprising an azole group. The complexing agent comprises one or more selected from serine, arginine, glutamine, and salts thereof and has a pH of 6-8. The corrosion inhibitor comprises 5-aminotetrazole or benzotriazoles.
Abstract translation: 目的：提供一种浆料组合物，以在化学机械抛光工艺中，特别是在铜CMP中具有优异的分散稳定性和抛光比，并且提高抛光速率，抛光选择比等。构成：浆料组合物包含：选自组 由二氧化铈，氧化铝，二氧化硅，二氧化钛和氧化锆组成，固体含量为0.5-10重量％。 同时具有羧基和氨基的络合剂和包含唑类的缓蚀剂。 络合剂包含选自丝氨酸，精氨酸，谷氨酰胺及其盐中的一种或多种，pH为6-8。 腐蚀抑制剂包括5-氨基四唑或苯并三唑。
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