公开(公告)号：EP2280813B1

公开(公告)日：2017-06-07

申请号：EP09733653.1

申请日：2009-04-17

Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY ,  1366 Technologies Inc.

Inventor： POLITO, Benjamin, F. ,  GATES, Holly, G. ,  SACHS, Emanuel, M.

IPC: B29C59/02 ,  B82Y10/00 ,  G03F7/00

CPC classification number: H01L31/182 ,  B29C43/021 ,  B29C43/222 ,  B29C59/02 ,  B29C2043/025 ,  B29C2043/3634 ,  B29C2043/3652 ,  B29C2043/465 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L31/0236 ,  H01L31/02363 ,  Y02E10/50

公开(公告)号：EP2647032B1

公开(公告)日：2016-03-09

申请号：EP11845655.7

申请日：2011-12-01

Applicant: 1366 Technologies Inc.

Inventor： JONCZYK, Ralf ,  SACHS, Emanuel, M.

IPC: C30B19/02 ,  C30B11/00 ,  H01L21/02 ,  C30B29/06

CPC classification number: H01L31/182 ,  C04B41/4539 ,  C04B41/5096 ,  C30B11/002 ,  C30B15/00 ,  C30B15/007 ,  C30B15/32 ,  C30B29/06 ,  H01L21/02002 ,  H01L21/02532 ,  H01L31/1804 ,  Y02E10/546 ,  Y02P70/521

公开(公告)号：EP2647032A2

公开(公告)日：2013-10-09

申请号：EP11845655.7

申请日：2011-12-01

Applicant: 1366 Technologies Inc.

Inventor： JONCZYK, Ralf ,  SACHS, Emanuel, M.

IPC: H01L21/02 ,  C30B19/02

CPC classification number: H01L31/182 ,  C04B41/4539 ,  C04B41/5096 ,  C30B11/002 ,  C30B15/00 ,  C30B15/007 ,  C30B15/32 ,  C30B29/06 ,  H01L21/02002 ,  H01L21/02532 ,  H01L31/1804 ,  Y02E10/546 ,  Y02P70/521

Abstract: An interposer sheet can be used for making semiconductor bodies, such as of silicon, such as for solar cell use. It is free-standing, very thin, flexible, porous and able to withstand the chemical and thermal environment of molten semiconductor without degradation. It is typically of a ceramic material, such as silica, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbide, silicon carbonitride, silicon oxycarbonitride and others. It is provided between a forming surface of a mold sheet, and the molten material from which a semiconductor body will be formed. It may be secured to the forming surface or deposited upon the melt. The interposer sheet suppresses grain nucleation, and limits heat flow from the melt. It promotes separation of the semiconductor body from the forming surface. It can be fabricated before its use. Because free-standing and not adhered to the forming surface, problems of mismatch of CTE are minimized. The interposer sheet and semiconductor body are free to expand and contract relatively independently of the forming surface.

公开(公告)号：EP2386118A1

公开(公告)日：2011-11-16

申请号：EP10729457.1

申请日：2010-01-06

Applicant: 1366 Technologies Inc.

Inventor： SACHS, Emanuel, M. ,  WALLACE, Richard, L. ,  BREDT, James, F. ,  POLITO, Benjamin, F. ,  ERSEN, Ali

IPC: H01L31/00

CPC classification number: H01L31/022425 ,  H01L21/6715 ,  Y02E10/50

Abstract: Materials that contain liquid are deposited into grooves upon a surface of a work piece, such as a silicon wafer to form a solar cell. Liquid can be dispensed into work piece paths, such as grooves under pressure through a dispensing tube. The tube mechanically tracks in the groove. The tube may be small and rest at the groove bottom, with the sidewalls providing restraint. Or it may be larger and ride on the top edges of the groove. A tracking feature, such as a protrusion, Non-circular cross-sections, molded-on protrusions and lobes also enhance tracking. The tube may be forced against the groove by spring or magnetic loading. Alignment guides, such as lead-in features may guide the tube into the groove. Restoring features along the path may restore a wayward tube. Many tubes may be used. Many work pieces can be treated in a line or on a drum.